Products (6)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision machine that evenly distributes and spreads semiconductor chips or electronic components onto substrates during manufacturing processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision assembly machine used to attach semiconductor dies to substrates or leadframes using adhesive materials.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that picks up semiconductor dies from wafer tape and places them onto substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
Thin slices of semiconductor material used as substrates for fabricating integrated circuits and other microelectronic devices.