This page explains how High-Speed Pick-and-Place Machine is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision robotic component of an SMT assembly line that rapidly picks electronic components from feeders and accurately places them onto printed circuit boards.
Technical details and manufacturing context for High-Speed Pick-and-Place Machine
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Placement Speed | 30000–60000 CPH | Higher speed increases throughput but may reduce placement accuracy. |
| Placement Accuracy | ±0.03–±0.05 mm | Tighter accuracy required for fine-pitch components. |
| Component Size Range | 01005–50×50 mm | Supports from chip components to large connectors. |
| PCB Size (Max) | 510×460 mm | Larger boards may require special handling. |
| Feeder Capacity | 80–120 8mm tapes | More feeders reduce changeover frequency. |
| Power Supply | 200–480 V AC | Voltage range depends on regional grid. |
| Power Consumption | 2.5–4.5 kW | Higher power for more axes and speed. |
| Air Consumption | 100–200 L/min | Requires adequate compressor capacity. |
| Operating Temperature | 15–35 °C | Outside range may affect accuracy. |
| Humidity Range | 30–80 % RH | High humidity can cause corrosion. |
| Machine Weight | 1500–2500 kg | Heavier machines are more stable. |
| Footprint (L×W×H) | 1500×1800×1500 mm | Check clearance for maintenance. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | N/A (pneumatic systems typically 0.4-0.7 MPa) |
| other spec: | Placement accuracy: ±0.025mm, Speed: 25,000-100,000 CPH, Component range: 0201 to 50mm² |
| temperature: | 15-35°C (operating environment) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with High-Speed Pick-and-Place Machine.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The placement speed is typically in the range of 30,000 to 60,000 CPH (components per hour). However, the actual speed depends on the specific model, component types, and board complexity. Always verify the rated speed with the manufacturer for your intended application.
It can handle components ranging from 01005 (metric) up to 50×50 mm. This includes chip resistors, capacitors, and larger connectors. For fine-pitch components, tighter placement accuracy is required, which is within the machine's capability.
The machine requires a power supply of 200–480 V AC and consumes 2.5–4.5 kW. It also uses compressed air at a rate of 100–200 L/min. Ensure your facility provides adequate power and compressed air capacity.
It uses a vision system to align the PCB via fiducial marks and inspects each component before placement. The placement head moves with high precision along X, Y, and Z axes, and the nozzle applies controlled force. Accuracy is typically ±0.03–±0.05 mm, but this should be confirmed for the specific model.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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