Huizhou CEE Technology Inc. specializes in the R&D, production and sales of rigid multi-layer boards (MLB), high-layer count boards (HLC), high-density interconnect printed circuit boards (HDI), flexible printed circuits and flexible…
Huizhou CEE Technology Inc. specializes in the R&D, production and sales of rigid multi-layer boards (MLB), high-layer count boards (HLC), high-density interconnect printed circuit boards (HDI), flexible printed circuits and flexible printed circuit assemblies (FPC & FPCA), and rigid-flex boards (R-F). Its products are widely used in network communications, consumer electronics, computers, automotive electronics, new displays, security and industrial control, medical and health care, as well as emerging application fields represented by artificial intelligence, data centers and cloud computing, the Internet of Things, biometrics, smart wearables, smart homes and drones.
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Published product lines include HDI boards, Flexible circuit boards (FPC), Rigid-flex boards, Multilayer boards, High layer-count boards. See the product information on this page for the available scope.
The published profile lists Huizhou, Guangdong, CN. Confirm the operating address directly with the company and official registration sources.
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