This page explains how Wire Bonding Machine is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision machine that creates electrical interconnections between semiconductor chips and their packages using fine wires.
Technical details and manufacturing context for Wire Bonding Machine
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Bonding SpeedRequired | 10–30 bonds/second | Maximum number of wire bonds the machine can complete per second |
| Bond ForceRequired | 10–150 gf | Force applied during the bonding process to ensure proper wire deformation and adhesion |
| Bond TemperatureRequired | 150–250 °C | Heater temperature at the bonding stage for thermosonic or thermocompression bonding |
| Positioning AccuracyRequired | ±0.01 μm | Precision of bond placement relative to target pad coordinates |
| Wire Diameter RangeRequired | 0.015–0.050 μm | Minimum and maximum wire diameters the machine can handle |
| Operating Pressure | 0.4–0.6 MPa | Pressure for pneumatic system; below 0.4 MPa may cause insufficient force. |
| Operating Temperature | 15–35 °C | Outside this range, bonding quality may degrade. |
| Humidity Range | 30–70 % RH | High humidity can cause oxidation of wire and bond pads. |
| Power Supply | 220 ±10% V AC | Single phase, 50/60 Hz. |
| Machine Weight | 800–1200 kg | Weight affects installation and floor loading. |
| Footprint | 1.2 × 1.0 m | Dimensions (W × D) for planning production layout. |
| IP Rating | IP54 | Protection against dust and water splashes.IEC 60529 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Wire Bonding Machine.
| pressure: | 0.5-2.0 N (bond force range), 0.1-0.5 MPa (capillary pressure) |
| other spec: | Wire diameter: 15-50 μm, Bond pitch: 30-100 μm, Throughput: 5-15 bonds/second |
| temperature: | 15-30°C (operating environment), 150-300°C (bonding temperature range) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
7 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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The machine supports thermosonic, thermocompression, and ultrasonic bonding techniques, as indicated in the product definition. These methods use heat, pressure, and/or ultrasonic energy to form reliable interconnections.
According to the product data, the machine can handle gold, aluminum, and copper wires. The wire diameter range is 0.015–0.050 mm, but you should confirm compatibility with the specific model.
The reference operating temperature is 15–35 °C, humidity 30–70% RH, and operating pressure 0.4–0.6 MPa. The power supply is 220 V AC ±10% single phase. Always verify these parameters for your installation.
The positioning accuracy is listed as ±0.01 μm. This is a reference value; actual accuracy may vary by model and setup. Consult the manufacturer for detailed specifications.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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