3D Optical Sensor Head for SPI Systems

Product Specifications

Technical details and manufacturing context for 3D Optical Sensor Head

Definition

The 3D Optical Sensor Head is a critical component within Automated Solder Paste Inspection (SPI) systems, responsible for non-contact measurement of solder paste volume, height, area, and alignment on PCB pads. It typically employs structured light, laser triangulation, or phase-shift profilometry to generate precise three-dimensional topographical maps of the solder paste deposits, enabling the SPI system to detect defects such as insufficient paste, bridging, misalignment, or excessive volume before the reflow soldering process. The sensor head projects a pattern of light onto the target solder paste, and a high-resolution camera, offset at a known angle, captures the deformation of this pattern. Using triangulation algorithms, the system calculates the height (Z-axis) for each point on the surface based on the displacement of the pattern in the camera image, thereby constructing a detailed 3D profile of the solder paste deposit. The head is typically mounted on a gantry system and moves across the PCB to scan the entire board. Key parameters include a measurement range of 0–500 µm, a height resolution of 0.1 µm, and repeatability of ±0.5 µm. The field of view is adjustable from 10–30 mm, with a working distance of 20–50 mm. Scan speed ranges from 10–50 mm/s. The light source uses blue light with a wavelength of 405–450 nm for high contrast. Operating temperature is 10–40 °C, storage temperature -10–60 °C, and relative humidity 20–80% non-condensing. The ingress protection rating is IP54 per IEC 60529. Supply voltage is 24 V DC ±10%, power consumption 15–30 W, and weight 0.5–1.5 kg. Materials include optical-grade glass lenses, aluminum alloy housing, and precision steel mounts. This component is designed for integration into SPI systems and is not a standalone inspection solution. For specific applications, verify model-specific values and standards with the legal manufacturer or supplier.

Working Principle

The sensor head projects a pattern of light (e.g., laser lines, structured light fringes) onto the target solder paste. A high-resolution camera, offset at a known angle, captures the deformation of this pattern. Using triangulation algorithms, the system calculates the height (Z-axis) for each point on the surface based on the displacement of the pattern in the camera image, thereby constructing a detailed 3D profile of the solder paste deposit.

Common Materials

Optical-grade glass lenses, Aluminum alloy housing, Precision steel mounts

Technical Parameters

Parameter	Typical range	Notes & selection driver
Measurement Range (Height)	0–500 µm	Covers typical solder paste thickness.
Resolution (Height)	0.1 µm	Detects fine height variations.
Repeatability (Height)	±0.5 µm	Ensures consistent measurements.
Field of View (FOV)	10–30 mm	Adjustable for different PCB sizes.
Working Distance	20–50 mm	Clearance for board handling.
Scan Speed	10–50 mm/s	Affects throughput.
Light Source Wavelength	405–450 nm	Blue light for high contrast.
Operating Temperature	10–40 °C	Stable performance within range.
Storage Temperature	-10–60 °C	Protect from extreme conditions.
Relative Humidity (Non-condensing)	20–80 %RH	Avoid condensation on optics.
Ingress Protection Rating	IP54	Dust and splash resistant.IEC 60529
Supply Voltage	24 ±10% V DC	Standard industrial supply.
Power Consumption	15–30 W	Depends on illumination and processing.
Weight	0.5–1.5 kg	Lightweight for gantry mounting.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Projection Lens Assembly
Focuses and projects the structured light pattern onto the target surface.

Material: Optical glass
Imaging Lens Assembly
Focuses the deformed light pattern from the target onto the camera sensor.

Material: Optical glass
Camera Sensor (CMOS/CCD)
Captures high-resolution images of the projected light pattern for 3D calculation.

Material: Silicon
Housing Part
Protects internal optics and provides mounting points, ensuring mechanical stability and alignment.

Material: Aluminum alloy
Pattern Projection Module
Generates the laser lines or fringe pattern that gets projected onto the paste.

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Frequently Asked Questions

What is the typical measurement range for solder paste height?

The measurement range for height is 0–500 µm, covering typical solder paste thicknesses. Verify the exact range for your specific model with the manufacturer.

What is the height resolution and repeatability?

The height resolution is 0.1 µm, and repeatability is ±0.5 µm, ensuring fine detection of height variations and consistent measurements. Confirm these values for your model.

What are the environmental operating conditions?

The sensor head operates in temperatures from 10–40 °C, storage from -10–60 °C, and relative humidity 20–80% non-condensing. It has an IP54 rating per IEC 60529 for dust and splash resistance.

What are the electrical and physical specifications?

Supply voltage is 24 V DC ±10%, power consumption 15–30 W, and weight 0.5–1.5 kg. These values depend on illumination and processing. Always verify with the manufacturer for your specific configuration.

Data Basis

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Preliminary Technical Classification

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pressure:	Atmospheric (non-contact optical measurement)
other spec:	Vibration tolerance: <0.5G @ 5-500Hz, Humidity: 30-70% RH non-condensing
temperature:	+10°C to +40°C (operating), -10°C to +60°C (storage)

3D Optical Sensor Head

Product Specifications

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Reliability & Engineering Risk Analysis

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