Digital Audio Signal Processor Module

Product Specifications

Technical details and manufacturing context for Digital Audio Signal Processor Module

Definition

A digital audio signal processor module is an IC, system-on-chip, packaged module or populated board that performs programmable or fixed digital operations on audio sample streams. The implementation may be digital-only or include codecs, analogue front ends, memory, clocks, power regulation and connectors; ADCs and DACs are not inherent to every audio DSP. I2S/TDM commonly carry audio data while SPI/I2C commonly configure devices, but exact roles and timing are model-specific. Sampling rate, word length, channel count, processing latency/capacity, supply and power are digital-path properties; SNR and THD+N require a defined analogue signal path and measurement setup. Package/board size, temperature and environmental protection depend on the exact product boundary. The listed ranges are unverified comparison prompts, not one coherent module specification. Select against an exact data sheet, hardware/firmware revision, clocking, algorithm load, audio path, PCB and test conditions.

Working Principle

Digital audio samples enter through a defined serial, memory or network interface, are synchronized to one or more clock domains, processed by arithmetic cores and moved through buffers, mixers, filters or other algorithms before output. If analogue conversion is included, converter reference, analogue supply, input/output stage, load, reconstruction/anti-alias filtering and clock jitter become part of the measured path. Real-time performance depends on sample rate, channels, word format, instruction and memory bandwidth, routing, block size, firmware and clock plan. Power, latency, SNR, THD+N and stability must therefore be measured for the exact signal path and configuration.

Common Materials

Silicon semiconductor, FR-4 PCB substrate, Copper alloy contacts

Technical Parameters

Parameter	Typical range	Notes & selection driver
Sampling RateRequired	44.1–192 kHz	Maximum audio sampling frequency
Bit DepthRequired	16–32 bits	Audio resolution in bits
Power ConsumptionRequired	0.5–2.5 mW	Unverified category prompt; state IC or module boundary, supply, clock, channels, algorithm load and test mode
Operating TemperatureRequired	-40–85 °C	Temperature range for reliable operation
Outline SizeRequired	7×7–15×15 mm	Two-dimensional outline prompt; height, tolerances and IC/package or board boundary require an exact drawing
Interface TypeRequired	I2S, TDM, SPI, I2C	Possible audio-data and control interfaces; exact roles, electrical levels, timing and supported modes require device evidence
Signal-to-Noise Ratio	≥100 dB	Unverified prompt; specify signal path, weighting, bandwidth, level, gain, load and test configuration
Total Harmonic Distortion + Noise	≤0.005 %	Unverified prompt; specify signal path, frequency, amplitude, bandwidth, weighting, gain, load and test configuration
Supply Voltage	1.8–3.3 V	Core and I/O voltage ranges
Operating Humidity	10–90 % RH	Non-condensing
Ingress Protection	Enclosure-dependent	Only a declared enclosure or complete assembly has an IP code; not an intrinsic DSP IC or exposed-connector rating
Weight	5–20 g	Depends on package and heatsink

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Digital Signal Processor Core Part
Executes audio processing algorithms

Material: Silicon semiconductor
Analog-to-Digital Converter
Converts analog audio input to digital signals

Material: Silicon semiconductor
Digital-to-Analog Converter
Converts processed digital signals to analog output

Material: Silicon semiconductor
Memory Buffer Part
Temporary storage for audio data processing

Material: Silicon semiconductor
Power Management Circuit
Regulates and distributes power to components

Material: Copper alloy, Silicon semiconductor

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Digital Audio Signal Processor Module.

Manufacturers of Digital Audio Signal Processor Module

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Shenzhen FHB Audio Technology Co., Ltd.

Shenzhen, Guangdong, CN

Also makes: Management Processor, Transmission, Digital Signal Processor and 4 more

Listed on the company's own website · profile compiled by CNFX from public sources

Listed there as: “Dsp Digital Sound Processor”
View source page ↗ fhbavtecaudio.com · checked 2026-09-03

View profile Send enquiry

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 16 September 2026

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Frequently Asked Questions

Does every audio DSP module include an ADC and DAC?

No. Many devices are digital-only processors and use external converters; others integrate one or more converters. Verify the exact block diagram, pin functions and analogue path.

Can the page SNR and THD+N values be compared without test conditions?

No. Identify the measured input-to-output path, sample rate, bandwidth and weighting, signal level/frequency, gain, load, supply, clock and filter configuration. Digital-only DSPs may not have an intrinsic analogue SNR or THD+N.

Do I2S, TDM, SPI and I2C all carry the same audio stream?

No. I2S/TDM commonly transport sample data while SPI/I2C often provide control, although device roles vary. Verify electrical levels, master/slave role, word/frame format, clocks, channel slots and supported modes.

Does a DSP IC or exposed connector have IP54–IP65 by default?

No. IEC 60529 classifies protection provided by a declared enclosure. An IP code must identify the complete enclosure or assembly boundary and evidence; it is not intrinsic to a bare IC, board or exposed connector.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Buyer enquiry

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audio:	Define analogue/digital paths, channels, sample rates, word/frame format, SNR/THD+N/dynamic-range conditions and latency.
compute:	Define algorithms, instruction/accelerator needs, memory, block size, firmware tools and worst-case real-time load.
boundary:	Identify bare IC/SoC, packaged module, evaluation board or production assembly and whether converters, memory, clocks and power are included.
interfaces:	Map audio-data versus control ports, electrical levels, clock master/slave, routing, boot and external codec/amplifier connections.
environment:	Set exact supply/thermal design, package/PCB drawing, assembly qualification, EMC and enclosure-level IP only where applicable.