INDUSTRY COMPONENT

Photodiode Chip

A semiconductor photodiode chip that converts light signals into electrical current for optical sensing applications.

Component Specifications

Definition
A photodiode chip is a specialized semiconductor component designed to detect light and convert it into an electrical signal through the photoelectric effect. These chips are typically fabricated from silicon, germanium, or III-V compound semiconductors like indium gallium arsenide (InGaAs) for specific wavelength ranges. They feature a PIN (p-i-n) or avalanche structure to optimize responsivity, speed, and noise characteristics for precise light measurement in industrial sensors.
Working Principle
Operates on the photoelectric effect: when photons with sufficient energy strike the semiconductor material in the depletion region, they generate electron-hole pairs. An applied reverse bias voltage separates these charge carriers, creating a photocurrent proportional to the incident light intensity. This current is then amplified and processed to provide measurable electrical output corresponding to light levels.
Materials
Primary: Silicon (Si) for visible to near-infrared (400-1100 nm). Alternatives: Germanium (Ge) for infrared up to 1800 nm, Indium Gallium Arsenide (InGaAs) for 800-2600 nm. Package: Ceramic or metal housing with glass/quartz window. Contacts: Gold or aluminum wire bonding.
Technical Parameters
ParameterTypical rangeNotes & selection driver
Rise Time1-100 ns
Active Area0.1-100 mm²
Dark Current1-100 nA at rated bias
Responsivity0.4-0.6 A/W at peak wavelength
Wavelength Range400-1100 nm (Si typical)
Operating Voltage5-100 V reverse bias
Temperature Range-40°C to +85°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards
ISO 10110-8, IEC 60747-5, JEDEC JESD22

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Electrostatic discharge damage during handling
  • Thermal degradation at high operating temperatures
  • Optical window contamination affecting sensitivity
  • Saturation from excessive light intensity
FMEA Triads
Trigger: Electrostatic discharge during installation
Failure: Permanent damage to semiconductor junction, causing high dark current or complete failure
Mitigation: Use ESD-safe handling procedures, grounded workstations, and proper packaging
Trigger: Excessive reverse bias voltage
Failure: Breakdown of PN junction, leading to thermal runaway and catastrophic failure
Mitigation: Implement voltage clamping circuits and follow manufacturer's maximum ratings
Trigger: Moisture ingress in packaging
Failure: Corrosion of contacts and degradation of optical properties over time
Mitigation: Use hermetic sealing and conformal coating for harsh environments

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance
±5% responsivity variation across production batches, ±2% spectral response consistency
Test Method
IEC 60747-5 for photoelectric characteristics, MIL-STD-883 for environmental testing, ISO 10110 for optical specifications

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Photodiode Chip

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

GLSUN (Guilin GLSUN Science and Tech Group Co.,Ltd)
Guangxi, CN
Listed on the company's own website · profile compiled by CNFX from public sources

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

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Frequently Asked Questions

What is the difference between a photodiode chip and a phototransistor?

A photodiode chip generates current directly from light with faster response but lower gain, while a phototransistor provides internal amplification but slower speed and higher noise.

How do I select the right photodiode chip for my application?

Consider wavelength sensitivity, response speed, active area size, dark current, and packaging based on your light source, signal frequency, and environmental conditions.

Can photodiode chips detect ultraviolet or far-infrared light?

Standard silicon chips detect visible to near-infrared; specialized materials like silicon carbide (SiC) for UV or mercury cadmium telluride (MCT) for far-IR are required for those ranges.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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