High-Speed Pick-and-Place Machine
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This page explains how Placement Head is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
The precision mechanism in SMT pick-and-place machines responsible for picking up electronic components and accurately placing them onto printed circuit boards (PCBs).
Technical details and manufacturing context for Placement Head
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Number of Heads | 2–12 pcs | Determines placement throughput; more heads increase speed. |
| Placement Speed | 20000–80000 cph | Higher speed reduces cycle time. |
| Placement Accuracy | ±0.03–±0.05 mm | Critical for fine-pitch components.IPC-9850 |
| Component Size Range | 01005–50×50 mm | Smallest to largest component footprint supported. |
| Z-Axis Stroke | 10–30 mm | Vertical travel for picking and placing. |
| Theta Rotation Range | 0–360 ° | Full rotation for component orientation. |
| Operating Pressure | 0.4–0.6 MPa | Required for vacuum pick-up and pneumatic actuation.ISO 8573-1 |
| Vacuum Level | -80–-90 kPa | Sufficient suction to hold components securely. |
| Operating Temperature | 10–40 °C | Outside this range, accuracy may degrade. |
| Relative Humidity | 30–80 %RH | Non-condensing; high humidity can affect components. |
| Weight | 15–50 kg | Affects dynamic performance and machine stability. |
| Power Consumption | 0.5–2.0 kW | Electrical load for motors and controllers. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | 0.5-1.5 bar (vacuum/pneumatic system) |
| other spec: | Component size: 01005 to 45mm, Placement accuracy: ±25μm, Speed: 10,000-100,000 CPH |
| temperature: | 15-35°C (operating environment) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Placement Head.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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The placement head is the end-effector that picks up electronic components from feeders and places them onto PCBs with high precision. It directly affects placement speed, accuracy, and the range of component sizes the machine can handle.
Key parameters include number of heads, placement speed, placement accuracy, component size range, Z-axis stroke, theta rotation range, operating pressure, vacuum level, operating temperature, relative humidity, weight, and power consumption. These are directory reference ranges; confirm with the manufacturer for your specific application.
Accuracy is achieved through precise mechanical design, vision systems for component inspection and alignment, and closed-loop control of the X-Y and theta axes. The placement accuracy is typically ±0.03–±0.05 mm per IPC-9850, but verify for the specific model.
Regular maintenance includes cleaning or replacing vacuum nozzles, checking vacuum levels, calibrating the theta rotation and Z-axis, and inspecting for wear. Failure to maintain can lead to placement errors and reduced throughput.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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