Signal Processing Circuit Board for Optical Positioning Sensors

Product Specifications

Technical details and manufacturing context for Signal Processing Circuit Board

Definition

The Signal Processing Circuit Board is a component used in optical positioning systems. It receives low-level analog signals from photodetectors, applies signal conditioning such as amplification, filtering, and noise reduction, and converts the conditioned signals to digital format using analog-to-digital converters (ADCs). Embedded algorithms then process the digital data to calculate precise position coordinates, which are transmitted to the main controller for system control and feedback.

This board is designed for integration into optical positioning sensors and supports 4 to 16 input signal channels. It offers a sampling rate of 1 to 10 kSPS per channel, with higher rates suitable for dynamic applications. The ADC resolution ranges from 12 to 24 bits, enabling precision positioning. The minimum signal-to-noise ratio is 80 dB, ensuring reliable data. The board operates on a supply voltage of 5 to 24 V DC and has a maximum power dissipation of 5 W. It is rated for an industrial temperature range of -40 to 85 °C, with a storage temperature range of -55 to 125 °C, and operates in non-condensing humidity of 5 to 95% RH. The ingress protection rating depends on the enclosure and ranges from IP40 to IP65 per IEC 60529.

The board is manufactured on FR-4 glass epoxy laminate (per IPC-4101) with a standard thickness of 1.6 mm (per IPC-2221). It follows the Eurocard form factor with dimensions of 100×160 mm and weighs up to 200 g without an enclosure. Materials include FR-4 PCB substrate, copper traces, and surface-mount components such as resistors, capacitors, and integrated circuits.

All listed parameters are reference ranges and must be verified with the legal manufacturer or supplier for the specific model and application. Standards mentioned are procurement references and do not imply certification or compliance of any particular product.

Working Principle

The board receives low-level analog signals from optical sensor elements. It applies signal conditioning including amplification, filtering, and noise reduction. The conditioned signals are converted to digital format via ADCs. Embedded algorithms process the digital data to calculate position coordinates. The processed data is then transmitted to the main controller.

Common Materials

FR-4 PCB substrate, Copper traces, SMD components (resistors, capacitors, ICs)

Technical Parameters

Parameter	Typical range	Notes & selection driver
Input Signal Channels	4–16 channels	Number of optical sensor inputs supported
Sampling Rate	1–10 kSPS	Per channel; higher rates for dynamic applications
Resolution	12–24 bit	ADC resolution; higher for precision positioning
Signal-to-Noise Ratio	≥80 dB	Minimum SNR for reliable data
Input Voltage	5–24 V DC	Supply voltage range
Power Consumption	≤5 W	Maximum power dissipation
Operating Temperature	-40–85 °C	Industrial temperature range
Storage Temperature	-55–125 °C	Non-operating storage range
Humidity	5–95 % RH	Non-condensing
Ingress Protection	IP40–IP65	Depends on enclosureIEC 60529
Board Material	FR-4	Glass epoxy laminateIPC-4101
Board Thickness	1.6 mm	Standard thicknessIPC-2221
Dimensions	100×160 mm	Eurocard form factor
Weight	≤200 g	Without enclosure

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Circuit Board
The board itself: the substrate and copper traces that carry power and signals between the parts on it.
Analog Front-End
Amplifies and filters raw sensor signals

Material: Operational amplifiers, passive components
ADC Module
Converts analog signals to digital format

Material: Analog-to-digital converter IC
Digital Signal Processor
Executes positioning algorithms on digitized data

Material: Microcontroller or DSP chip
Power Regulation Circuit
Provides stable power to all components

Material: Voltage regulators, capacitors

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Optical Positioning Sensor

View system integration details

Encoder (Servo)

View system integration details

Manufacturers of Signal Processing Circuit Board

Manufacturer profiles associated with Signal Processing Circuit Board.

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Frequently Asked Questions

What is the function of the Signal Processing Circuit Board?

It receives analog signals from photodetectors, conditions them (amplification, filtering, noise reduction), converts to digital via ADCs, and uses algorithms to calculate position coordinates for output to a controller.

What are the key electrical specifications?

It supports 4-16 input channels, sampling rate 1-10 kSPS per channel, ADC resolution 12-24 bits, minimum SNR 80 dB, input voltage 5-24 V DC, and power consumption up to 5 W.

What environmental conditions can it operate in?

Operating temperature -40 to 85 °C, storage -55 to 125 °C, humidity 5-95% RH non-condensing. Ingress protection depends on enclosure, IP40-IP65 per IEC 60529.

What are the mechanical specifications?

Board material FR-4 (IPC-4101), thickness 1.6 mm (IPC-2221), dimensions 100×160 mm (Eurocard), weight up to 200 g without enclosure.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Standard atmospheric (non-pressurized enclosure)
other spec:	Signal bandwidth: DC to 10 MHz, Power supply: 5V DC ±5%, 500mA max
temperature:	-40°C to +85°C operating, -55°C to +125°C storage

Signal Processing Circuit Board

Product Specifications

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards