Editorial Technical Reference

Rigid-Flex PCB

This page explains how Rigid-Flex PCB is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

Printed circuit board combining rigid laminate sections and flexible polyimide layers in one interconnected structure that folds into compact assemblies.

Representative manufacturing scene; not a photograph of a specific supplier or model.

Product Specifications

Technical details and manufacturing context for Rigid-Flex PCB

Definition
A rigid-flex PCB integrates rigid FR-4 or high-Tg sections with flexible polyimide circuits laminated into a single board, eliminating connectors and cables between sub-boards. The flexible layers run continuously through the rigid zones, letting the finished circuit fold into three-dimensional housings such as cameras, wearables, aerospace modules, and medical probes. Constructions range from one flex layer bonded to two rigid layers up to complex builds beyond twelve layers with controlled impedance, stiffeners, and shielding films, traded off against significantly higher cost than separate boards joined by connectors.
Working Principle
Flexible copper-clad polyimide cores are imaged and etched like standard flex circuits, then selectively bonded with no-flow prepreg to rigid cap layers only where stiffness is required. Plated through-holes and vias interconnect rigid and flex layers, and routing plus laser or die cutting releases the flex windows so the finished board bends along defined zones.
Common Materials
polyimide flexible cores, FR-4 or high-Tg rigid laminate, rolled annealed copper foil, no-flow prepreg adhesive, coverlay film and stiffeners

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Rigid-Flex PCB.

Application Fit & Sizing Matrix

Operational Limits
bend type: flex-to-install or dynamic flexing designs
layer range: 2-16+ layers combining rigid and flex
qualification: IPC-6013 Class 2 or Class 3 builds
impedance control: single-ended 50 ohm and differential 90/100 ohm available
typical applications: cameras, wearables, medical probes, aerospace and defense modules
Media Compatibility
Unsuitable: