Heat sink fins are extended surface components designed to dissipate heat from electronic or mechanical systems through convection and radiation.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Fin Height | 5-50 mm | |
| Fin Spacing | 1.5-10 mm | |
| Fin Thickness | 0.5-2.0 mm | |
| Base Thickness | 3-15 mm | |
| Surface Finish | Anodized, bare, or coated | |
| Thermal Conductivity | 150-400 W/m·K |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
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To increase surface area for more efficient heat dissipation from electronic or mechanical components.
Closer spacing increases surface area but may restrict airflow; taller fins enhance dissipation but require stronger base support. Optimal design balances these factors for specific airflow conditions.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.