Thermal chucks that hold and set the temperature of wafers in probe stations and wafer probers · Temperature range, cooling method and coolant, accuracy and resolution, heating and cooling times, electrical isolation and voltage, temperature sensor, surface plating, control interface and wafer size
A thermal chuck is the temperature-controlled stage of a wafer prober or probe station: it holds the wafer by vacuum and sets its temperature so devices can be tested hot, cold or at room temperature. Its range, speed and electrical behaviour decide which tests can run and how long they take. Ask three things first: what temperature range and wafer size the test plan needs, how quickly the chuck must move between test temperatures, and what voltage, leakage and noise limits the measurements impose.
Hot, cold and tri-temperature thermal chucks and their controllers and coolers for wafer probers and analytical probe stations. Probe cards (see probe card), complete wafer probers, test handlers for packaged parts (see automated test handler) and environmental test chambers (see test chamber) are outside this page.
01
ERS electronic's AirCool chuck system uses pressurised air for active cooling below ambient without Peltier elements. Its page lists upper temperature limits from +150 °C up to +300 °C, lower limits of −10 °C for 200 mm and 0 °C for 300 mm, user-supplied air as coolant, display resolution of 0.01 °C, smallest set-point step of 0.1 °C and temperature accuracy of ±0.1 °C. ERS states that the AirCool system brought MTBF values of more than 50,000 hours. [1]
The ERS AC3 page describes a hot/cold system for production and laboratory wafer probers with temperature ranges from −65 to +400 °C: upper limits from +150 °C up to +300 °C with a +400 °C option, lower limits of +35, +20, −40 or −55 °C, air as coolant with a compact chiller, low-noise capability in the fA range, and the same 0.01 °C display resolution, 0.1 °C step and ±0.1 °C accuracy. [2]
ERS notes on both pages that the data are typical values observed during test and may vary with other factors. [1] [2]
Give the supplier the prober or probe station model, wafer size, required temperature range and set points, accuracy and uniformity requirement, coolant available (dry air, chiller), heating and cooling time targets, maximum voltage and leakage or noise limits, surface plating, temperature sensor, control interface and power available.
02
For a 300 mm AirCool system, ERS lists heating from +25 °C to +150 °C in 10 min, to +200 °C in 15 min and to +300 °C in 25 min, and cooling from +150, +200 and +300 °C back to +25 °C in 20, 25 and 30 min. For a 300 mm AC3 system it lists heating from +25 °C to +150, +200 and +300 °C in 20, 28 and 40 min, and cooling from +25 °C to −20, −40 and −55 °C in 15, 35 and 65 min. [1] [2]
Editorial calculation: the AirCool figure for +25 °C to +300 °C averages 11 °C per minute (275 °C in 25 min), while the AC3 figure for +25 °C to −55 °C averages about 1.2 °C per minute (80 °C in 65 min), so cold set points can dominate test time. [1] [2]
Both pages list a maximum voltage between chuck top and ground of 500 V DC with a high-voltage option up to 10 kV, a Pt100 1/3 DIN four-wire temperature sensor, nickel surface plating with gold or non-conductive options, RS232C and Ethernet interfaces, and low-noise DC/PID control. Standard electrical isolation is listed as more than 1 TΩ at +25 °C for AirCool and more than 2.5 TΩ at +25 °C for AC3. [1] [2]
03
MPI's TS150 data sheet lists thermal chuck values that the ERS pages cited above do not give. For its 35 °C to 150 °C chuck it states temperature uniformity of < ±1 °C, stability of ±0.5 °C and surface flatness and base parallelism of < ±15 µm; its 20 °C to 200 °C and 20 °C to 300 °C chucks are listed at ±0.08 °C stability and < ±10 µm flatness. The 20 °C to 300 °C chuck is rated at < ±0.5 °C uniformity at 20 to 200 °C and < ±1.0 °C above 200 °C, with leakage at 10 V of < 15 fA at 25 °C and < 50 fA at 300 °C, and isolation of > 10 GΩ at 300 °C. [3]
The same sheet sets facility needs for the air-cooled chucks: compressed dry air at 6.0 bar (0.6 MPa, 87 psi) with a dew point ≤ 0°C, 100 to 240 VAC at 50 Hz / 60 Hz, and controller ratings of 500 VA and 150 l/min of air for the 35 to 150 °C system, or 700 VA and 200 l/min for the 200 °C and 300 °C systems. MPI marks the data as subject to change. [3]
04
ATT Advanced Temperature Test Systems publishes a general specification table for three thermal chuck series: the air-cooled hot A-Series with low limits of −10 °C, +20 °C or ambient and high limits of +200, +300 or +350 °C; the air-cooled C-Series from −65 °C or −40 °C to +200 or +300 °C; and the liquid-cooled L-Series from −65, −40 or −20 °C to +200 or +300 °C. All three list 0.01 °C resolution, ±0.1 °C accuracy, ±0.1 °C stability and uniformity of ±0.5 °C or ±0.5%. [4]
ATT states that chuck performance may vary between prober types and applications. It lists triax connections as standard on all its chuck systems, with sub-femto options, and offers on-site cold upgrades with −40 °C and −55 °C solutions in 5–7 working days including prober sealing. [4]
Editorial calculation: at +300 °C, ±0.5% is 300 × 0.005 = ±1.5 °C, three times ±0.5 °C, so ask which limit applies at your set points; MPI's data sheet above lists < ±1.0 °C above 200 °C for its 300 °C chuck. [4] [3]
| ATT series | Technology | Planarity, low to +200 °C |
|---|---|---|
| A-Series | Air – hot | ±8 µm |
| C-Series | Air – hot/cold | ±5 µm |
| L-Series | Liquid – hot/cold | ±5 µm |
05
This is a functional reference built from the sources cited; it is not one maker's design.
| Part | Role | Fix in the order |
|---|---|---|
| Chuck top | Hold the wafer and spread heat. [1] [2] | Wafer size; plating; flatness. |
| Heater and air cooling path | Heat and cool the chuck. [1] [2] | Range; ramp times. |
| Chiller or air supply | Provide coolant. [1] [2] | Air quality; chiller size. |
| Temperature sensor | Measure chuck temperature. [1] [2] | Sensor type; calibration. |
| Controller | Hold the set point with low noise. [1] [2] | Control method; interface. |
| Isolation layers | Separate chuck top from ground. [1] [2] | Isolation; max voltage. |
06
A thermal chuck selection needs values for your prober and devices. The table explains each field, gives published values where a reviewed source states them, and says what to obtain from the supplier.
| Field | What it means and published values | Ask the supplier for |
|---|---|---|
| Temperature Range | E.g. −10 to +300 °C; −65 to +400 °C by option. [1] [2] | Range at your wafer size. |
| Temperature Uniformity | Spread across the chuck surface. | Value at your set points. |
| Temperature Stability | E.g. ±0.1 °C accuracy, 0.1 °C step. [1] [2] | Accuracy; stability. |
| Heating Rate | E.g. +25 to +300 °C in 25 or 40 min (300 mm). [1] [2] | Times between your set points. |
| Cooling Rate | E.g. +25 to −55 °C in 65 min (300 mm). [2] | Times between your set points. |
| Wafer Size | E.g. 200 mm, 300 mm. [1] | Size; small-sample holders. |
| Flatness | Surface flatness and base parallelism over temperature. [1] [2] | Value over range. |
| Surface Roughness | Chuck surface finish. | Value. |
| Vacuum Pressure | Wafer hold-down vacuum. | Vacuum zones; level. |
| Electrical Isolation | E.g. > 1 TΩ or > 2.5 TΩ at +25 °C; 500 V DC to ground. [1] [2] | Isolation over temperature; HV option. |
| Power Supply | Mains supply for controller and cooler. | Voltage; phases. |
| Power Consumption | System power draw. | Value. |
| Weight | Chuck and cooler mass. | Value. |
07
Paste it into your enquiry below or into an email to a maker, then replace every bracket.
Prober: [model; chuck interface] Wafer: [size; thickness] Temperature: [range; set points; accuracy; uniformity] Time: [heating and cooling targets] Coolant: [dry air; chiller] Electrical: [max voltage; isolation; noise] Surface: [plating; vacuum zones] Control: [interface]
This company lists temperature chucks for probe stations.
Lists probe station temperature chucks and vacuum wafer chucks for wafer testing, with its probe stations.
Product scope checked 2026-10-11
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Published systems range from −10 °C (200 mm) to +300 °C for an air-cooled chuck, and from −65 °C to +400 °C with options for a tri-temperature system. [1] [2]
One 300 mm system lists +25 °C to +300 °C in 25 min; another lists +25 °C to −55 °C in 65 min. [1] [2]
Both published systems list 500 V DC between chuck top and ground, with a high-voltage option up to 10 kV. [1] [2]
MPI's TS150 data sheet lists < ±0.5 °C at 20 to 200 °C and < ±1.0 °C above 200 °C for its 300 °C chuck, and < ±1 °C for its 35 °C to 150 °C chuck. [3]
ATT's specification table lists planarity of ±8 µm for its air-cooled hot A-Series and ±5 µm for its C- and L-Series. [4]
Sources checked 2026-10-11. Both sources are one maker's product pages for specific thermal chuck systems, cited as examples of the parameters a thermal chuck specification covers, not endorsements.
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