Surface Mount Technology (SMT) Line
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This page explains how Pick-and-Place Machine is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
An automated robotic system that precisely picks up components and places them onto printed circuit boards or other substrates during electronic assembly.
Technical details and manufacturing context for Pick-and-Place Machine
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Placement SpeedRequired | 15000–45000 cph | Maximum number of components placed per hour under optimal conditions |
| Placement AccuracyRequired | ±0.05 mm | Positional accuracy of component placement relative to target coordinates |
| RepeatabilityRequired | ±0.02 mm | Consistency of placement position across multiple cycles |
| Minimum Component SizeRequired | 0.4×0.2 mm | Smallest component dimension the machine can handle |
| Maximum Component SizeRequired | 50×50 mm | Largest component dimension the machine can handle |
| PCB Size RangeRequired | 50×50–510×460 mm | Minimum and maximum dimensions of printed circuit boards the machine can process |
| Number of FeedersRequired | 80–120 units | Maximum number of component feeders that can be installed simultaneously |
| Operating Pressure | 0.5–0.7 MPa | Compressed air, dry and clean |
| Power Supply | 220 ±10% V AC | 50/60 Hz, 3-phase |
| Power Consumption | 2.5–4.5 kW | Depends on configuration |
| Operating Temperature | 15–35 °C | Non-condensing |
| Humidity Range | 30–80 % RH | Non-condensing |
| Ingress Protection | IP54 | Dust and splash water protectedIEC 60529 |
| Machine Weight | 1500–2500 kg | Without feeders and options |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| speed: | 10,000-100,000 components per hour |
| accuracy: | ±0.01-0.05 mm placement accuracy |
| pressure: | N/A (pneumatic systems typically 0.4-0.7 MPa) |
| board size: | Up to 510×460 mm standard, larger available |
| temperature: | 15-35°C (operating environment) |
| component size: | 0.3 mm² to 150 mm² |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
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The placement speed is typically in the range of 15,000 to 45,000 components per hour under optimal conditions. The actual speed depends on the specific model, component types, and board layout. Verify the rated speed with the manufacturer for your intended application.
Placement accuracy is typically ±0.05 mm, and repeatability is ±0.02 mm. These values indicate the positional accuracy relative to target coordinates and the consistency across multiple cycles. Confirm these specifications with the supplier for the exact model.
The machine can handle components ranging from 0.4×0.2 mm (minimum) to 50×50 mm (maximum). This range covers common SMD components such as resistors, capacitors, and larger ICs. Always check the feeder and nozzle compatibility for specific component types.
The machine requires a clean, dry compressed air supply at 0.5–0.7 MPa, and a 220 V AC (±10%) power supply at 50/60 Hz. It operates in a temperature range of 15–35 °C and humidity of 30–80% RH (non-condensing). The ingress protection rating is IP54 per IEC 60529. Ensure your facility meets these requirements before installation.
This component is essential for the following industrial systems and equipment:
Commonly used trade names and technical identifiers for Pick-and-Place Machine.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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