Motherboard/Backplane for Network Infrastructure

Product Specifications

Technical details and manufacturing context for Motherboard/Backplane

Definition

In network infrastructure equipment, the motherboard/backplane is the central printed circuit board that houses the CPU, memory, and other critical components while providing multiple expansion slots and connectors for network interface cards, storage controllers, and other modules. It establishes the primary data pathways and power distribution system within routers, switches, servers, and other networking hardware, ensuring reliable communication between all installed components. The board is typically manufactured from FR-4 fiberglass epoxy laminate with copper foil traces, solder mask, and gold-plated connectors. Standard dimensions follow the ATX form factor (304.8 × 304.8 mm), though other sizes are available. Layer counts range from 8 to 20, with copper thickness from 35 to 70 µm, and minimum trace width/space of 0.1/0.1 mm. Impedance tolerance is ±10%, and operating temperature ranges from -40 to 85 °C, with storage from -55 to 125 °C. Humidity tolerance is 5–95% RH (non-condensing). Input voltage is 12 V DC ±5%, with current capacity per power pin from 10 to 30 A. Dielectric withstanding voltage is 500 V DC, insulation resistance ≥100 MΩ at 500 V DC, and surface finish is ENIG (immersion gold over nickel). Weight varies from 0.5 to 1.5 kg depending on board size and layer count. These parameters are reference values per IPC-6012, IPC-2221, IPC-2141, and IEC 60068 standards; actual values must be confirmed with the manufacturer for specific models. The backplane portion provides a passive interconnection system with standardized slots, while the motherboard section includes active components like chipsets that manage data flow. Power distribution from the PSU to all components and communication via protocols such as PCIe, SATA, and USB are facilitated. This directory entry is for reference; verify all specifications with the legal manufacturer or supplier.

Working Principle

The motherboard/backplane functions as the central nervous system of network equipment. It contains embedded copper traces that form electrical pathways (buses) for data transmission between the CPU, memory, and expansion slots. The backplane portion typically provides a passive interconnection system with standardized slots and connectors, while the motherboard section includes active components like chipsets that manage data flow. It distributes power from the PSU to all connected components and facilitates communication through various protocols (PCIe, SATA, USB, etc.).

Common Materials

FR-4 fiberglass epoxy laminate, Copper foil, Solder mask, Gold-plated connectors

Technical Parameters

Parameter	Typical range	Notes & selection driver
Board Size	304.8 × 304.8 mm	Standard ATX form factor; other sizes available.ATX
Layer Count	8–20	Higher layer count for complex routing and signal integrity.IPC-6012
Copper Thickness	35–70 µm	Thicker copper for higher current capacity.IPC-6012
Minimum Trace Width/Space	0.1/0.1 mm	Tighter geometries for high-density designs.IPC-2221
Impedance Tolerance	±10%	Critical for high-speed signal integrity.IPC-2141
Operating Temperature	-40–85 °C	Extended range for industrial environments.IEC 60068-2-1/2
Storage Temperature	-55–125 °C	Survives harsh shipping and storage conditions.IEC 60068-2-1/2
Humidity	5–95 % RH	Non-condensing; condensation may cause shorts.IEC 60068-2-78
Input Voltage	12 ±5% V DC	Typical backplane power; other voltages available.ATX
Current Capacity	10–30 A	Per power pin; depends on copper weight and connector rating.IPC-2221
Dielectric Withstanding Voltage	500 V DC	Minimum isolation between circuits.IPC-6012
Insulation Resistance	≥100 MΩ	Measured at 500 V DC; lower may indicate contamination.IPC-6012
Surface Finish	ENIG	Immersion gold over nickel; other finishes available.IPC-4552
Weight	0.5–1.5 kg	Depends on board size and layer count.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

CPU Socket Part
Physical and electrical interface for the central processing unit

Material: LGA/PGA socket with gold-plated contacts
Memory Slots Part
Hold and connect RAM modules to the memory controller

Material: Plastic housing with gold-plated contacts
PCIe Slots Part
Provide high-speed expansion interfaces for network cards and other peripherals

Material: Plastic slot with gold-plated edge connectors
Chipset
Manages data flow between CPU, memory, and peripherals

Material: Silicon semiconductor with BGA packaging
Power Connectors
Deliver electrical power from PSU to motherboard components

Material: Plastic housing with gold-plated pins
Network Controller
Integrated circuitry for Ethernet connectivity

Material: Silicon chip with QFN packaging
Copper Traces
Embedded pathways that form the buses between CPU, memory and slots.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Motherboard/Backplane.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Network Infrastructure Equipment

View system integration details

Manufacturers of Motherboard/Backplane

Manufacturer profiles associated with Motherboard/Backplane.

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Frequently Asked Questions

What are the typical board dimensions for this motherboard/backplane?

The standard size is 304.8 × 304.8 mm per the ATX form factor, but other sizes are available. Always confirm the exact dimensions for your specific model with the manufacturer.

What is the operating temperature range?

The operating temperature range is -40 to 85 °C, with storage from -55 to 125 °C, per IEC 60068-2-1/2. Verify these limits for your application.

What surface finish is used?

The surface finish is ENIG (electroless nickel immersion gold), per IPC-4552. Other finishes may be available; check with the supplier.

What standards apply to this component?

Relevant standards include IPC-6012 for performance, IPC-2221 for design, IPC-2141 for impedance, and IEC 60068 for environmental testing. These are reference standards; compliance must be verified with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	N/A (non-pressure application)
other spec:	Humidity: 10% to 90% non-condensing, Vibration: 5-500 Hz at 0.5G, Shock: 50G for 11ms
temperature:	0°C to 70°C (operational), -40°C to 85°C (storage)

Motherboard/Backplane

Product Specifications

Industry Taxonomies & Aliases

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards