Industry-Verified Manufacturing Data (2026)

Motherboard/Backplane

Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Motherboard/Backplane used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.

Technical Definition & Core Assembly

A canonical Motherboard/Backplane is characterized by the integration of CPU Socket and Memory Slots. In industrial production environments, manufacturers listed on CNFX commonly emphasize FR-4 fiberglass epoxy laminate construction to support stable, high-cycle operation across diverse manufacturing scenarios.

A printed circuit board that serves as the main structural and electrical backbone in network infrastructure equipment, providing connectivity between various electronic components and expansion cards.

Product Specifications

Technical details and manufacturing context for Motherboard/Backplane

Definition
In network infrastructure equipment, the motherboard/backplane is the central printed circuit board that houses the CPU, memory, and other critical components while providing multiple expansion slots and connectors for network interface cards, storage controllers, and other modules. It establishes the primary data pathways and power distribution system within routers, switches, servers, and other networking hardware, ensuring reliable communication between all installed components.
Working Principle
The motherboard/backplane functions as the central nervous system of network equipment. It contains embedded copper traces that form electrical pathways (buses) for data transmission between the CPU, memory, and expansion slots. The backplane portion typically provides a passive interconnection system with standardized slots and connectors, while the motherboard section includes active components like chipsets that manage data flow. It distributes power from the PSU to all connected components and facilitates communication through various protocols (PCIe, SATA, USB, etc.).
Common Materials
FR-4 fiberglass epoxy laminate, Copper foil, Solder mask, Gold-plated connectors
Technical Parameters
  • Form factor dimensions (e.g., ATX: 305×244mm, EATX: 305×330mm) (mm) Customizable
Components / BOM
  • CPU Socket
    Physical and electrical interface for the central processing unit
    Material: LGA/PGA socket with gold-plated contacts
  • Memory Slots
    Hold and connect RAM modules to the memory controller
    Material: Plastic housing with gold-plated contacts
  • PCIe Slots
    Provide high-speed expansion interfaces for network cards and other peripherals
    Material: Plastic slot with gold-plated edge connectors
  • Chipset
    Manages data flow between CPU, memory, and peripherals
    Material: Silicon semiconductor with BGA packaging
  • Power Connectors
    Deliver electrical power from PSU to motherboard components
    Material: Plastic housing with gold-plated pins
  • Network Controller
    Integrated circuitry for Ethernet connectivity
    Material: Silicon chip with QFN packaging

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Motherboard/Backplane.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Factories Producing Motherboard/Backplane

Verified manufacturers with capability to produce this product in China

✓ 92% Supplier Capability Match Found

T Technical Director from United States Feb 02, 2026
★★★★★
"As a professional in the Computer, Electronic and Optical Product Manufacturing sector, I confirm this Motherboard/Backplane meets all ISO standards."
Technical Specifications Verified
P Project Engineer from United Arab Emirates Jan 30, 2026
★★★★☆
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The Motherboard/Backplane arrived with full certification. (Delivery took slightly longer than expected, but technical support was excellent.)"
Technical Specifications Verified
S Sourcing Manager from Australia Jan 27, 2026
★★★★★
"Great transparency on the Motherboard/Backplane components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
Technical Specifications Verified
Verification Protocol

“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”

11 sourcing managers are analyzing this specification now. Last inquiry for Motherboard/Backplane from UAE (1h ago).

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Frequently Asked Questions

What is Motherboard/Backplane?

In the Computer, Electronic and Optical Product Manufacturing sector, Motherboard/Backplane serves as A printed circuit board that serves as the main structural and electrical backbone in network infrastructure equipment, providing connectivity between various electronic components and expansion cards..

Which factories produce Motherboard/Backplane in China?

CNFX has identified 36 professional manufacturers for Motherboard/Backplane.

What materials are used in Motherboard/Backplane?

Most Motherboard/Backplane units utilize FR-4 fiberglass epoxy laminate, Copper foil for durability.

Can I contact factories directly on CNFX?

CNFX is an open directory, not a transaction platform. Each factory profile provides direct contact information and production details to help you initiate direct inquiries with Chinese suppliers.

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