A heatsink is a passive cooling device that dissipates heat from electronic components to prevent overheating.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Weight | 50-500 g | |
| Fin Height | 10-50 mm | |
| Base Thickness | 3-10 mm | |
| Mounting Method | Screw, clip, or adhesive | |
| Thermal Resistance | 0.5-5.0 °C/W |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A circuit stage within a Voltage Control Unit that switches power flow to regulate output voltage.
A system designed to transfer and dissipate excess heat generated by electronic components within a control circuit or power regulator to maintain optimal operating temperatures.
Thermal management subsystem that dissipates heat from telecommunications equipment components to maintain optimal operating temperatures.
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It dissipates heat from power electronic components to prevent thermal damage, ensure efficiency, and extend device lifespan.
Consider thermal resistance, material, size, airflow conditions, and mounting compatibility based on the component's power dissipation and ambient temperature.
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