Editorial Technical Reference

Wireless Communication Module

This page explains how Wireless Communication Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A hardware component that enables wireless data transmission between the air quality monitor and other smart home devices or networks.

View Full Specifications Explore Manufacturing Sources
Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Wireless Communication Module

Definition
The wireless communication module is an essential electronic component within the Smart Home Air Quality Monitor that facilitates wireless connectivity. It transmits real-time air quality data (such as PM2.5, CO2, VOC levels) from the monitor's sensors to a central hub, mobile application, or cloud platform. This enables remote monitoring, alerts, and integration with broader smart home automation systems. The module typically uses radio frequency (RF) protocols like Wi-Fi, Bluetooth, Zigbee, or LoRa. It receives digital data from the monitor's main processor, encodes it into RF signals, and transmits them via an integrated antenna. It also receives commands or configuration data from external devices, relaying them back to the monitor's control unit. Key parameters include operating frequency in the 2.4–2.4835 GHz ISM band (IEEE 802.11), transmission power up to 20 dBm (ETSI EN 300 328), receiver sensitivity down to -95 dBm at 1 Mbps BLE, data rates from 1 to 300 Mbps (IEEE 802.11), supply voltage 3.0–3.6 V DC, operating temperature -40 to 85 °C (IEC 60068-2-1), humidity range 10–90% RH non-condensing (IEC 60068-2-78), ingress protection IP54–IP65 (IEC 60529), interfaces UART, SPI, I2C, antenna gain 2–5 dBi, module size 15–30 mm, and weight 2–10 g. Materials typically include a printed circuit board (PCB), RF transceiver chip, antenna (ceramic or PCB trace), and passive components. These values are reference ranges; verify model-specific specifications with the legal manufacturer or supplier before procurement or integration.
Working Principle
The module receives digital data from the monitor's main processor, encodes it into RF signals, and transmits them via an integrated antenna. It also receives commands or configuration data from external devices, relaying them back to the monitor's control unit. It uses RF protocols like Wi-Fi, Bluetooth, Zigbee, or LoRa, operating in the 2.4 GHz ISM band. The module's transceiver chip modulates the data onto the carrier frequency, and the antenna radiates the signal. For reception, the antenna captures RF signals, the transceiver demodulates them, and the module sends the digital data to the processor. The module's interfaces (UART, SPI, I2C) connect to the host MCU. Power is supplied at 3.0–3.6 V DC. The module is designed for industrial temperature ranges and dust/water resistance as per IP ratings.
Common Materials
Printed Circuit Board (PCB), RF transceiver chip, Antenna (ceramic or PCB trace), Passive components (resistors, capacitors)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Operating Frequency2.4–2.4835 GHzISM band for Wi-Fi/BLEIEEE 802.11
Transmission Power20 dBmMax EIRP for 2.4 GHzETSI EN 300 328
Receiver Sensitivity-95 dBmAt 1 Mbps BLE
Data Rate1–300 MbpsDepends on modulationIEEE 802.11
Supply Voltage3.0–3.6 V DCTypical 3.3 V
Operating Temperature-40–85 °CIndustrial gradeIEC 60068-2-1
Humidity Range10–90 % RHNon-condensingIEC 60068-2-78
Ingress ProtectionIP54–IP65Dust and water resistantIEC 60529
InterfaceUART, SPI, I2CFor host MCU
Antenna Gain2–5 dBiPCB or external antenna
Module Size15–30 mmLength or width
Weight2–10 gDepends on shielding

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • RF Transceiver IC
    Encodes/decodes digital data to/from RF signals
    Material: Semiconductor (silicon)
  • Antenna Part
    Radiates and receives RF electromagnetic waves
    Material: Copper trace on PCB or ceramic
  • Power Regulator
    Provides stable voltage to the RF components
    Material: Semiconductor (silicon)
  • Host Interface
    Connects the module to the monitor's MCU over UART / SPI / I2C.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Smartphones
View system integration details

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
humidity: 5% to 95% RH non-condensing
temperature: -40°C to +85°C
operating voltage: 3.0V to 3.6V DC
transmission power: Up to +20 dBm
receiver sensitivity: -97 dBm typical
Media Compatibility
✓ Indoor air quality monitoring systems ✓ Smart home automation networks ✓ Industrial IoT sensor networks
Unsuitable: High-voltage electrical substations or environments with strong electromagnetic interference
Sizing Data Required
  • Required data transmission rate (bps)
  • Maximum communication range needed (meters)
  • Network protocol compatibility (e.g., Wi-Fi, Zigbee, LoRaWAN)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal degradation or loss
Cause: Environmental interference (e.g., electromagnetic interference from nearby equipment, physical obstructions), antenna damage or misalignment, or power supply fluctuations affecting transmission stability.
Module overheating or thermal shutdown
Cause: Inadequate ventilation or cooling in the enclosure, excessive ambient temperature, prolonged high transmission power, or internal component failure leading to thermal runaway.
Maintenance Indicators
  • Intermittent or complete loss of communication signals, indicated by dropped data packets or failed connectivity checks in monitoring systems.
  • Unusual audible buzzing or humming from the module enclosure, or visual signs such as discoloration, swelling, or burnt odor from overheating components.
Engineering Tips
  • Implement regular environmental monitoring and shielding: Use EMI/RFI shielding in enclosures, ensure proper antenna placement away from interference sources, and maintain stable, clean power supplies with surge protection.
  • Optimize thermal management and preventive inspections: Design enclosures with adequate ventilation or active cooling, schedule periodic thermal imaging checks to detect hotspots, and adhere to manufacturer-recommended duty cycles to prevent overheating.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI C63.4-2014 (Methods of measurement of radio-noise emissions from low-voltage electrical and electronic equipment) CE marking per Directive 2014/53/EU (Radio Equipment Directive)

Quoted from the published standard.

Manufacturing Precision
  • Antenna impedance matching: +/- 5%
  • PCB trace width for RF signals: +/- 0.01mm
Quality Inspection
  • Radiated Spurious Emissions (RSE) test
  • Protocol conformance and interoperability test

Manufacturers of Wireless Communication Module

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Hunan Rika Electronic Tech Co., Ltd.
Hunan, CN
Also makes: Graphics Interface Controller, Humidity Sensor, Oxygen Probe / Analyzer and 9 more
Listed on the company's own website · profile compiled by CNFX from public sources
View profile Send enquiry

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Supply Chain Compatible Machinery & Devices

Industrial Smart Camera Module

The Industrial Smart Camera Module is a compact, self-contained vision processing unit designed for integration into industrial machinery and production lines.

Explore Specs →
Surface Mount Resistor

Passive electronic component for current limiting and voltage division in circuits

Explore Specs →
Surface Mount Capacitor

A surface mount capacitor is a fundamental electronic component used for energy storage, filtering, coupling, and decoupling in electronic circuits.

Explore Specs →
Surface Mount Technology (SMT) Pick-and-Place Machine

Automated machine that precisely places electronic components onto printed circuit boards.

Explore Specs →

Frequently Asked Questions

What wireless protocols does this module support?

The module typically supports Wi-Fi, Bluetooth, Zigbee, or LoRa. The exact protocols depend on the specific module variant. Check the datasheet or confirm with the supplier.

What is the operating temperature range?

The reference range is -40 to 85 °C, per IEC 60068-2-1. Verify the actual range for the specific module model.

What interfaces are available for connecting to the host processor?

Common interfaces include UART, SPI, and I2C. The availability may vary by module; confirm with the supplier.

How do I verify compliance with standards?

Standards such as IEEE 802.11, ETSI EN 300 328, IEC 60068-2-1, IEC 60068-2-78, and IEC 60529 are listed as reference. Always request certificates or test reports from the manufacturer or supplier for the specific model.
Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
Buyer enquiry

Request manufacturing insight for Wireless Communication Module

Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.

Where it goes
Straight to the CNFX editorial desk, and to the manufacturer if this product is linked to a claimed profile. Nothing is broadcast to a supplier list.
Your details stay here
We do not sell or rent enquiry data, and we do not add you to a mailing list. Used only to answer this request.
No commission, no middleman
CNFX is a directory. We take no cut of any order and never negotiate on a supplier's behalf.
What we don't claim
A listing is not an endorsement. Qualify every supplier and verify every figure yourself before ordering.

Your business information is used only to process this request.

Thank you! Your message has been sent. We'll respond within 1–3 business days.
Sorry, we couldn't send your message. Please try again, or email us at contact@cnfx.com.

Need to Manufacture Wireless Communication Module?

Compare manufacturer profiles with relevant product and process capability.

Create Manufacturer Profile Contact Us
Previous Product
XY Positioning Stage
Last Product
Get QuotesChat