This page explains how Reflow Soldering Oven is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A thermal processing unit that melts solder paste to form permanent electrical connections between surface-mount components and printed circuit boards.
Technical details and manufacturing context for Reflow Soldering Oven
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Heating Zones | 8–10 zones | More zones allow finer thermal profiling |
| Cooling Zones | 2–3 zones | Sufficient cooling prevents solder defects |
| Max Conveyor Width | 400–600 mm | Determines maximum PCB size |
| Conveyor Speed Range | 0.3–2.0 m/min | Adjustable to match thermal profile |
| Temperature Range | 25–350 °C | Peak reflow temperature typically 245–260°C |
| Temperature Uniformity | ±2 °C | Critical for consistent solder joints |
| Heating Power | 20–60 kW | Higher power for faster ramp rates |
| Supply Voltage | 380 ±10% V AC | Three-phase, 50/60 Hz |
| Air Pressure | 0.5–0.7 MPa | For pneumatic conveyor and cooling |
| Nitrogen Consumption | 15–30 m³/h | When using nitrogen reflow for better wetting |
| Overall Dimensions (L×W×H) | 6000–12000 × 1500–2000 × 1500–2000 mm | Footprint varies with number of zones |
| Weight | 2000–5000 kg | Heavier machines have more thermal mass |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | Atmospheric to slight positive pressure (0-0.5 psi) for inert gas purging |
| other spec: | Conveyor speed: 0.1-2.0 m/min, thermal zones: 5-12, max board size: 300x300 mm to 500x500 mm |
| temperature: | Ambient to 300°C (typical reflow profile: 150-250°C peak) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The typical temperature range is 25–350°C, with peak reflow temperatures usually between 245–260°C. However, the exact range depends on the specific model and application, so always verify with the manufacturer.
Common configurations have 8–10 heating zones, which allow finer thermal profiling. The number of zones affects the precision of the temperature profile and should be selected based on the complexity of the PCB assembly.
Cooling zones (typically 2–3) are used to control the cooling rate of the PCB after reflow. Proper cooling is critical to prevent solder defects such as poor joint formation or thermal shock to components.
Yes, some reflow ovens support nitrogen reflow to improve solder wetting. Nitrogen consumption is typically 15–30 m³/h, but this depends on the oven design and process requirements. Verify with the manufacturer for specific models.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
Compare manufacturer profiles with relevant product and process capability.