Editorial Technical Reference

Encryption Chip

This page explains how Encryption Chip is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A specialized integrated circuit for cryptographic operations in data communication systems.

Product Specifications

Technical details and manufacturing context for Encryption Chip

Definition
An encryption chip is a hardware component within a Data Communication Module that implements cryptographic algorithms to encrypt and decrypt data transmitted over networks. It provides hardware-level security for protecting sensitive information during communication processes, offering advantages in speed and tamper resistance compared to software-based encryption solutions. This component is designed for use in computer, electronic, and optical product manufacturing, specifically as a part-level component. The chip operates with a supply voltage range of 1.8–3.6 V (IEC 60134), a listed industrial temperature range of -40 to 85 °C that must be confirmed for the specific chip; IEC 60068-2-1 and IEC 60068-2-2 are cold and dry-heat test methods and do not establish this range; and a clock frequency of 10–100 MHz. It supports AES encryption throughput of 100–500 Mbps for 128-bit keys (NIST FIPS 197), with power consumption between 10 and 100 mW at 1.8 V and 10 MHz. The chip is available in a QFN-32 package (JEDEC MS-026) with a 5×5 mm footprint, and operates in non-condensing humidity of 5–95% RH (IEC 60068-2-78). It has an ESD tolerance of 2000 V (HBM, IEC 61000-4-2), data retention of 10 years at 85 °C (JESD22-A103), and write endurance of 100,000 cycles for EEPROM (JESD22-A117). The primary material is silicon. These parameters are directory reference ranges and must be verified with the legal manufacturer or supplier for the specific model and application. The chip is not a standalone product but a component intended for integration into communication modules. It is not certified or compliant solely by listing these standards; they serve as procurement and verification references. For proper selection, consider the required cryptographic algorithms, throughput, power constraints, and environmental conditions. Interfaces typically include data input/output, clock, and control lines, but specific pinouts must be confirmed from the datasheet. Maintenance signals may include temperature and voltage monitoring, and failure boundaries are defined by the operating ranges and endurance limits. Always consult the manufacturer for detailed specifications and application notes.
Working Principle
The encryption chip receives plaintext data from the communication module, processes it through embedded cryptographic algorithms (such as AES, RSA, or ECC), and outputs ciphertext using encryption keys. During reception, it performs the reverse decryption process. This hardware-based approach offloads computationally intensive cryptographic operations from the main processor, enhancing both security and system performance. The chip operates within specified voltage, temperature, and clock ranges, and its throughput depends on the clock frequency and algorithm. It uses silicon-based circuitry to execute these operations, and its EEPROM storage supports key and configuration retention. The chip's performance is characterized by parameters like AES throughput and power consumption, which vary with operating conditions. For proper operation, the chip must be supplied with appropriate power and clock signals, and its environmental conditions must stay within the specified limits to ensure reliable encryption and decryption.
Common Materials
Silicon
Technical Parameters
ParameterTypical rangeNotes & selection driver
Supply Voltage1.8–3.6 VOperating range for core and I/OIEC 60134
Operating Temperature-40–85 °CIndustrial grade
Clock Frequency10–100 MHzHigher frequency increases throughput
AES Encryption Throughput100–500 MbpsFor 128-bit keyNIST FIPS 197
Power Consumption10–100 mWAt 1.8V, 10MHz
Package TypeQFN-32Other packages availableJEDEC MS-026
Operating Humidity5–95 % RHNon-condensingIEC 60068-2-78
ESD Tolerance2000 VHBM modelIEC 61000-4-2
Data Retention10 yearsAt 85°CJESD22-A103
Write Endurance100000 cyclesFor EEPROMJESD22-A117
Footprint5×5 mmQFN-32 packageJEDEC MS-026

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Cryptographic Core
    Executes cryptographic algorithms for encryption and decryption operations
    Material: silicon
  • Key Storage
    Securely stores encryption keys in tamper-resistant memory
    Material: silicon
  • I/O Interface
    Handles data input/output between the chip and the communication module
    Material: copper/silicon
  • Random Number Generator
    Generates cryptographically secure random numbers for key generation and other security functions
    Material: silicon

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Encryption Chip.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
voltage: 1.8V to 3.3V (supply voltage range)
temperature: -40°C to 125°C (operational range)
clock frequency: Up to 500 MHz (max operating frequency)
power consumption: ≤ 150 mW (typical active power)
Media Compatibility
✓ Secure communication systems (e.g., 5G base stations) ✓ IoT devices with encryption requirements ✓ Data center hardware security modules
Unsuitable: High-radiation environments (e.g., space applications without radiation hardening)
Sizing Data Required
  • Required cryptographic algorithms (e.g., AES-256, RSA-2048)
  • Data throughput requirements (Gbps)
  • Physical package constraints (e.g., BGA, QFN footprint)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal degradation
Cause: Excessive heat generation due to poor heat dissipation, overclocking, or high ambient temperatures leading to material breakdown and circuit failure.
Electromigration
Cause: High current density causing gradual displacement of metal atoms in interconnects, resulting in open circuits or short circuits over time.
Maintenance Indicators
  • Unexpected system crashes or data corruption during encryption/decryption operations
  • Abnormally high chip temperature detected by thermal sensors or physical touch
Engineering Tips
  • Implement active cooling solutions with proper thermal interface materials and maintain ambient temperature below manufacturer specifications
  • Use voltage regulation and current limiting circuits to prevent electrical overstress and ensure stable power supply quality

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO/IEC 19790:2012 (Security requirements for cryptographic modules) ANSI X9.97 (Financial services - Secure cryptographic devices) CE marking (EU compliance for electromagnetic compatibility and safety)

Quoted from the published standard.

Manufacturing Precision
  • Die thickness: +/-0.025mm
  • Bond wire placement: +/-0.01mm
Quality Inspection
  • Environmental stress screening (temperature cycling and vibration)
  • Side-channel attack resistance testing (power analysis and timing analysis)

Manufacturers of Encryption Chip

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Shanghai Fudan Microelectronics Group Co., Ltd.
Shanghai, CN
Also makes: Smart Meter
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Secured encryption chips”
View source page ↗ fm-chips.com · checked 2026-09-16

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

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Frequently Asked Questions

What cryptographic algorithms does the encryption chip support?

The chip implements embedded cryptographic algorithms such as AES, RSA, or ECC, as mentioned in the working principle. The specific algorithms supported may vary by model, so consult the manufacturer's datasheet for the exact list.

What is the operating temperature range?

The listed industrial-grade operating temperature range is -40 to 85 °C and must be verified for the specific model. IEC 60068-2-1 and IEC 60068-2-2 are cold and dry-heat test methods and do not establish this range.

What is the AES encryption throughput?

For a 128-bit key, the AES encryption throughput is 100–500 Mbps, as per NIST FIPS 197. This is a reference range; actual throughput depends on clock frequency and operating conditions.

What is the package type and footprint?

The chip is available in a QFN-32 package with a 5×5 mm footprint, according to JEDEC MS-026. Other packages may be available, so confirm with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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