Wire Bonder
View system integration details
Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Bond Head used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Bond Head is characterized by the integration of Capillary/Wedge Tool Holder and Z-axis Actuator. In industrial production environments, manufacturers listed on CNFX commonly emphasize Stainless steel construction to support stable, high-cycle operation across diverse manufacturing scenarios.
The precision mechanism in a wire bonder that performs the actual wire bonding operation.
Technical details and manufacturing context for Bond Head
Commonly used trade names and technical identifiers for Bond Head.
This component is essential for the following industrial systems and equipment:
| pressure: | 0.5-2.0 N (bond force range) |
| other spec: | Positioning accuracy: ±1.5 μm, Bond cycle time: 50-200 ms |
| temperature: | 20-40°C (operating ambient) |
Verified manufacturers with capability to produce this product in China
✓ 92% Supplier Capability Match Found
Authentic performance reports from verified B2B procurement managers.
"Great transparency on the Bond Head components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
"The Bond Head we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."
"Found 11+ suppliers for Bond Head on CNFX, but this spec remains the most cost-effective."
“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”
The Bond Head is constructed from high-performance materials including stainless steel for structural components, ceramic for insulation and wear resistance, and tungsten carbide for critical wear surfaces to ensure durability and precision.
Key components include the Capillary/Wedge Tool Holder for wire guidance, Z-axis Actuator for vertical movement, Heater Block for temperature control, and Ultrasonic Transducer for bonding energy transmission.
Bond Heads are essential in Computer, Electronic and Optical Product Manufacturing for semiconductor packaging, microelectronics assembly, and precision component bonding where reliable wire interconnections are critical.
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