Network Infrastructure Equipment
View system integration details
Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Motherboard/Backplane used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Motherboard/Backplane is characterized by the integration of CPU Socket and Memory Slots. In industrial production environments, manufacturers listed on CNFX commonly emphasize FR-4 fiberglass epoxy laminate construction to support stable, high-cycle operation across diverse manufacturing scenarios.
A printed circuit board that serves as the main structural and electrical backbone in network infrastructure equipment, providing connectivity between various electronic components and expansion cards.
Technical details and manufacturing context for Motherboard/Backplane
Commonly used trade names and technical identifiers for Motherboard/Backplane.
This component is essential for the following industrial systems and equipment:
| pressure: | N/A (non-pressure application) |
| other spec: | Humidity: 10% to 90% non-condensing, Vibration: 5-500 Hz at 0.5G, Shock: 50G for 11ms |
| temperature: | 0°C to 70°C (operational), -40°C to 85°C (storage) |
Verified manufacturers with capability to produce this product in China
✓ 92% Supplier Capability Match Found
Authentic performance reports from verified B2B procurement managers.
"As a professional in the Computer, Electronic and Optical Product Manufacturing sector, I confirm this Motherboard/Backplane meets all ISO standards."
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The Motherboard/Backplane arrived with full certification. (Delivery took slightly longer than expected, but technical support was excellent.)"
"Great transparency on the Motherboard/Backplane components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”
This motherboard/backplane is constructed using FR-4 fiberglass epoxy laminate for durability, copper foil for electrical conductivity, solder mask for protection, and gold-plated connectors for reliable connectivity in network infrastructure applications.
It features multiple PCIe slots, memory slots, and a CPU socket to support various expansion cards and components, making it ideal for scalable network infrastructure equipment in computer and electronic manufacturing.
With its robust FR-4 construction, integrated network controller, and gold-plated connectors, it ensures stable electrical connections and long-term performance in demanding electronic and optical product manufacturing environments.
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