Products (10)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
The precision mechanism in a wire bonder that performs the actual wire bonding operation.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in semiconductor bonding equipment that securely holds and positions capillary or wedge bonding tools during wire bonding processes.
Product
in Electrical Equipment Manufacturing
A specialized heating chamber used to cure and solidify impregnated transformer cores by applying controlled heat to activate resins and ensure proper bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in wire bonding equipment that uses an electrical discharge to melt and form a ball at the end of a bonding wire.
Product
in Computer, Electronic and Optical Product Manufacturing
A temperature-controlled platform that holds and heats semiconductor wafers or dies during wire bonding processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision heating component within a bond head assembly that provides controlled thermal energy for bonding processes.
Product
in Manufacture of Footwear
Hydraulic press for molding and bonding shoe soles to uppers