Wafer Prober
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This page explains how Wafer Chuck is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision vacuum or electrostatic holding device that secures semiconductor wafers during testing in wafer probers.
Technical details and manufacturing context for Wafer Chuck
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Wafer Diameter | 100–300 mm | Compatible with standard wafer sizesSEMI M1 |
| Flatness | ≤5 μm | Critical for lithography and probing accuracySEMI M1 |
| Surface Roughness | Ra 0.1–0.4 μm | Affects wafer backside contact and cleanlinessISO 4287 |
| Chuck Flatness Tolerance | ±2 μm | Ensures uniform wafer supportSEMI M1 |
| Operating Temperature | 15–50 °C | Outside this range, chucking force may degrade |
| Maximum Chucking Force | 500–1500 N | Sufficient for high-speed probing |
| Leak Rate | ≤1×10⁻⁶ Pa·m³/s | Ensures vacuum integrityISO 27895 |
| Material | Al 6061-T6 | Lightweight and corrosion-resistantASTM B221 |
| Weight | 2–8 kg | Depends on size and configuration |
| Operating Pressure | 0.4–0.6 MPa | Below 0.4 MPa chucking force is insufficient |
| Electrical Resistance | 10⁶–10⁹ Ω | Prevents electrostatic discharge damageASTM D257 |
| Operating Humidity | 30–70 % RH | High humidity may cause condensationIEC 60068-2-78 |
| Ingress Protection | IP54 | Protects against dust and water splashesIEC 60529 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Wafer Chuck.
This component is essential for the following industrial systems and equipment:
| pressure: | Up to 100 psi (vacuum hold down) |
| other spec: | Wafer flatness: <5 µm TIR, Chuck flatness: <2 µm, Vacuum response time: <1 sec |
| temperature: | -40°C to +150°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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The wafer chuck securely holds semiconductor wafers in place during electrical testing, probing, and inspection in wafer probers, ensuring precise positioning and stability to maintain measurement accuracy.
Wafer chucks typically use vacuum suction or electrostatic force. Vacuum chucks use a pressure differential through small holes, while electrostatic chucks use an electric field to attract the wafer.
The wafer chuck is compatible with standard wafer sizes from 100 to 300 mm, as referenced in SEMI M1. Always verify compatibility with the specific model.
Relevant standards include SEMI M1 for wafer dimensions and flatness, ISO 4287 for surface roughness, ISO 27895 for leak rate, and ASTM D257 for electrical resistance. Verify compliance with the manufacturer.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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