Editorial Technical Reference

Network Interface Card (NIC)

This page explains how Network Interface Card (NIC) is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A hardware component that enables a database server to connect to a network and communicate with other devices.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Network Interface Card (NIC)

Definition
A Network Interface Card (NIC) is a hardware component installed in a database server to provide the physical interface for network connectivity. It translates data from the server into electrical signals suitable for transmission over network cables (e.g., Ethernet) or radio waves (for wireless NICs), and vice versa for incoming data. Within a database server, the NIC facilitates client connections, data replication between servers, backup operations to network storage, and cluster communication, making it essential for data availability and distributed processing.

Typical NICs for database servers support data rates from 1 to 100 Gbps, with bus interfaces ranging from PCIe 3.0 to 4.0. They may have 1 to 4 ports, with connector types from SFP+ to QSFP28. Operating temperature ranges from 0 to 70 °C, storage temperature from -40 to 85 °C, and operating humidity from 10 to 90% RH (non-condensing). Power consumption varies from 5 to 25 W. Mean time between failures (MTBF) is typically 50,000 to 100,000 hours. Physical dimensions range from 120 to 180 mm in length, and weight from 100 to 300 g. Compliance references include RoHS, CE, and FCC.

These values are reference ranges; actual specifications depend on the specific model and application. Always verify model-specific parameters and standards with the legal manufacturer or supplier before procurement or integration.
Working Principle
The NIC operates by receiving data packets from the server's CPU via the system bus (e.g., PCIe). Its controller chip processes these packets, adding necessary physical layer framing and error-checking data (like CRC). For wired Ethernet NICs, a PHY (physical layer) chip then converts the digital signals into analog signals for transmission over the twisted-pair cable. For reception, it reverses the process: it receives analog signals, converts them back to digital, checks for errors, strips the physical layer data, and passes the resulting data packets to the server's operating system via the bus.
Common Materials
Silicon (for integrated circuits), Fiberglass (for PCB substrate), Copper (for traces and connectors), Plastic (for housing)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Data Rate1–100 GbpsHigher rates require PCIe 3.0 or aboveIEEE 802.3
Bus InterfacePCIe 3.0–4.0 x8x8 lanes for 100G, x4 for 25GPCI Express Base Specification
Ports1–4 portsMore ports increase throughput but require more PCIe lanes
Connector TypeSFP+–QSFP28QSFP28 for 100G, SFP+ for 10GSFF-8431, SFF-8665
Operating Temperature0–70 °CIndustrial grade -40–85 available
Storage Temperature-40–85 °CNon-condensing environment
Operating Humidity10–90 % RHNon-condensing
Power Consumption5–25 WDepends on data rate and port count
MTBF50000–100000 hoursHigher is better for server reliabilityTelcordia SR-332
Dimensions120–180 mmLength of the card, varies with bracket type
Weight100–300 gIncluding bracket
ComplianceRoHS, CE, FCCRequired for market accessRoHS 2011/65/EU, CE, FCC Part 15

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Controller Chip Part
    The main processor on the NIC that manages data packet handling, protocol offloading (e.g., TCP/IP), and communication with the server's bus.
    Material: silicon
  • PHY (Physical Layer) Chip
    Handles the analog signal modulation/demodulation for wired connections, implementing the electrical specifications of the Ethernet standard.
    Material: silicon
  • Connector (e.g., RJ45 Port) Part
    Provides the physical socket for inserting a network cable to establish a wired connection.
    Material: copper alloy, plastic
  • PCB (Printed Circuit Board) Part
    The base board that holds and electrically connects all other components of the NIC.
    Material: fiberglass, copper

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (electronic component)
other spec: Humidity: 10% to 90% non-condensing, Power: 3.3V/5V/12V depending on slot type
temperature: 0°C to 70°C (operating), -40°C to 85°C (storage)
Media Compatibility
✓ Ethernet networks (copper/fiber) ✓ TCP/IP protocol stacks ✓ Virtualization environments (VMware/Hyper-V)
Unsuitable: High EMI/RFI industrial environments without shielding
Sizing Data Required
  • Network bandwidth requirement (1G/10G/25G/100G)
  • Server PCIe slot type and generation (PCIe 3.0/4.0/5.0)
  • Network topology and redundancy needs (single/dual port, teaming)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal degradation
Cause: Overheating due to poor ventilation, dust accumulation, or excessive ambient temperature causing solder joint failure, component warping, or semiconductor breakdown.
Electrical overstress
Cause: Voltage spikes, electrostatic discharge (ESD), or power surges damaging sensitive microelectronics, often from improper handling, faulty power supplies, or inadequate grounding.
Maintenance Indicators
  • Intermittent or complete loss of network connectivity despite functional cables and switches
  • Abnormal heat emission from the NIC or adjacent motherboard area, often detectable by touch or thermal imaging
Engineering Tips
  • Implement regular cleaning of server/device internals to prevent dust buildup that impedes heat dissipation, using compressed air or anti-static vacuums.
  • Ensure proper grounding and use surge protectors or uninterruptible power supplies (UPS) to shield against electrical transients and maintain stable voltage.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO/IEC 11801: Information technology - Generic cabling for customer premises ANSI/TIA-568-C.2: Balanced Twisted-Pair Telecommunications Cabling and Components Standards CE Marking: Compliance with EU EMC Directive 2014/30/EU and Low Voltage Directive 2014/35/EU

Quoted from the published standard.

Manufacturing Precision
  • Connector Pin Alignment: +/-0.1mm
  • PCB Trace Width/Spacing: +/-10% of nominal design value
Quality Inspection
  • Bit Error Rate Test (BERT) for signal integrity verification
  • Electromagnetic Compatibility (EMC) Testing for radiated/conducted emissions

Manufacturers of Network Interface Card (NIC)

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Frequently Asked Questions

What data rates are typical for a database server NIC?

Typical data rates range from 1 to 100 Gbps, depending on the model and network infrastructure. Higher rates require PCIe 3.0 or above. Always verify the specific NIC's supported rates with the manufacturer.

How many ports can a NIC have?

NICs commonly have 1 to 4 ports. More ports increase throughput but require more PCIe lanes. The exact port count and lane requirements should be confirmed for the specific model.

What connector types are used?

Connector types range from SFP+ (for 10G) to QSFP28 (for 100G). The appropriate connector depends on the data rate and cable type. Verify compatibility with your network equipment.

What environmental conditions are specified?

Operating temperature is typically 0 to 70 °C, storage temperature -40 to 85 °C, and operating humidity 10 to 90% RH (non-condensing). Industrial-grade versions may offer wider ranges. Confirm with the manufacturer for your application.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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