Reflow Oven Module for 5G PCB Soldering

Product Specifications

Technical details and manufacturing context for Reflow Oven Module

Definition

The Reflow Oven Module is a critical component within the Modular 5G Base Station Production System, responsible for the precise thermal processing of assembled PCBs. It melts solder paste to form permanent electrical and mechanical connections between surface-mount devices (SMDs) and the PCB substrate, ensuring the reliability and performance of 5G radio units and control boards. The module transports PCBs on a conveyor through multiple controlled heating zones (preheat, soak, reflow, cooling). It uses heaters (infrared, convection, or vapor phase) to raise the board temperature according to a specific thermal profile, melting the solder paste without damaging sensitive components, then cools the assembly to solidify the joints. Key parameters include 8–12 heating zones, 2–4 cooling zones, a maximum conveyor speed of 1500–2500 mm/min, a conveyor width of 300–500 mm, a temperature range of 25–350°C, temperature uniformity of ±2°C, heating power of 30–60 kW, supply voltage of 380 V AC ±10% (three-phase, 50/60 Hz), nitrogen consumption of 15–30 m³/h (when using N2 for inert atmosphere), exhaust flow rate of 500–1000 m³/h, machine dimensions of 6000–10000 × 1200–1500 × 1500–1800 mm (L×W×H), and weight of 2000–4000 kg. Materials on file include stainless steel (housing/conveyor), ceramic insulators, quartz heating elements, and high-temperature silicone seals. These values are directory reference ranges and must be confirmed for the actual model and application with the legal manufacturer or supplier. The module is designed for integration into the production line, with interfaces for conveyor control, power supply, exhaust, and optional nitrogen. Verification questions should address thermal profile accuracy, uniformity, and compliance with applicable standards. Maintenance signals include temperature drift, uneven heating, or excessive exhaust flow. Failure boundaries include loss of temperature control, conveyor jams, or seal degradation.

Working Principle

The module transports PCBs on a conveyor through multiple controlled heating zones (preheat, soak, reflow, cooling). It uses heaters (infrared, convection, or vapor phase) to raise the board temperature according to a specific thermal profile, melting the solder paste without damaging sensitive components, then cools the assembly to solidify the joints. The conveyor speed and zone temperatures are set to achieve the required thermal profile, with temperature uniformity maintained across the PCB surface. The module may use nitrogen to create an inert atmosphere, reducing oxidation. Exhaust systems remove fumes generated during soldering.

Common Materials

Stainless Steel (housing/conveyor), Ceramic Insulators, Quartz Heating Elements, High-Temperature Silicone Seals

Technical Parameters

Parameter	Typical range	Notes & selection driver
Heating Zone Count	8–12 zones	More zones allow finer thermal profile control
Cooling Zone Count	2–4 zones	Critical for solder joint solidification
Max Conveyor Speed	1500–2500 mm/min	Determines throughput
Conveyor Width	300–500 mm	Must accommodate PCB size
Temperature Range	25–350 °C	Peak reflow temperature typically 245–260°C
Temperature Uniformity	±2 °C	Across PCB surface for consistent soldering
Heating Power	30–60 kW	Total installed heating capacity
Supply Voltage	380 ±10% V AC	Three-phase, 50/60 Hz
Nitrogen Consumption	15–30 m³/h	When using N2 for inert atmosphere
Exhaust Flow Rate	500–1000 m³/h	For fume extraction
Machine Dimensions (L×W×H)	6000–10000 × 1200–1500 × 1500–1800 mm	Footprint for floor planning
Weight	2000–4000 kg	Affects installation and floor loading

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Heating Zone
Provides controlled radiant or convective heat to raise PCB temperature according to the thermal profile.

Material: Stainless Steel housing with ceramic-insulated heating elements
Conveyor System
Transports PCBs smoothly and consistently through all zones of the oven module.

Material: Stainless Steel mesh or rail
Cooling Zone
Rapidly cools the PCB after reflow to solidify solder joints and minimize thermal stress on components.

Material: Aluminum heat sinks with forced air fans
Control Panel
Interface for setting and monitoring temperature profiles, conveyor speed, and system status.

Material: Stainless Steel enclosure with touchscreen
Exhaust System
Draws off the flux fumes given off during reflow.
Nitrogen Inerting System Optional
Fills the tunnel with nitrogen to hold oxidation down, on the versions that use it.

Manufacturers of Reflow Oven Module

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Frequently Asked Questions

What is the typical temperature range for the reflow process?

The directory lists a temperature range of 25–350°C, with peak reflow temperature typically 245–260°C. However, the exact profile depends on the solder paste and components; verify with the manufacturer.

How many heating zones does the module have?

The module typically has 8–12 heating zones, allowing finer control of the thermal profile. Confirm the exact count for the specific model.

What is the maximum conveyor speed?

The maximum conveyor speed is listed as 1500–2500 mm/min, which determines throughput. Actual speed settings depend on the PCB design and thermal requirements.

Does the module support nitrogen atmosphere?

Yes, it can use nitrogen for an inert atmosphere, with consumption of 15–30 m³/h. This reduces oxidation during soldering. Verify nitrogen capability with the supplier.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric to 5 kPa (vacuum-capable for void reduction)
other spec:	Heating rate: 1-4°C/sec, Cooling rate: 1-6°C/sec, Belt width: 300-500 mm, Nitrogen atmosphere: O2 < 1000 ppm
temperature:	Ambient to 300°C (typical reflow profile: 150-250°C)

Reflow Oven Module

Product Specifications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards