This page explains how Industrial Edge Computing Node is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A ruggedized computing device deployed at industrial sites to process data locally, reducing latency and bandwidth usage.
Technical details and manufacturing context for Industrial Edge Computing Node
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Processor CoresRequired | 4–8 cores | Number of CPU cores available for processing tasks |
| Memory CapacityRequired | 8–32 GB | Total RAM available for data processing and temporary storage |
| Storage CapacityRequired | 128–512 TB | Total solid-state storage available for operating system, applications, and data |
| Operating TemperatureRequired | -40–70 °C | Temperature range within which the device operates reliably |
| Power ConsumptionRequired | 15–30 W | Maximum power draw during normal operation |
| Ingress Protection RatingRequired | IP65–IP67 IP code | Level of protection against solid objects and liquidsIEC 60529 |
| Input Voltage | 9–36 V DC | Wide range for industrial power |
| Communication Interfaces | 2×GbE, 2×RS-232/485, 2×USB 3.0 | Optional 4G/5G, Wi-Fi |
| Mounting | DIN rail or wall | Tool-less installation |
| Weight | 1.5–2.5 kg | Aluminum housing |
| Dimensions (W×H×D) | 150×100×50 mm | Compact, DIN rail compatible |
| Vibration Resistance | 5–500 Hz | 3 axes, 2 gIEC 60068-2-6 |
| Shock Resistance | 15 g | 11 ms, half-sineIEC 60068-2-27 |
| Relative Humidity | 10–95 % | Non-condensing |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Industrial Edge Computing Node.
| pressure: | 0 to 2 bar (non-pressurized enclosure) |
| other spec: | IP67 ingress protection, 5-95% non-condensing humidity, 5G vibration resistance |
| temperature: | -40°C to 85°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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It is used to process data locally at industrial sites, enabling real-time decision-making, reducing latency and bandwidth usage, and enhancing data security by keeping sensitive data on-site.
Key specifications include processor cores (4-8), memory (8-32 GB), storage (128-512 GB), operating temperature (-40 to 70°C), ingress protection (IP65-IP67), input voltage (9-36 V DC), and communication interfaces (2×GbE, 2×RS-232/485, 2×USB 3.0). Always verify with the manufacturer for the specific model.
It supports DIN rail or wall mounting with tool-less installation, making it easy to deploy in industrial cabinets or on walls.
It operates in temperatures from -40 to 70°C, relative humidity 10-95% non-condensing, and meets vibration and shock standards per IEC 60068-2-6 and IEC 60068-2-27. Confirm exact limits with the supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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