High-Performance Computing Systems

Product Specifications

Technical details and manufacturing context for High-Performance Computing Systems

Definition

High-Performance Computing (HPC) systems are specialized computing architectures that aggregate processing power through parallel computing techniques to solve computationally intensive problems in science, engineering, and business. These systems typically consist of multiple processors, high-speed interconnects, large memory configurations, and specialized storage solutions working in concert to achieve superior performance metrics. HPC systems are used for tasks such as weather simulation, molecular modeling, financial risk analysis, and machine learning training. They are characterized by high peak and sustained performance, measured in FLOPS, and can contain thousands to hundreds of thousands of processing units. The systems are designed to handle large datasets and complex calculations that would be impractical on general-purpose computers. They often require specialized cooling and power infrastructure due to their high energy consumption. The directory lists typical parameters such as peak performance (1–10 FLOPS), sustained performance (0.5–5 FLOPS), processor count (1000–100000 units), memory capacity (10–500 TB), interconnect bandwidth (100–1000 GB/s), power consumption (100–1000 kW), operating temperature (10–35 °C, ISO 7779), storage capacity (1–50 PB), cooling method (air or liquid, liquid for >200 kW), footprint (10–200 m²), weight (5000–50000 kg), operating humidity (20–80% RH, ISO 7779), and input voltage (200–480 V AC, IEC 60038). These values are reference ranges and must be verified for the specific model and application. The systems are built using semiconductor materials, copper alloys, thermal interface materials, and printed circuit board substrates. For procurement, it is essential to confirm the exact specifications with the legal manufacturer or supplier, as actual performance and compliance may vary.

Working Principle

HPC systems operate on parallel computing principles where computational tasks are divided into smaller sub-tasks that can be processed simultaneously across multiple processing units. These systems utilize specialized architectures such as clusters, grids, or massively parallel processors (MPP) with high-bandwidth, low-latency interconnects to coordinate parallel execution. Workloads are managed through job schedulers and parallel programming models like MPI (Message Passing Interface) or OpenMP to distribute and synchronize computations across thousands of processing cores.

Common Materials

Semiconductor materials, Copper alloys, Thermal interface materials, Printed circuit board substrates

Technical Parameters

Parameter	Typical range	Notes & selection driver
Peak PerformanceRequired	1–10 FLOPS	Maximum theoretical computational performance achievable under ideal conditions
Sustained PerformanceRequired	0.5–5 FLOPS	Actual computational performance maintained during typical workloads
Processor CountRequired	1000–100000 units	Total number of processing units (CPUs/GPUs) in the system
Memory CapacityRequired	10–500 TB	Total system memory available for computational tasks
Interconnect BandwidthRequired	100–1000 GB/s	Maximum data transfer rate between processing nodes
Power ConsumptionRequired	100–1000 kW	Maximum electrical power consumption under full load
Operating Temperature	10–35 °C	Air-cooledISO 7779
Storage Capacity	1–50 PB	Parallel file system
Cooling Method	Air or Liquid	Liquid for >200 kW
Footprint	10–200 m²	Including racks and cooling
Weight	5000–50000 kg	Full system
Operating Humidity	20–80 % RH	Non-condensingISO 7779
Input Voltage	200–480 V AC	3-phaseIEC 60038

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Compute Nodes
Primary processing units containing CPUs/GPUs that execute computational tasks

Material: Semiconductor processors, copper interconnects, silicon substrates
High-Speed Interconnect
Network infrastructure enabling low-latency communication between compute nodes

Material: Optical fibers, copper cables, network interface controllers
Parallel Storage System
High-bandwidth storage solution for simultaneous data access by multiple compute nodes

Material: Magnetic disks, solid-state drives, storage controllers
Cooling System
Thermal management infrastructure to dissipate heat generated by high-density computing components

Material: Liquid coolant, heat exchangers, copper piping, aluminum fins
Power Distribution Unit
Electrical infrastructure providing stable power supply to all system components

Material: Copper conductors, insulating materials, circuit breakers
Management Node
Control system for job scheduling, resource allocation, and system monitoring

Material: Standard server components with management processors

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for High-Performance Computing Systems.

Manufacturers of High-Performance Computing Systems

Manufacturer profiles associated with High-Performance Computing Systems.

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Frequently Asked Questions

What are typical performance metrics for HPC systems?

Typical metrics include peak performance (1–10 FLOPS), sustained performance (0.5–5 FLOPS), processor count (1000–100000 units), memory capacity (10–500 TB), and interconnect bandwidth (100–1000 GB/s). These are reference ranges; actual values depend on the specific configuration and must be confirmed with the manufacturer.

What cooling methods are used for HPC systems?

Cooling methods include air cooling for systems up to 200 kW and liquid cooling for systems exceeding 200 kW. The operating temperature range is 10–35 °C (ISO 7779) and humidity 20–80% RH (ISO 7779). Verify the cooling requirements with the supplier.

What are the power and space requirements?

Power consumption ranges from 100 to 1000 kW, input voltage is 200–480 V AC (IEC 60038), and footprint is 10–200 m² including racks and cooling. Weight ranges from 5000 to 50000 kg. These are reference values; confirm with the manufacturer.

What materials are used in HPC construction?

Materials include semiconductor materials, copper alloys, thermal interface materials, and printed circuit board substrates. These are typical materials; specific grades and specifications should be verified with the supplier.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric (0.8 to 1.1 bar), altitude up to 3000m
other spec:	Humidity: 20-80% non-condensing, Power: 200-480V AC, 50/60Hz, Cooling: Liquid or air, 10-100 kW thermal load
temperature:	10°C to 35°C (operating), 0°C to 45°C (storage)

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