Products (10)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
A robotic system that automatically sorts, tests, and classifies semiconductor devices during production.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in semiconductor bonding equipment that securely holds and positions capillary or wedge bonding tools during wire bonding processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A photosensitive electronic component that converts light signals into electrical signals for detection and measurement in optical spectrometers.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision machine that evenly distributes and spreads semiconductor chips or electronic components onto substrates during manufacturing processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A semiconductor chip that manages communication protocols and data exchange within diagnostic systems.
Product
in Machinery and Equipment Manufacturing
A component that identifies when operational parameters exceed predefined limits within a penalty function system.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A component within an Automatic Gain Control (AGC) system that measures the amplitude or power level of an input signal.