Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Pick-and-Place Machine used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Pick-and-Place Machine is characterized by the integration of Robotic Placement Head and Vision System. In industrial production environments, manufacturers listed on CNFX commonly emphasize Aluminum Alloy construction to support stable, high-cycle operation across diverse manufacturing scenarios.
An automated robotic system that precisely picks up components and places them onto printed circuit boards or other substrates during electronic assembly.
Technical details and manufacturing context for Pick-and-Place Machine
Commonly used trade names and technical identifiers for Pick-and-Place Machine.
| speed: | 10,000-100,000 components per hour |
| accuracy: | ±0.01-0.05 mm placement accuracy |
| pressure: | N/A (pneumatic systems typically 0.4-0.7 MPa) |
| board size: | Up to 510×460 mm standard, larger available |
| temperature: | 15-35°C (operating environment) |
| component size: | 0.3 mm² to 150 mm² |
Verified manufacturers with capability to produce this product in China
✓ 93% Supplier Capability Match Found
Authentic performance reports from verified B2B procurement managers.
"Impressive build quality. Especially the Placement Speed (cph) is very stable during long-term operation."
"As a professional in the Computer, Electronic and Optical Product Manufacturing sector, I confirm this Pick-and-Place Machine meets all ISO standards. (Delivery took slightly longer than expected, but technical support was excellent.)"
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The Pick-and-Place Machine arrived with full certification."
“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”
Our pick-and-place machine offers placement accuracy within ±0.05mm, ensuring precise component positioning for high-density PCB assembly applications.
The system supports up to 120 component feeders, allowing for flexible production setups with multiple component types and sizes simultaneously.
This machine handles components ranging from 0.3mm microchips to 150mm large components, including QFPs, BGAs, connectors, and passive components for comprehensive assembly capabilities.
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