Wafer probe cards · Cantilever vs vertical vs MEMS, pad pitch and probe count, parallel test, space transformers, direct dock, test-cell fit
A probe card is the interface between a wafer prober and tester that brings fine probes into contact with the pads or bumps of each die on a wafer, so the dies can be tested electrically before dicing. Ask three things first: the pad or bump layout and pitch, how many dies must be tested in parallel, and the tester and prober interface and electrical performance the test needs.
Cantilever, vertical and MEMS probe cards for wafer-level test, with their PCBs, space transformers and probe heads. Wafer probers, test sockets for packaged parts, and ATE testers are outside this page.
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Nidec SV Probe's Venture cantilever probe cards use epoxy technology for logic testing, from single to multi-die for a variety of test systems, with up to 3,000 points, pad pitches as tight as 35 µm and up to 32 DUTs. Its Trio vertical probe cards target full-array and parallel probing with up to 30,000 probes, flat or pointed tips and build options for high-density, multiple-die and matrix-array layouts, for small pads, copper pillars, micro-bumps and through-silicon vias. It also offers B3 vertical cards as an economical cantilever alternative and MEMSFlex MEMS probes. [1] [2]
Editorial calculation: a cantilever card with 3,000 points spread over 32 DUTs allows about 3,000 ÷ 32 ≈ 94 probes per die, so devices with more pads than that per die, or full-array bumps, point toward vertical technology with its much higher probe count. [2] [1]
Give the supplier the die size and pad or bump map, pitch and pad metallurgy, number of DUTs in parallel, test temperature range, current and frequency requirements, tester and prober model and interface, touchdown life target, and cleaning method.
02
Nidec SV Probe explains that on vertical cards a space transformer (ST) sits between the probe head and the printed circuit board, fanning the probe pitch out to the PCB. It offers wired (WST), modular (MST), multi-layer ceramic (MLC), multi-layer organic (MLO) and multi-site MLO reflow of package substrate options, and MLC with multilayer thin film down to 50 µm pitch, made in-house for shorter lead time. [3]
For direct-dock test cells, it says direct-dock probing allows higher bandwidth, increased pin density and more devices tested in parallel, supporting the move of traditional final test to wafer probe for known-good die, and offers turnkey service from PCB design to probe card assembly. [4] EFPCB, a supplier linked to this page, lists probe card PCBs with hard gold finish. [5]
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Nidec SV Probe, Suzhou Silicon Test System Co., Ltd. and Venture Electronics list probe cards, and Shenzhen Dougte Technology Co., Ltd. lists probe cards with test services; EFPCB, KKPCB, Shenzhen Fastprint Circuit Tech Co., Ltd. and Shenzhen Sunshine Global Circuits Co., Ltd. (SGC) list the probe-card or ATE boards.
Ask any supplier for probe technology and tip shape, minimum pitch and probe count, planarity and alignment accuracy, contact force and resistance, current per probe, electrical bandwidth, temperature range, space transformer type, PCB stack-up and finish, touchdown life, repair service and lead time.
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| Part | Role | Fix in the order |
|---|---|---|
| Probes (cantilever, vertical or MEMS) | Contact the pads or bumps. [1] [2] | Type; tip; count. |
| Probe head | Hold and guide vertical probes. [1] | Layout; pitch. |
| Space transformer | Fan pitch out to the PCB. [3] | MLC, MLO, WST, MST. |
| Probe card PCB | Connect to the tester. [3] [5] | Stack-up; finish. |
| Stiffener and interface | Fit prober and tester. [4] | Direct dock or cable. |
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Nidec publishes probe counts, pitch and space-transformer options; contact resistance, current per pin, leakage, planarity and touchdown life have to come from the quotation itself.
| Field | What it means and published values | Ask the supplier for |
|---|---|---|
| Number of Pins (pins) | e.g. up to 3K cantilever; up to 30K vertical. [2] [1] | Probe count. |
| Pitch (µm) | e.g. 35 µm cantilever; 50 µm MLC/MLTF ST. [2] [3] | Minimum pitch. |
| Contact Resistance (Ω) | Probe-to-pad contact. | Value and stability. |
| Current Capacity per Pin (A) | Probe current rating. | Rating. |
| Bandwidth (GHz) | Direct dock raises bandwidth. [4] | Value. |
| Leakage Current (nA) | Insulation of the card. | Value. |
| Operating Temperature (°C) | Test temperature. | Range. |
| Probe Tip Material | Flat or pointed tips. [1] | Material and shape. |
| Substrate Material | Space transformer: MLC, MLO etc. [3] | Material. |
| Planarity (µm) | Tip height variation. | Value. |
| Probe Life (touchdowns) | Wear life. | Life and repair. |
| Maximum Test Frequency (GHz) | Signal frequency. | Value. |
| Capacitance (pF) | Per path. | Value. |
| Inductance (nH) | Per path. | Value. |
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Paste it into your enquiry below or into an email to a maker, then replace every bracket.
Die: [size; pad or bump map; pitch; metallurgy] Parallelism: [DUTs per touchdown] Test: [temperature; current; frequency] Cell: [tester; prober; direct dock or cable] Life: [touchdowns; cleaning; repair]
Nidec SV Probe, Suzhou Silicon Test System Co., Ltd., Venture Electronics and Shenzhen Dougte Technology Co., Ltd. list probe cards; four PCB makers list probe-card or ATE boards.
Lists cantilever, vertical, direct-dock and MEMS probe cards and space transformers.
Product scope checked 2026-10-11
Lists probe cards and test services.
Product scope checked 2026-10-11
Lists probe card PCBs with hard gold finish among PCB products.
Product scope checked 2026-10-11
Lists ATE PCBs and probe card boards among PCB services.
Product scope checked 2026-10-11
PCB maker listing semiconductor test boards including probe card PCBs.
Product scope checked 2026-10-11
PCB maker listing ATE and probe card boards.
Product scope checked 2026-10-11
Lists probe cards, including multi-site mixed-signal, WAT, DDI, DC parametric and vertical cards, with probe card aligners among its equipment.
Product scope checked 2026-10-13
Lists vertical, cantilever, MEMS and RF probe cards with probe card design services.
Product scope checked 2026-10-13
Explore company information and manufacturing capabilities, then discuss the scope of your project with a relevant supplier.
Nidec SV Probe lists cantilever cards for logic with up to 3K points and 35 µm pitch, and vertical cards with up to 30K probes for full-array and parallel probing. [2] [1]
The interconnect between the probe head and the PCB on vertical cards; Nidec offers MLC, MLO, wired and modular types, down to 50 µm pitch. [3]
Nidec says direct-dock probing allows higher bandwidth, higher pin density and more devices tested in parallel. [4]
Sources checked 2026-10-11. Nidec SV Probe makes probe cards and describes its product technologies; EFPCB is a probe-card PCB supplier linked to this page.
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