Processing Element Array

Product Specifications

Technical details and manufacturing context for Processing Element Array

Definition

The Processing Element Array is the core computational engine of a Neural Processing Unit, comprising numerous identical or specialized processing elements organized in a regular grid structure. This array enables massively parallel execution of neural network operations, particularly matrix multiplications and convolutions, by distributing computations across multiple processing elements simultaneously. Each element typically contains arithmetic logic units (ALUs), local memory, and interconnects for data exchange with neighboring elements. The array is fabricated on silicon using copper interconnects and dielectric materials, with process technology ranging from 7 to 16 nanometers. It is available in configurations with 64 to 1024 processing elements, arranged in grid dimensions from 8x8 to 32x32. The clock frequency ranges from 500 to 1500 MHz, providing peak throughput of 2 to 16 TOPS (INT8 operations per second). Power consumption varies between 5 and 30 watts, depending on workload and frequency, with a core logic supply voltage of 0.8 to 1.2 volts. The operating temperature range is -40 to 85 degrees Celsius, and storage temperature is -55 to 125 degrees Celsius, with relative humidity up to 95% non-condensing. The package types include BGA-256 to BGA-1156, with body sizes from 15x15 to 45x45 millimeters, and weight ranging from 5 to 20 grams. These specifications are reference ranges and must be verified for the specific model and application with the legal manufacturer or supplier. The array is designed for integration into NPUs used in edge computing, data centers, and other AI inference and training applications. Its architecture allows efficient execution of deep learning workloads, balancing performance and power consumption. The Processing Element Array is a critical component for accelerating neural network computations, enabling real-time processing in various devices.

Working Principle

The Processing Element Array operates by distributing neural network computations across its multiple processing elements in parallel. Input data (activations) and weights are broadcast or streamed to the array, where each processing element performs multiply-accumulate (MAC) operations on its assigned data subset. Results are aggregated through the array's interconnection network, enabling efficient execution of large matrix operations fundamental to neural network inference and training. The array's grid structure allows data to flow between neighboring elements, reducing data movement and improving efficiency. The parallel nature of the array significantly accelerates computation compared to sequential processing, making it suitable for real-time AI applications.

Common Materials

Silicon, Copper interconnects, Dielectric materials

Technical Parameters

Parameter	Typical range	Notes & selection driver
Number of Processing Elements	64–1024 cores	Determines parallel processing capacity.
Array Dimensions (Rows x Columns)	8x8–32x32	Configurable grid layout.
Clock Frequency	500–1500 MHz	Affects throughput and power.
Peak Throughput	2–16 TOPS	INT8 operations per second.
Power Consumption	5–30 W	Depends on workload and frequency.
Supply Voltage	0.8–1.2 V	Core logic voltage.
Operating Temperature	-40–85 °C	Junction temperature range.IEC 60068-2-14
Storage Temperature	-55–125 °C	Non-operating condition.IEC 60068-2-2
Relative Humidity	5–95 % RH	Non-condensing.IEC 60068-2-78
Process Technology	7–16 nm	CMOS node.
Package Type	BGA-256–BGA-1156	Ball grid array.JEDEC MS-028
Weight	5–20 g	Depends on package and heat sink.
Footprint (Package Size)	15x15–45x45 mm	Body size.JEDEC MS-028

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Processing Element Core Part
Performs arithmetic operations (MAC) and local data processing

Material: Silicon transistors
Local Memory Buffer Part
Stores intermediate results and weights for the processing element

Material: SRAM cells
Interconnect Router
Manages data movement between neighboring processing elements

Material: Copper wiring, logic gates
Control Unit
Coordinates operation sequencing and instruction execution within the PE

Material: Logic circuits

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Processing Element Array.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Neural Processing Unit

View system integration details

Manufacturers of Processing Element Array

Manufacturer profiles associated with Processing Element Array.

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Frequently Asked Questions

What is the typical number of processing elements in an array?

The number of processing elements ranges from 64 to 1024, depending on the specific model and application. This value determines the parallel processing capacity of the array.

What are the array dimensions available?

The array can be configured in grid layouts from 8x8 to 32x32 rows and columns. The exact dimensions depend on the product variant and must be confirmed with the manufacturer.

What is the operating temperature range?

The operating temperature range is -40 to 85 degrees Celsius, as per IEC 60068-2-14. This is a reference range; verify the specific model's ratings with the supplier.

What package types are available?

The array is available in BGA-256 to BGA-1156 packages, conforming to JEDEC MS-028. The package size and weight vary accordingly, and these specifications should be confirmed for the actual product.

Data Basis

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Preliminary Technical Classification

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pressure:	Atmospheric (sealed package), no pressure rating required
other spec:	Power consumption: 5-50W typical, Clock frequency: 500MHz-1.5GHz, Data bandwidth: 100-500 GB/s
temperature:	0°C to 85°C (operational), -40°C to 125°C (storage)

Product Specifications

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