Solder Pot for Wave Soldering Machines | Specifications & Parameters

Product Specifications

Technical details and manufacturing context for Solder Pot

Definition

The solder pot is a critical component of a wave soldering machine that maintains a reservoir of molten solder at a controlled temperature. It serves as the source from which the solder wave is generated to create electrical and mechanical connections between electronic components and printed circuit boards (PCBs). The pot is typically constructed from corrosion-resistant materials such as stainless steel (commonly 316L grade) or titanium for aggressive solder alloys. Its tank capacity ranges from 5 to 50 kg, influencing production throughput and solder volume. Operating temperatures are typically set between 250 and 300°C for lead-free solder, with a temperature control accuracy of ±2°C to ensure consistent joint quality. Heating power varies from 3 to 10 kW, affecting heat-up time and temperature stability. The solder wave height is adjustable from 3 to 12 mm, critical for proper through-hole soldering. Conveyor speed can be set between 0.5 and 2.5 m/min to match soldering requirements. The pot's material grade is specified as 316L per ASTM A240, and it meets electrical safety with insulation resistance of at least 100 MΩ per IEC 60204-1. Power supply is three-phase 380 V AC ±10% (50/60 Hz) per IEC 60038, and ingress protection is rated IP54 per IEC 60529. The unit weighs between 150 and 500 kg, with a typical footprint of 1200×600×800 mm (L×W×H). These parameters serve as reference ranges; actual values must be confirmed with the manufacturer for specific models and applications. The solder pot operates by heating solid solder bars or pre-melted solder to a precise temperature, then using a pump to create the wave that contacts the PCB. Proper maintenance and temperature control are essential to prevent defects such as poor wetting or excessive dross. Always verify model-specific specifications and standards with the legal manufacturer or supplier.

Working Principle

The solder pot is heated by integrated electric heating elements to melt solid solder bars or pre-melted solder, maintaining it in a liquid state at a precise temperature, typically 250–280°C. A pump mechanism draws the molten solder from the pot to create the characteristic wave that contacts the PCB during the soldering process. The temperature is controlled within ±2°C to ensure consistent solder joint quality. The pot's design, including material and capacity, influences heat-up time and temperature stability. The wave height is adjustable to accommodate different PCB thicknesses and component types. The conveyor speed is synchronized with the wave to achieve proper soldering. The system operates within specified electrical and safety parameters, including insulation resistance and ingress protection. Regular monitoring of temperature and solder composition is necessary to maintain performance and prevent defects.

Common Materials

Stainless steel (typically 316L grade), Titanium (for aggressive solder alloys)

Technical Parameters

Parameter	Typical range	Notes & selection driver
Tank Capacity	5–50 kg	Determines production throughput and solder volume.
Operating Temperature	250–300 °C	Typical range for lead-free solder; too low causes poor wetting, too high increases dross.
Temperature Control Accuracy	±2 °C	Ensures consistent solder joint quality.
Heating Power	3–10 kW	Affects heat-up time and temperature stability.
Solder Wave Height	3–12 mm	Critical for proper soldering of through-hole components.
Conveyor Speed	0.5–2.5 m/min	Adjustable to match soldering requirements.
Material Grade	316L	Corrosion-resistant stainless steel for molten solder.ASTM A240
Insulation Resistance	≥100 MΩ	Safety requirement for electrical components.IEC 60204-1
Power Supply	380 ±10% V AC	Three-phase, 50/60 Hz.IEC 60038
Ingress Protection	IP54	Protection against dust and splashing water.IEC 60529
Weight	150–500 kg	Affects installation and floor loading.
Footprint (L×W×H)	1200×600×800 mm	Typical dimensions; verify for your facility.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Pot Body
The pot itself: holds the melt and takes the thermal load of each cycle.
Heating Elements
Provide controlled heat to melt and maintain solder temperature

Material: Stainless steel sheathed with ceramic insulation
Temperature Sensors
Monitor and regulate solder temperature through feedback control

Material: Thermocouples (typically K-type)
Dross Skimmer
Removes oxidized solder (dross) from the surface of the molten solder

Material: Stainless steel
Solder Pump Inlet Part
Channel through which molten solder is drawn to create the wave

Material: Stainless steel or titanium

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Solder Pot.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Wave Soldering Machine

View system integration details

Manufacturers of Solder Pot

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 6 September 2026

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Frequently Asked Questions

What materials are used for solder pots?

Solder pots are typically made from stainless steel (commonly 316L grade) or titanium for aggressive solder alloys. The material must resist corrosion from molten solder and maintain structural integrity at high temperatures.

What is the typical operating temperature range?

The operating temperature is typically between 250 and 300°C for lead-free solder. Too low a temperature can cause poor wetting, while too high increases dross formation. The temperature control accuracy is ±2°C.

How does the solder pot create the wave?

The solder pot uses a pump mechanism to draw molten solder from the reservoir and create a wave that contacts the PCB. The wave height is adjustable from 3 to 12 mm to suit different soldering requirements.

What standards apply to solder pots?

Relevant standards include ASTM A240 for material grade (316L), IEC 60204-1 for insulation resistance (≥100 MΩ), IEC 60038 for power supply (380 V ±10%), and IEC 60529 for ingress protection (IP54). These are verification references; actual compliance must be confirmed with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric to 0.5 bar (for wave formation)
flow rate:	10-100 L/min (wave pump capacity)
temperature:	200-300°C (typical solder melting range)
solder volume:	5-100 L (pot capacity)

Solder Pot

Product Specifications

Industry Taxonomies & Aliases

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards