Probe Card
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This page explains how Space Transformer is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A critical component in probe cards that redistributes electrical signals from the tester's pitch to the device-under-test's finer pitch.
Technical details and manufacturing context for Space Transformer
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Operating Frequency | 1–10 GHz | Higher frequencies require advanced materials and design. |
| Contact Resistance | ≤50 mΩ | Lower resistance ensures signal integrity. |
| Insulation Resistance | ≥1000 MΩ | High insulation prevents leakage currents. |
| Capacitance | 0.5–2.0 pF | Low capacitance for high-speed signals. |
| Inductance | 0.1–0.5 nH | Low inductance minimizes signal distortion. |
| Operating Temperature | -40–85 °C | Outside this range, performance may degrade. |
| Pitch Range | 50–500 µm | Finer pitch requires higher precision. |
| Planarity | ≤10 µm | Ensures uniform contact across the device. |
| Substrate Material | Al2O3 | Alumina ceramic for high thermal stability. |
| Coefficient of Thermal Expansion | 6–8 ppm/°C | Match to device to minimize stress. |
| Weight | 10–50 g | Affects handling and mounting. |
| Insertion Loss | ≤0.5 dB | Low loss for signal fidelity. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | 0 to 50 psi |
| temperature: | -40°C to +125°C |
| frequency range: | DC to 10 GHz |
| electrical current: | Up to 1A per signal line |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
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It redistributes electrical signals from the larger pitch of the test system's PCB to the finer pitch of the IC pads on the wafer, enabling reliable contact and signal transmission during semiconductor testing.
Typical materials include multilayer ceramic (MLC) or high-performance organic laminate (e.g., BT resin, polyimide) for the substrate, copper for conductive traces, and tungsten or beryllium copper for contact springs.
Reference ranges include operating frequency 1–10 GHz, contact resistance ≤50 mΩ, insulation resistance ≥1000 MΩ, capacitance 0.5–2.0 pF, inductance 0.1–0.5 nH, operating temperature -40 to 85 °C, pitch range 50–500 µm, planarity ≤10 µm, and insertion loss ≤0.5 dB. These must be confirmed for the specific model.
Consider the device's pad pitch, required frequency, thermal environment, and mechanical constraints. Verify that the component's parameters match your requirements, and always consult the manufacturer for model-specific specifications and standards.
This component is essential for the following industrial systems and equipment:
Commonly used trade names and technical identifiers for Space Transformer.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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