Editorial Technical Reference

Wireless Communication Board

This page explains how Wireless Communication Board is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A printed circuit board (PCB) that enables wireless communication capabilities for smart home electrical systems.

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Wireless Communication Board in a manufacturing environment
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Product Specifications

Technical details and manufacturing context for Wireless Communication Board

Definition
The Wireless Communication Board is a specialized electronic component designed for integration into a Smart Home Circuit Breaker Panel. It provides wireless connectivity, enabling remote monitoring, control, and data transmission of electrical parameters and circuit status via protocols such as Wi-Fi, Zigbee, or Bluetooth. The board is built on an FR-4 PCB substrate with copper traces and surface-mount device (SMD) components, including a wireless module chipset. It operates in the 2.4–2.4835 GHz ISM band, with a transmit power of 20–30 dBm (max EIRP for indoor use) and receiver sensitivity of -90 to -100 dBm. Data rates range from 1 to 300 Mbps, depending on modulation and bandwidth, per IEEE 802.11n. The board requires a supply voltage of 3.3–5 V DC and consumes 80–300 mA at maximum transmit power. It is rated for industrial-grade operating temperatures from -40°C to 85°C and a non-condensing humidity range of 5–95% RH. The ingress protection rating for the enclosure is IP40–IP65, not for the bare board. Board dimensions are customizable, typically 25×40 to 50×80 mm, with a weight of 10–30 g including shield and connectors. Antenna gain for the PCB trace antenna is 2–5 dBi. These parameters are reference ranges and must be verified for the specific model and application. The board receives electrical signals from sensors and circuit breakers in the panel, processes them through embedded microcontrollers and wireless modules, and transmits data wirelessly to user interfaces such as mobile apps or web dashboards. It also receives control commands for remote operation of the circuit breaker system. For procurement, verify model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The board receives electrical signals from sensors and circuit breakers in the panel. These signals are processed by embedded microcontrollers and wireless modules. The processed data is transmitted wirelessly to user interfaces like mobile apps or web dashboards. The board also receives control commands from these interfaces, enabling remote operation of the circuit breaker system. The wireless communication uses protocols such as Wi-Fi, Zigbee, or Bluetooth, operating in the 2.4 GHz ISM band. The board's microcontroller manages data processing and protocol handling, while the wireless module handles RF transmission and reception. The board is powered by a 3.3–5 V DC supply and consumes 80–300 mA at maximum transmit power. It is designed for industrial temperature ranges and humidity conditions. The board's antenna gain is 2–5 dBi, and its dimensions and weight are customizable. The working principle ensures reliable wireless connectivity for monitoring and control of electrical parameters and circuit status.
Common Materials
FR-4 PCB substrate, Copper traces, SMD electronic components, Wireless module chipset
Technical Parameters
ParameterTypical rangeNotes & selection driver
Operating Frequency2.4–2.4835 GHzISM band for Wi-Fi/BluetoothIEEE 802.11
Transmit Power20–30 dBmMax EIRP for indoor useETSI EN 300 328
Receiver Sensitivity-90–-100 dBmLower is better for weak signals
Data Rate1–300 MbpsDepends on modulation and bandwidthIEEE 802.11n
Supply Voltage3.3–5 V DCTypical for logic and RF circuits
Current Consumption80–300 mAAt max transmit power
Operating Temperature-40–85 °CIndustrial gradeIEC 60068-2-1
Humidity Range5–95 % RHNon-condensingIEC 60068-2-78
Ingress ProtectionIP40–IP65For enclosure, not bare boardIEC 60529
Board Dimensions25×40–50×80 mmCustomizable per design
Weight10–30 gIncluding shield and connectors
Antenna Gain2–5 dBiFor PCB trace antenna

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Circuit Board
    The board itself: the substrate and copper traces that carry power and signals between the parts on it.
  • Microcontroller Unit
    Processes sensor data and manages wireless communication protocols
    Material: Silicon semiconductor
  • Wireless Transceiver Module
    Transmits and receives wireless signals
    Material: RF semiconductor components
  • Power Regulation Circuit
    Converts panel voltage to appropriate levels for board components
    Material: Copper, semiconductor components
  • Antenna Part
    Radiates and receives electromagnetic waves for wireless communication
    Material: Copper trace or external antenna element

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (atmospheric)
other spec: Humidity: 10-90% non-condensing, Power Supply: 3.3V DC ±5%
temperature: -20°C to +85°C
Media Compatibility
✓ Indoor air environments ✓ Plastic/ABS enclosures ✓ Low EMI residential settings
Unsuitable: High EMI industrial environments (e.g., near heavy machinery, arc welders)
Sizing Data Required
  • Required wireless range (meters)
  • Number of connected devices/nodes
  • Data transmission rate (kbps/Mbps)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal stress failure
Cause: Overheating due to poor ventilation, excessive ambient temperature, or component power dissipation beyond design limits, leading to solder joint fatigue, component degradation, or board warping.
Signal integrity degradation
Cause: Electromagnetic interference (EMI) from nearby equipment, poor antenna placement, or connector corrosion disrupting wireless transmission, resulting in data loss, increased latency, or complete communication failure.
Maintenance Indicators
  • Intermittent or complete loss of wireless connectivity despite proper network configuration
  • Unusual heat emission from the board or enclosure, or audible buzzing/hissing from components
Engineering Tips
  • Implement environmental controls: Ensure adequate airflow, maintain ambient temperature within manufacturer specifications, and use conformal coating to protect against moisture and contaminants.
  • Regularly inspect and clean connectors/antennas, perform signal strength testing, and use shielded enclosures with proper grounding to minimize EMI interference.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI C63.4 - Methods of measurement of radio-noise emissions from low-voltage electrical and electronic equipment CE marking per Directive 2014/53/EU (Radio Equipment Directive)

Quoted from the published standard.

Manufacturing Precision
  • PCB trace width tolerance: +/-0.05mm
  • Component placement accuracy: +/-0.1mm
Quality Inspection
  • RF performance testing (frequency, power, modulation accuracy)
  • Environmental stress screening (temperature cycling, vibration)

Manufacturers of Wireless Communication Board

Manufacturer profiles associated with Wireless Communication Board.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 6 September 2026

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Frequently Asked Questions

What is the operating frequency range of the Wireless Communication Board?

The board operates in the 2.4–2.4835 GHz ISM band, as per IEEE 802.11 standards. This range is typical for Wi-Fi and Bluetooth applications. Verify the exact frequency for your model with the manufacturer.

What is the maximum transmit power?

The maximum EIRP for indoor use is 20–30 dBm, according to ETSI EN 300 328. This is a reference range; the actual transmit power may vary by model and regional regulations. Confirm with the supplier.

What are the power supply requirements?

The board requires a DC supply voltage of 3.3–5 V. Current consumption is 80–300 mA at maximum transmit power. Ensure your power supply meets these requirements and verify with the manufacturer.

What is the operating temperature range?

The board is rated for industrial-grade operating temperatures from -40°C to 85°C, per IEC 60068-2-1. This range is suitable for most indoor and outdoor installations. Always check the datasheet for your specific model.

Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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