Editorial Technical Reference

Wireless Receiver Module

This page explains how Wireless Receiver Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

Electronic component that receives wireless audio signals for satellite speakers

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Wireless Receiver Module

Definition
The Wireless Receiver Module is a specialized electronic component designed for satellite speaker systems. It receives wireless audio transmission signals, typically via Bluetooth, Wi-Fi, or proprietary protocols, and converts them into electrical signals suitable for amplification and playback. This module enables cable-free audio connectivity between audio sources and satellite speakers in home theater, multimedia, and professional audio systems.

The module operates by capturing modulated radio frequency signals through its antenna, demodulating them to extract audio data, and converting digital audio to analog using a Digital-to-Analog Converter (DAC). It outputs the analog signal to the speaker's amplifier circuit. The module includes error correction, signal processing, and synchronization functions to maintain audio quality and stability.

Key specifications include a frequency range of 2.4–2.4835 GHz (ISM band, per IEEE 802.11), GFSK modulation, output power adjustable from 0 to 4 dBm, receiver sensitivity of -90 dBm at 1% BER, supply voltage of 3.3–5 V DC, current consumption of 20–40 mA during active reception, operating temperature of -20 to 70 °C, storage temperature of -40 to 85 °C, humidity range of 10–90% RH (non-condensing), IP rating of IP40–IP65 (per IEC 60529), audio output level of 0.5–1.0 V RMS, signal-to-noise ratio of ≥85 dB (A-weighted), total harmonic distortion of ≤0.1% at 1 kHz, and dimensions of 25×15×5 mm.

Materials typically include a printed circuit board (PCB), integrated circuits (ICs), RF antenna, and connectors. These values are reference ranges; actual specifications may vary by model and application. Always verify model-specific values and standards with the legal manufacturer or supplier before procurement or integration.
Working Principle
The module receives modulated radio frequency signals through its antenna. It demodulates the signal to extract the audio data, then converts digital audio to analog using a DAC. The analog signal is output to the speaker's amplifier circuit. The module includes error correction, signal processing, and synchronization functions to maintain audio quality and stability.
Common Materials
Printed Circuit Board (PCB), Integrated Circuits (ICs), RF Antenna, Connectors
Technical Parameters
ParameterTypical rangeNotes & selection driver
Frequency Range2.4–2.4835 GHzISM band for wireless audioIEEE 802.11
Modulation TypeGFSKGaussian frequency shift keying
Output Power0–4 dBmAdjustable for range and compliance
Receiver Sensitivity-90 dBmAt 1% BER
Supply Voltage3.3–5 V DCTypical 3.3V
Current Consumption20–40 mADuring active reception
Operating Temperature-20–70 °CIndustrial grade
Storage Temperature-40–85 °CNon-operating
Humidity Range10–90 % RHNon-condensing
IP RatingIP40–IP65Depends on enclosureIEC 60529
Audio Output Level0.5–1.0 V RMSLine level
Signal-to-Noise Ratio≥85 dBA-weighted
Total Harmonic Distortion≤0.1 %At 1 kHz
Dimensions25×15×5 mmTypical module footprint

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • RF Antenna Part
    Captures wireless radio frequency signals from the transmitter
    Material: Copper trace on PCB or external antenna element
  • RF Receiver IC Part
    Demodulates and processes the incoming RF signal
    Material: Semiconductor silicon
  • Audio DAC
    Converts digital audio data to analog audio signals
    Material: Semiconductor silicon
  • Power Regulator
    Provides stable voltage to all electronic components
    Material: Semiconductor silicon with passive components

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (atmospheric)
other spec: Operating Voltage: 3.3V DC ±5%, Frequency Range: 2.4GHz ISM band, Receiver Sensitivity: -95dBm
temperature: -20°C to +70°C
Media Compatibility
✓ Indoor residential environments ✓ Commercial audio installations ✓ Home theater systems
Unsuitable: High EMI industrial environments (e.g., near heavy machinery, arc welders)
Sizing Data Required
  • Required audio channel count (e.g., stereo, 5.1, 7.1)
  • Maximum transmission distance needed
  • Speaker impedance and power requirements

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal Degradation/Intermittent Connectivity
Cause: Antenna damage or misalignment, RF interference from nearby equipment, or component aging (e.g., oscillator drift, capacitor degradation) leading to weak or unstable signal reception.
Power Supply Failure
Cause: Voltage spikes or surges damaging internal circuitry, thermal stress from poor ventilation causing component overheating, or electrolytic capacitor drying/leaking over time leading to unstable power delivery.
Maintenance Indicators
  • Frequent signal dropouts or increased latency in data transmission, audible as gaps or static in audio applications.
  • Visible signs of overheating (discoloration, warping) on the module housing or power components, or unusual heat emission during operation.
Engineering Tips
  • Implement regular RF spectrum analysis and site surveys to identify and mitigate interference sources, and ensure proper antenna positioning/shielding per manufacturer specifications.
  • Install surge protection devices on power inputs, maintain clean and dust-free ventilation around the module, and schedule preventive replacement of aging electrolytic capacitors based on operational hours.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI C63.4-2014 - Methods of measurement of radio-noise emissions from low-voltage electrical and electronic equipment in the range of 9 kHz to 40 GHz CE marking - Compliance with EU Radio Equipment Directive (RED) 2014/53/EU

Quoted from the published standard.

Manufacturing Precision
  • Frequency stability: +/- 10 ppm
  • PCB component placement: +/- 0.1mm
Quality Inspection
  • RF performance testing (sensitivity, selectivity, output power)
  • Environmental stress testing (temperature, humidity, vibration)

Manufacturers of Wireless Receiver Module

Manufacturer profiles associated with Wireless Receiver Module.

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Frequently Asked Questions

What is the typical frequency range of this module?

The module operates in the 2.4–2.4835 GHz ISM band, as per IEEE 802.11. This range is commonly used for wireless audio transmission.

What is the receiver sensitivity?

The receiver sensitivity is -90 dBm at 1% bit error rate (BER). This indicates the minimum signal level required for reliable reception.

What is the operating temperature range?

The operating temperature range is -20 to 70 °C. Storage temperature is -40 to 85 °C. Ensure the module is used within these limits.

What is the IP rating?

The IP rating is IP40–IP65, depending on the enclosure. This indicates the level of protection against dust and water ingress. Verify the actual rating for your specific model.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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