Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Pick-and-Place Machine used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Pick-and-Place Machine is characterized by the integration of Robotic Placement Head and Vision System. In industrial production environments, manufacturers listed on CNFX commonly emphasize Aluminum Alloy construction to support stable, high-cycle operation across diverse manufacturing scenarios.
An automated robotic system that precisely picks up components and places them onto printed circuit boards or other substrates during electronic assembly.
Technical details and manufacturing context for Pick-and-Place Machine
Commonly used trade names and technical identifiers for Pick-and-Place Machine.
This component is essential for the following industrial systems and equipment:
| speed: | 10,000-100,000 components per hour |
| accuracy: | ±0.01-0.05 mm placement accuracy |
| pressure: | N/A (pneumatic systems typically 0.4-0.7 MPa) |
| board size: | Up to 510×460 mm standard, larger available |
| temperature: | 15-35°C (operating environment) |
| component size: | 0.3 mm² to 150 mm² |
Manufacturer profiles with relevant production capability in China
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Our pick-and-place machine offers placement accuracy within ±0.05mm, ensuring precise component positioning for high-density PCB assembly applications.
The system supports up to 120 component feeders, allowing for flexible production setups with multiple component types and sizes simultaneously.
This machine handles components ranging from 0.3mm microchips to 150mm large components, including QFPs, BGAs, connectors, and passive components for comprehensive assembly capabilities.
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