Reflow oven

01

Start from the paste's profile window

Indium5.8LS-3 data sheet Form 99438 R1 gives SAC305 reference recommendations: average ambient-to-peak ramp 1.0–1.5 °C/s, optional soak 20–60 s at 140–160 °C, time above liquidus 45–60 s, peak 230–260 °C and cooling 2–6 °C/s. The average ramp is expressly different from maximum rising slope. [1]

The sheet also lists separate acceptable ranges. Its recommendations need adjustment for the assembly; start with a linear profile and evaluate an optional soak against the actual process. Use the current paste specification and measured board profile for qualification. [1]

Supply paste/alloy, board construction, component limits, panel size and spacing, production rate and atmosphere requirements together.

02

Respect the strictest component

Advanced Energy’s linked extract recommends a SAC305 profile with peak 240–245 °C, ramp-up at most 3 °C/s, ramp-down at most 4 °C/s and a 90 s limit above 217 °C. These are the module reference’s conditions, not universal oven limits. [2]

The same extract instructs measurement at module block pins. Its filename contains “lga50d”, while the body refers to LGA80D modules; confirm the exact module’s current documentation before applying that profile. Full IPC/JEDEC J-STD-020 clauses were not accessed. [2]

Agree thermocouple locations at thermally demanding and heat-sensitive parts, and qualify repeat boards at the intended production loading. Keep measured joint peaks separate from zone setpoints.

03

Upper and lower heating counts, conveyor speed and atmosphere

NeoDen’s IN12C listing identifies six upper and six lower heating zones and 50–600 mm/min conveyor speed. Request the drawing that maps those zones along the board path. Its listed room-temperature-to-300 °C range is an equipment specification, not a prescribed solder-joint peak. [3]

The same page gives 15 mm underside clearance in its summary and 22 mm in the specification table. Obtain the drawing for the supplied revision before accepting a double-sided assembly envelope. [3]

Chuxin lists nitrogen hot-air and vacuum-reflow equipment; I.C.T lists Lyra and other reflow families. Specify oxygen monitoring, nitrogen consumption and any vacuum stage for the actual configuration. [4] [5]

04

Compact reflow equipment and in-line soldering configurations

Compare continuous in-line transport with desktop/batch handling before selecting the loading and qualification method. I.C.T and Chuxin publish different reflow configurations. [5] [4]

Identify who supplies the oven, loader/unloader, profiling equipment and exhaust interface. Validate the proposed arrangement with the board family and production rate in the enquiry.

05

Heated enclosure, board transport and temperature feedback

Keep enclosure insulation, heat generation, temperature sensing and board profiling identifiable. A controller’s zone reading and a thermocouple trace on the assembly serve different purposes.

06

Board envelope, recipe capability and factory utilities

Obtain model values for board transport and services alongside the qualified recipe. Paste-profile temperatures and cooling recommendations belong to the assembly process, not the oven’s equipment-rating fields.

07

Send the paste, boards and line data together

Paste it into your enquiry below or into an email to a maker, then replace every bracket.

Paste: [product; alloy; data-sheet profile]
Boards: [size; thickness; copper; heaviest and lightest assemblies; panel or single]
Components: [least heat-tolerant parts and their limits; largest thermal masses; BGAs]
Line: [boards per hour; board length; double-sided reflow]
Atmosphere: [air, nitrogen with O2 limit, or vacuum]
Utilities: [power; compressed air; nitrogen; exhaust]
Documents: [thermocouple profile on your board; uniformity test; manuals]

See manufacturer records Send an enquiry through CNFX