Network Infrastructure Equipment
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This page explains how Motherboard/Backplane is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board that serves as the main structural and electrical backbone in network infrastructure equipment, providing connectivity between various electronic components and expansion cards.
Technical details and manufacturing context for Motherboard/Backplane
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Board Size | 304.8 × 304.8 mm | Standard ATX form factor; other sizes available.ATX |
| Layer Count | 8–20 | Higher layer count for complex routing and signal integrity.IPC-6012 |
| Copper Thickness | 35–70 µm | Thicker copper for higher current capacity.IPC-6012 |
| Minimum Trace Width/Space | 0.1/0.1 mm | Tighter geometries for high-density designs.IPC-2221 |
| Impedance Tolerance | ±10% | Critical for high-speed signal integrity.IPC-2141 |
| Operating Temperature | -40–85 °C | Extended range for industrial environments.IEC 60068-2-1/2 |
| Storage Temperature | -55–125 °C | Survives harsh shipping and storage conditions.IEC 60068-2-1/2 |
| Humidity | 5–95 % RH | Non-condensing; condensation may cause shorts.IEC 60068-2-78 |
| Input Voltage | 12 ±5% V DC | Typical backplane power; other voltages available.ATX |
| Current Capacity | 10–30 A | Per power pin; depends on copper weight and connector rating.IPC-2221 |
| Dielectric Withstanding Voltage | 500 V DC | Minimum isolation between circuits.IPC-6012 |
| Insulation Resistance | ≥100 MΩ | Measured at 500 V DC; lower may indicate contamination.IPC-6012 |
| Surface Finish | ENIG | Immersion gold over nickel; other finishes available.IPC-4552 |
| Weight | 0.5–1.5 kg | Depends on board size and layer count. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | N/A (non-pressure application) |
| other spec: | Humidity: 10% to 90% non-condensing, Vibration: 5-500 Hz at 0.5G, Shock: 50G for 11ms |
| temperature: | 0°C to 70°C (operational), -40°C to 85°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
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The standard size is 304.8 × 304.8 mm per the ATX form factor, but other sizes are available. Always confirm the exact dimensions for your specific model with the manufacturer.
The operating temperature range is -40 to 85 °C, with storage from -55 to 125 °C, per IEC 60068-2-1/2. Verify these limits for your application.
The surface finish is ENIG (electroless nickel immersion gold), per IPC-4552. Other finishes may be available; check with the supplier.
Relevant standards include IPC-6012 for performance, IPC-2221 for design, IPC-2141 for impedance, and IEC 60068 for environmental testing. These are reference standards; compliance must be verified with the manufacturer.
This component is essential for the following industrial systems and equipment:
Commonly used trade names and technical identifiers for Motherboard/Backplane.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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