This page explains how Chip Spreader is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision machine that evenly distributes and spreads semiconductor chips or electronic components onto substrates during manufacturing processes.
Technical details and manufacturing context for Chip Spreader
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Placement AccuracyRequired | ±0.05 μm | Maximum deviation from target placement position |
| Placement SpeedRequired | 3000–8000 components/hour | Maximum number of chips placed per hour under optimal conditions |
| Component Size RangeRequired | 01005–45×45 mm | Minimum and maximum dimensions of chips that can be handled |
| Substrate SizeRequired | 50×50–510×460 mm | Maximum dimensions of the substrate that can be processed |
| Power RequirementRequired | 220–240 V/Hz | Electrical power specifications required for operation |
| Operating Pressure | 0.5–0.7 MPa | Compressed air, dry and oil-freeISO 8573-1 |
| Air Consumption | 100–150 L/min | At 0.6 MPa supply pressure |
| Operating Temperature | 15–35 °C | Below 15°C may affect adhesive curing |
| Humidity Range | 30–70 % RH | Non-condensing |
| Ingress Protection | IP54 | Dust-protected and splash-proofIEC 60529 |
| Machine Weight | 1200–1500 kg | Depending on configuration |
| Footprint (L×W×H) | 1800×1600×1700 mm | Clearance for maintenance required |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | 0.1-0.5 bar (dispensing pressure) |
| flow rate: | 0.1-10 ml/min (adjustable slurry flow) |
| throughput: | Up to 10,000 units/hour (chip placement rate) |
| temperature: | 15-30°C (operating environment) |
| substrate size: | Up to 300mm diameter wafers or equivalent panel sizes |
| placement accuracy: | ±25μm (chip placement precision) |
| slurry concentration: | 5-50% solids by weight |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
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The placement accuracy is specified as ±0.05 μm, meaning the maximum deviation from the target position is within that range. This is a reference value; actual performance may vary by model and setup, so confirm with the manufacturer.
The component size range is from 01005 (0.4 x 0.2 mm) up to 45 x 45 mm. This range covers a wide variety of chips and electronic components. Verify that your specific components fall within the machine's capabilities.
The machine requires 220–240 V/Hz electrical power and compressed air at 0.5–0.7 MPa, meeting ISO 8573-1 for dry, oil-free air. Air consumption is 100–150 L/min at 0.6 MPa supply pressure. Ensure your facility meets these requirements.
The recommended operating temperature is 15–35°C, with non-condensing humidity of 30–70% RH. The machine has an IP54 rating, meaning it is dust-protected and splash-proof. Operating outside these conditions may affect performance, especially adhesive curing below 15°C.
Commonly used trade names and technical identifiers for Chip Spreader.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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