Editorial Technical Reference

Data Communication Module

This page explains how Data Communication Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A specialized electronic component that enables wireless or wired data transmission between medical monitoring devices and external systems.

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Product Specifications

Technical details and manufacturing context for Data Communication Module

Definition
The Data Communication Module is a component-level electronic assembly used in medical monitoring devices. It is responsible for transmitting patient vital signs, device status, and operational data to central monitoring stations, electronic health records, or healthcare provider networks. The module ensures reliable communication while maintaining data integrity and patient privacy in clinical environments. It converts analog or digital signals from medical sensors into standardized data packets, applies encryption and error-correction protocols, and transmits via wireless (Wi-Fi, Bluetooth, cellular) or wired (Ethernet, USB) interfaces. The module manages connection stability and data throughput. Key parameters include supply voltage of 3.3–5 V DC, data rates from 1 to 1000 Mbps, operating temperature range of -40 to 85 °C, storage temperature of -40 to 105 °C, humidity of 10–90% RH (non-condensing), ingress protection from IP40 to IP65 (per IEC 60529), selectable interfaces (UART, SPI, I2C, USB), Bluetooth/BLE frequency band of 2.4–2.4835 GHz (per IEEE 802.15.1), transmit power of 0–20 dBm, receiver sensitivity of -95 to -85 dBm, dimensions of 15–30 mm, and weight of 5–20 g. Materials include printed circuit board, semiconductor chips, RF components, and connectors. These values are reference ranges and must be verified for the specific model and application with the legal manufacturer or supplier. The module is intended for integration by device manufacturers; it is not a standalone consumer product. Proper selection requires confirming interface compatibility, power supply, environmental conditions, and regulatory requirements. Maintenance signals include intermittent connectivity, increased error rates, or physical damage. Failure boundaries are defined by the manufacturer's specifications; the module should be replaced if it fails to meet those specifications.
Working Principle
The module receives analog or digital signals from medical sensors. It conditions and converts these signals into standardized data packets. Encryption and error-correction protocols are applied to ensure data integrity and security. The module then transmits the data via wireless interfaces (Wi-Fi, Bluetooth, cellular) or wired interfaces (Ethernet, USB) to designated receivers. It manages connection stability and data throughput, adapting to network conditions. The module operates within specified voltage, temperature, and humidity ranges. It uses semiconductor chips and RF components on a printed circuit board to perform signal processing and communication. The module's firmware handles protocol stacks and connection management. It may support multiple interfaces and frequency bands depending on the model. The module's performance is characterized by parameters such as data rate, transmit power, and receiver sensitivity. These parameters are reference values and must be confirmed for the specific model.
Common Materials
Printed Circuit Board (PCB), Semiconductor chips, RF components, Connectors
Technical Parameters
ParameterTypical rangeNotes & selection driver
Supply Voltage3.3–5 V DCOperating range for logic and RF sections
Data Rate1–1000 MbpsDepends on interface and protocol
Operating Temperature-40–85 °CIndustrial grade
Storage Temperature-40–105 °CNon-operating
Humidity10–90 % RHNon-condensing
Ingress ProtectionIP40–IP65Depends on enclosureIEC 60529
InterfaceUART, SPI, I2C, USBSelectable per model
Frequency Band2.4–2.4835 GHzBluetooth/BLEIEEE 802.15.1
Transmit Power0–20 dBmAdjustable
Receiver Sensitivity-95–-85 dBmAt 1 Mbps
Dimensions15–30 mmLength or width, varies by model
Weight5–20 gDepends on shielding and connectors

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • RF Transceiver
    Handles wireless signal transmission and reception
    Material: Semiconductor
  • Microcontroller
    Processes data and manages communication protocols
    Material: Silicon chip
  • Antenna Part
    Radiates and receives electromagnetic waves for wireless communication
    Material: Copper alloy
  • Encryption Chip
    Secures patient data through cryptographic algorithms
    Material: Semiconductor
  • Wired Interfaces
    Ethernet and USB ports for the wired transmission path.
  • Firmware
    Handles the protocol stack and connection management of the module.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Data Communication Module.

Medical Data Transceiver Patient Monitor Communication Unit

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Medical Monitoring Devices
View system integration details

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Not applicable (electronic component)
other spec: Humidity: 10-90% non-condensing, Data Rate: Up to 1 Gbps, Power Supply: 3.3V DC ±5%
temperature: -20°C to +70°C
Media Compatibility
✓ Hospital-grade disinfectants ✓ Medical-grade plastics enclosures ✓ Clean room environments
Unsuitable: High electromagnetic interference (EMI) environments like MRI rooms
Sizing Data Required
  • Required data transmission protocol (e.g., Wi-Fi, Bluetooth, Ethernet)
  • Maximum data throughput requirement (Mbps)
  • Power consumption constraints (mA)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Data Packet Corruption
Cause: Electromagnetic interference from nearby high-power equipment or poor shielding in industrial environments
Connection Intermittency
Cause: Corrosion of connectors due to moisture ingress or thermal cycling-induced contact degradation
Maintenance Indicators
  • Intermittent or complete loss of data transmission despite power being present
  • Unusual LED indicator patterns (e.g., flickering, incorrect color sequences) on the module
Engineering Tips
  • Implement regular cleaning and inspection of connectors with dielectric grease application to prevent corrosion
  • Install the module in a controlled environment with proper EMI shielding and maintain stable operating temperatures

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO/IEC 11801-1:2017 (Generic cabling systems) ANSI/TIA-568.2-D (Balanced twisted-pair telecommunications cabling) EN 55032:2015/A11:2020 (CE marking for electromagnetic compatibility)

Quoted from the published standard.

Manufacturing Precision
  • Connector alignment: +/-0.15mm
  • PCB via hole diameter: +/-0.05mm
Quality Inspection
  • Signal integrity test (eye diagram analysis)
  • Thermal cycling test (-40°C to +85°C, 500 cycles)

Manufacturers of Data Communication Module

Manufacturer profiles associated with Data Communication Module.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 6 September 2026

Technical documentation
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Frequently Asked Questions

What interfaces does this module support?

The module supports selectable interfaces including UART, SPI, I2C, and USB. The specific interface availability depends on the model. Verify with the manufacturer for your application.

What is the operating temperature range?

The operating temperature range is -40 to 85 °C. Storage temperature is -40 to 105 °C. These are reference ranges; confirm the exact limits for the specific model.

Does the module support Bluetooth?

Yes, the module can support Bluetooth/BLE in the 2.4–2.4835 GHz band, per IEEE 802.15.1. However, not all models may include this feature. Check the model specifications.

What is the ingress protection rating?

The ingress protection rating ranges from IP40 to IP65, per IEC 60529. The actual rating depends on the enclosure and model. Verify with the manufacturer.

Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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