Editorial Technical Reference

Photodetector

This page explains how Photodetector is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A device that converts light signals into electrical signals for detection and measurement.

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Product Specifications

Technical details and manufacturing context for Photodetector

Definition
A photodetector is an electronic component within a sensor module that detects light or other electromagnetic radiation and converts it into an electrical signal. It serves as the primary sensing element in optical sensor systems, enabling the measurement of light intensity, detection of presence/absence, and various optical measurements. This directory entry covers photodetectors based on semiconductor materials such as silicon, germanium, and InGaAs. Typical parameters include a spectral range of 400–1100 nm for silicon-based devices, with peak sensitivity around 900–950 nm. Responsivity at peak wavelength is typically 0.4–0.6 A/W. Dark current ranges from 0.1–10 nA at 10 V reverse bias and 25°C. Rise time is 10–100 ns at 50 Ω load and 5 V bias. Active area diameter varies from 0.3–10 mm, with capacitance of 10–100 pF at 0 V bias. Operating temperature is -40 to 85°C, storage temperature -55 to 125°C. Reverse breakdown voltage is 30–200 V minimum. Noise equivalent power (NEP) is 1e-14 to 1e-12 W/√Hz at peak wavelength and 25°C. Package types include TO-5, TO-8, and SMD, with hermetic options available. Weight ranges from 1–10 g depending on package. These values are reference ranges and must be verified for the specific model and application. When selecting a photodetector, consider the required spectral range, sensitivity, speed, and environmental conditions. Verify electrical interfaces, such as bias voltage and load impedance, with the manufacturer. Maintenance signals include increased dark current or reduced responsivity, indicating possible degradation. Failure boundaries include exceeding reverse breakdown voltage or operating beyond temperature limits. Always confirm model-specific specifications and standards with the legal manufacturer or supplier.
Working Principle
Photodetectors operate based on the photoelectric effect, where incident photons strike a photosensitive material (typically semiconductor-based), generating electron-hole pairs that create a measurable electrical current or voltage proportional to the light intensity. The generated charge carriers are collected by electrodes, producing a photocurrent that can be amplified and processed. The magnitude of the photocurrent depends on the light intensity and the material's quantum efficiency. The response time is influenced by the carrier transit time and the capacitance of the device. Photodetectors are designed to operate in specific spectral ranges, with materials chosen to match the wavelength of interest. The output signal can be used for direct light measurement or as part of a larger optical sensing system.
Common Materials
Semiconductor (Silicon, Germanium, InGaAs)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Spectral Range400–1100 nmSilicon-based; covers visible to near-infrared
Peak Sensitivity Wavelength900–950 nmTypical for Si photodiodes
Responsivity0.4–0.6 A/WAt peak wavelength
Dark Current0.1–10 nAAt 10 V reverse bias, 25°C
Rise Time10–100 nsAt 50 Ω load, 5 V bias
Active Area Diameter0.3–10 mmLarger area increases capacitance
Capacitance10–100 pFAt 0 V bias; affects speed
Operating Temperature-40–85 °CExtended range available
Storage Temperature-55–125 °CNon-operating
Reverse Breakdown Voltage30–200 VMinimum
Noise Equivalent Power (NEP)1e-14–1e-12 W/√HzAt peak wavelength, 25°C
Package TypeTO-5, TO-8, SMDHermetic options available
Weight1–10 gDepends on package

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Photosensitive Element Part
    Converts photons to electrical charge carriers through the photoelectric effect
    Material: Semiconductor material (e.g., Silicon, Germanium)
  • Electrodes Part
    Collect and conduct the generated electrical current to external circuitry
    Material: Metal (typically Aluminum or Gold)
  • Packaging/Window Part
    Protects the sensitive element while allowing light transmission in the desired spectral range
    Material: Glass or optical-grade plastic

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Atmospheric to 2 bar
temperature: -40°C to +85°C
response time: 1 ns to 100 ms
wavelength range: 190 nm to 1100 nm
Media Compatibility
✓ Optical fibers ✓ Clear liquids ✓ Gaseous environments
Unsuitable: High-particulate slurry environments
Sizing Data Required
  • Wavelength of light source
  • Required response time
  • Signal-to-noise ratio requirement

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Photodiode degradation
Cause: Excessive exposure to high-intensity light or radiation beyond rated specifications, leading to permanent damage to the semiconductor material and reduced sensitivity.
Optical window contamination
Cause: Accumulation of dust, oil, or particulates on the optical surface, obstructing light transmission and causing signal attenuation or false readings.
Maintenance Indicators
  • Drift or instability in output signal under constant light conditions, indicating potential internal component failure or contamination.
  • Visible discoloration, clouding, or physical damage to the optical window or housing, suggesting environmental exposure issues.
Engineering Tips
  • Implement optical window inspection and cleaning protocols using approved, lint-free materials and solvents to prevent scratching and maintain light transmission efficiency.
  • Ensure proper alignment and secure mounting to minimize vibration-induced misalignment, and use protective housings or filters to shield from excessive light intensity and harsh environmental conditions.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 9022-3:2015 (Environmental test methods for optical components) ANSI/IES LM-79-19 (Electrical and photometric measurements of solid-state lighting products) DIN 58141-6:2016-12 (Fiber optic components - Part 6: Photodetectors)

Quoted from the published standard.

Manufacturing Precision
  • Spectral response range: +/- 5 nm
  • Dark current: +/- 10% of specified value
Quality Inspection
  • Quantum efficiency measurement test
  • Response time and bandwidth verification test

Manufacturers of Photodetector

Manufacturer profiles associated with Photodetector.

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Frequently Asked Questions

What is the typical spectral range of a silicon photodetector?

For silicon-based photodetectors, the spectral range is typically 400–1100 nm, covering visible to near-infrared wavelengths. The peak sensitivity is usually around 900–950 nm. These are reference values; the exact range depends on the specific model and should be confirmed with the manufacturer.

How does dark current affect photodetector performance?

Dark current is the small current that flows even in the absence of light, due to thermally generated carriers. It sets a lower limit on detectable light levels and contributes to noise. For the photodetectors in this directory, dark current is typically 0.1–10 nA at 10 V reverse bias and 25°C. Lower dark current is generally better for low-light applications.

What factors influence the response speed of a photodetector?

Response speed is characterized by rise time, which is typically 10–100 ns for these devices at 50 Ω load and 5 V bias. It is influenced by the carrier transit time, the capacitance of the device, and the load impedance. Larger active area increases capacitance, which can slow the response. Operating at higher reverse bias can reduce capacitance and improve speed.

What are common package types and how do they affect use?

Common package types include TO-5, TO-8, and SMD (surface-mount device). Hermetic options are available for harsh environments. The package affects mounting, optical access, and thermal performance. Weight ranges from 1–10 g depending on package. Choose a package that suits your assembly process and environmental requirements.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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