This page explains how Programmable Interconnect is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Configurable routing network within a Processing Logic Array that enables dynamic connections between logic blocks and I/O elements.
Technical details and manufacturing context for Programmable Interconnect
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Number of Logic Elements | 1000–100000 LE | Determines logic capacity |
| Number of I/O Pins | 100–2000 pins | Interface to external circuitry |
| Maximum Operating Frequency | 100–500 MHz | Higher speeds require careful layout |
| Routing Delay | 0.5–5 ns | Affects timing closure |
| Supply Voltage | 1.2–3.3 V | Core and I/O voltage levels |
| Power Consumption | 0.5–10 W | Thermal design consideration |
| Operating Temperature Range | -40–85 °C | Industrial gradeIEC 60068-2-1/2 |
| ESD Tolerance | 2000–8000 V | HBM modelIEC 61000-4-2 |
| Package Footprint | 10–40 mm² | Area on PCB |
| Configuration Memory | 1–100 Mbit | For bitstream storage |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| voltage: | 1.2V to 3.3V |
| temperature: | -40°C to +125°C |
| signal frequency: | DC to 500 MHz |
| reconfiguration speed: | <100 ns per connection |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Programmable Interconnect.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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A programmable interconnect is used in Processing Logic Arrays (such as FPGAs and CPLDs) to provide reconfigurable electrical pathways between logic elements, memory blocks, and I/O interfaces. It allows designers to customize the connectivity of the array after manufacturing, enabling flexible implementation of digital circuits.
The interconnect is programmed by loading configuration data into memory cells that control the state of configurable switches. This data is typically stored in a configuration bitstream and can be loaded at power-up or during operation, depending on the device architecture.
Key parameters include the number of logic elements, number of I/O pins, maximum operating frequency, routing delay, supply voltage, power consumption, operating temperature range, ESD tolerance, package footprint, and configuration memory. These values are reference ranges and must be verified for the specific model and application.
The operating temperature range is referenced to IEC 60068-2-1/2, and ESD tolerance is referenced to IEC 61000-4-2. These standards are procurement references; actual compliance must be confirmed with the legal manufacturer or supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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