Products (10)
Product
in Electronic Component Manufacturing
Industrial machine for precisely placing and bonding semiconductor dies onto substrates
Product
in Computer, Electronic and Optical Product Manufacturing
The precision mechanism in a wire bonder that performs the actual wire bonding operation.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in automated die attach machines that physically applies force and/or energy to create permanent bonds between semiconductor dies and substrates.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in semiconductor bonding equipment that securely holds and positions capillary or wedge bonding tools during wire bonding processes.
Product
in Electrical Equipment Manufacturing
A specialized heating chamber used to cure and solidify impregnated transformer cores by applying controlled heat to activate resins and ensure proper bonding.
Product
in Computer, Electronic and Optical Product Manufacturing
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Product
in Manufacture of Electric Motors, Generators and Transformers
Precisely stacked and bonded electrical steel laminations forming the stationary magnetic core of an electric motor.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision component in wire bonding equipment that uses an electrical discharge to melt and form a ball at the end of a bonding wire.
Product
in Computer, Electronic and Optical Product Manufacturing
A temperature-controlled platform that holds and heats semiconductor wafers or dies during wire bonding processes.
Product
in Computer, Electronic and Optical Product Manufacturing
A precision heating component within a bond head assembly that provides controlled thermal energy for bonding processes.