Reflow Oven for PCB Assembly | Thermal Processing Equipment

Product Specifications

Technical details and manufacturing context for Reflow Oven

Definition

A reflow oven is a critical component within an automated printed circuit board (PCB) assembly line. It precisely applies controlled heat to melt solder paste that has been deposited on PCB pads, creating reliable solder joints between surface-mount devices (SMDs) and the circuit board substrate. The process follows a specific temperature profile to ensure proper metallurgical bonding without damaging sensitive electronic components. The oven typically consists of multiple heating zones, cooling zones, and a conveyor system that transports the PCBs through the machine. The heating zones are usually 8 to 12 in number, allowing fine temperature profiling, while cooling zones range from 2 to 4 to prevent solder joint defects. The conveyor width accommodates PCBs from 300 to 600 mm, and conveyor speed is adjustable from 0.5 to 2.5 m/min to match the solder paste profile. The temperature range is 25 to 350 °C, with peak reflow temperatures typically 245 to 260 °C, and temperature uniformity is maintained within ±3 °C for consistent solder joint quality. Heating power ranges from 20 to 60 kW, and the machine operates on a three-phase 380 V AC supply (±10%, 50/60 Hz). Air pressure of 0.5 to 0.8 MPa is required for pneumatic components and cooling, and exhaust flow of 10 to 20 m³/min removes fumes and maintains air quality. Machine dimensions vary from 5000 to 12000 mm in length, 1200 to 1800 mm in width, and 1500 to 2000 mm in height, with weights from 2000 to 5000 kg. Operating humidity should be 30 to 80% RH (non-condensing), and noise level is ≤70 dB(A). Materials used include stainless steel, aluminum, ceramic heating elements, quartz heating tubes, and insulation materials. These specifications are typical ranges; actual values must be confirmed with the manufacturer for specific models.

Working Principle

The reflow oven transports PCBs through multiple temperature-controlled zones (preheat, soak, reflow, cooling) using a conveyor system. It heats the assembly according to a programmed thermal profile, causing the solder paste to melt (reflow) and form intermetallic bonds between component leads and PCB pads, then cools the assembly to solidify the solder joints. The conveyor speed and zone temperatures are adjustable to match the solder paste requirements. Proper profiling ensures reliable joints without thermal damage to components.

Common Materials

Stainless steel, Aluminum, Ceramic heating elements, Quartz heating tubes, Insulation materials

Technical Parameters

Parameter	Typical range	Notes & selection driver
Heating Zones	8–12 zones	More zones allow finer temperature profiling.
Cooling Zones	2–4 zones	Adequate cooling prevents solder joint defects.
Conveyor Width	300–600 mm	Must accommodate PCB dimensions.
Conveyor Speed	0.5–2.5 m/min	Adjustable to match solder paste profile.
Temperature Range	25–350 °C	Peak reflow temperature typically 245–260 °C.
Temperature Uniformity	±3 °C	Critical for consistent solder joint quality.
Heating Power	20–60 kW	Determines heating capacity and energy consumption.
Power Supply	380 ±10% V AC	Three-phase, 50/60 Hz.
Air Pressure	0.5–0.8 MPa	For pneumatic components and cooling.
Exhaust Flow	10–20 m³/min	Removes fumes and maintains air quality.
Machine Dimensions	5000–12000 × 1200–1800 × 1500–2000 mm	Length × width × height; footprint affects layout.
Weight	2000–5000 kg	Heavier machines offer better thermal stability.
Operating Humidity	30–80 % RH	Non-condensing; high humidity can affect solder paste.
Noise Level	≤70 dB(A)	Complies with typical workplace safety limits.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Oven Body
The oven enclosure itself: contains the heated volume and retains the insulation.
Conveyor System
Transports PCBs through temperature zones at controlled speed
Heating Elements
Generate and maintain precise temperatures in each zone
Temperature Sensors
Monitor and provide feedback for temperature control
Control System
Programs and regulates thermal profiles and conveyor parameters
Cooling System
Rapidly cools PCBs after reflow to solidify solder joints

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Surface Mount Technology (SMT) Line

View system integration details

Manufacturers of Reflow Oven

12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

CHARMHIGH TECHNOLOGY LIMITED

Changsha, Hunan, CN

Also makes: Wave Soldering Machine, Automated Surface-Mount Technology Assembly Line, Automated Printed Circuit Board Assembly Line and 6 more