Products (6)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized component in wire bonding machines that uses controlled electrical discharge to cleanly sever bonding wires after connection formation.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision thermal platform within a wire bonding machine that provides controlled heating to the substrate during the bonding process.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision machine that creates electrical interconnections between semiconductor chips and their packages using fine wires.