Base plate for aluminum heat sinks providing thermal interface and structural support
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Flatness | ≤0.05 mm | |
| Thickness | 3-10 mm | |
| Dimensions | Customizable to heat sink footprint | |
| Surface Roughness | Ra ≤ 1.6 μm | |
| Thermal Conductivity | ≥150 W/m·K | |
| Mounting Hole Pattern | Standardized (e.g., 4x M3) |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A custom-manufactured aluminum component designed to dissipate heat from electronic devices through conduction and convection.
Industrial-grade aluminum heat sink for efficient thermal management in demanding applications.
An aluminum extruded heat sink is a passive cooling component manufactured through aluminum extrusion processes.
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The base plate serves as the thermal interface between the heat source and the fins, spreading heat evenly across the heat sink structure to maximize dissipation efficiency.
Precise flatness ensures maximum surface contact with the heat source, minimizing air gaps that create thermal resistance and reduce cooling performance.
Yes, base plates are often custom-designed with specific thickness, material, hole patterns, and surface treatments to match thermal requirements and mechanical constraints.
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