Input Interface Matrix

Product Specifications

Technical details and manufacturing context for Input Interface Matrix

Definition

The Input Interface Matrix is a critical component of the Fusion Logic Core that serves as the primary signal aggregation and routing hub. It receives analog and digital inputs from multiple sources including sensors, controllers, and external systems, normalizes signal levels, performs initial filtering, and distributes processed signals to appropriate processing modules within the core. This matrix enables scalable input management and ensures signal integrity before data fusion operations.

The matrix operates by receiving input signals through multiple interface ports, converting them to standardized voltage/current levels, applying noise filtering and signal conditioning, then routing them through configurable switching logic to designated processing channels. It uses multiplexing techniques to handle simultaneous inputs and includes isolation circuits to prevent signal interference between channels.

Key parameters include 8–32 input channels, supporting signal types such as 4–20 mA, 0–10 V, RTD, and TC per IEC 60381-1. Input impedance is ≥100 kΩ, accuracy is ±0.1% FS per IEC 60770-1, and sampling rate ranges from 10–1000 Hz. Isolation voltage is 1500 V DC per IEC 61010-1. Operating temperature is -40–85 °C, storage temperature -40–105 °C, relative humidity 5–95% non-condensing, and ingress protection IP54–IP65 per IEC 60529. Supply voltage is 24 V DC ±10% per IEC 61131-2, power consumption ≤5 W, weight 0.5–2.0 kg, and dimensions range from 100×75×25 mm to 200×150×50 mm. Materials include FR-4 PCB substrate, copper traces, surface-mount components, and polymer housing.

This directory entry provides reference ranges; actual values must be confirmed with the legal manufacturer or supplier for the specific model and application. Standards listed are procurement references, not proof of certification.

Working Principle

The matrix receives input signals through multiple interface ports, converts them to standardized voltage/current levels, applies noise filtering and signal conditioning, then routes them through configurable switching logic to designated processing channels. It uses multiplexing techniques to handle simultaneous inputs and includes isolation circuits to prevent signal interference between channels.

Common Materials

FR-4 PCB substrate, Copper traces, Surface-mount electronic components, Polymer housing

Technical Parameters

Parameter	Typical range	Notes & selection driver
Number of Input Channels	8–32 channels	Determines the number of sensors/control signals that can be connected.
Signal Type	4–20 mA, 0–10 V, RTD, TC	Compatibility with common industrial sensors.IEC 60381-1
Input Impedance	≥100 kΩ	High impedance minimizes loading on signal sources.
Accuracy	±0.1 % FS	Overall measurement accuracy including linearity and hysteresis.IEC 60770-1
Sampling Rate	10–1000 Hz	Higher rates for dynamic signals; lower for steady-state.
Isolation Voltage	1500 V DC	Channel-to-channel and channel-to-ground isolation.IEC 61010-1
Operating Temperature	-40–85 °C	Extended range for harsh environments.
Storage Temperature	-40–105 °C	Non-operating survival range.
Relative Humidity	5–95 % RH	Non-condensing.IEC 60068-2-78
Ingress Protection	IP54–IP65	IP65 for washdown environments.IEC 60529
Supply Voltage	24 ±10% V DC	Reverse polarity and overvoltage protection.IEC 61131-2
Power Consumption	≤5 W	Typical at 24 V DC with all channels active.
Weight	0.5–2.0 kg	Depends on number of channels and housing material.
Dimensions (W×H×D)	100×75×25 – 200×150×50 mm	Compact DIN-rail mountable design.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Signal Conditioning Circuit
Normalizes input signals to standard levels and filters noise

Material: Electronic components on PCB
Multiplexing Switch Array
Routes signals to appropriate processing channels

Material: Semiconductor switching ICs
Isolation Barrier
Prevents electrical interference between input channels

Material: Optocouplers and isolation transformers
Configuration Memory Part
Stores routing and processing parameters

Material: Non-volatile memory IC

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Fusion Logic Core

View system integration details

Manufacturers of Input Interface Matrix

Manufacturer profiles associated with Input Interface Matrix.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 6 September 2026

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Frequently Asked Questions

What is the Input Interface Matrix used for?

It aggregates and routes multiple analog and digital input signals from sensors, controllers, and external systems to processing modules within the Fusion Logic Core, ensuring signal integrity before data fusion.

What signal types does it support?

It supports 4–20 mA, 0–10 V, RTD, and thermocouple (TC) signals, as referenced in IEC 60381-1. Confirm compatibility with your specific sensors.

What is the isolation voltage?

The isolation voltage is 1500 V DC, per IEC 61010-1, providing channel-to-channel and channel-to-ground isolation. Verify this for your application's safety requirements.

How do I verify the correct model for my application?

Check the number of input channels (8–32), signal types, sampling rate (10–1000 Hz), and environmental ratings (temperature, humidity, IP rating) against your needs. Always confirm with the manufacturer or supplier.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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Product Specifications

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