This page explains how Flexible Printed Circuit (FPC) is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A thin circuit built on flexible polyimide film that bends, folds, and rolls, connecting or replacing wiring in compact electronic assemblies.
Technical details and manufacturing context for Flexible Printed Circuit (FPC)
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Base Material | PI | Polyimide film for flexibility and thermal stability |
| Copper Thickness | 18–35 μm | Standard 1/2 oz to 1 oz; affects current capacityIPC-6013 |
| Minimum Line Width/Space | 50–75 μm | Tighter geometries possible with advanced processesIPC-6013 |
| Minimum Bend Radius | 0.5–1.0 mm | Dynamic flex requires larger radiusIPC-2223 |
| Operating Temperature | -40–85 °C | Extended range up to 105°C for some materials |
| Insulation Resistance | ≥100 MΩ | At 100 V DC, after humidity testIPC-6013 |
| Dielectric Withstanding Voltage | 500–1000 V AC | For 1 minute, no breakdownIPC-6013 |
| Impedance Tolerance | ±10% | For controlled impedance designsIPC-6013 |
| Solderability | ≥95 % | Wetting area after agingIEC 60068-2-54 |
| Peel Strength | ≥0.7 N/mm | Copper to base materialIPC-TM-650 |
| Flammability Rating | V-0 | Required for many consumer electronicsUL 94 |
| Humidity Resistance | 85°C/85% RH | 500 hours, no delaminationIEC 60068-2-78 |
| Weight | 0.05–0.2 g/cm² | Depends on layer count and copper weight |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| flex life: | flex-to-install up to millions of dynamic cycles |
| line space: | down to 0.05/0.05 mm |
| termination: | ZIF fingers, hot-bar solder, connectors, ACF bonding |
| construction: | single-sided, double-sided, multilayer, adhesiveless available |
| thickness range: | 0.05-0.4 mm typical |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
9 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
According to the directory data, FPC thickness ranges from roughly 0.05 to 0.4 mm, depending on layer count and construction. Always confirm the exact thickness for your specific model with the manufacturer.
Common standards include IPC-6013 for flex board qualification, IPC-2223 for flex design, and UL 94V-0 for flammability. These are references for procurement and verification; they do not guarantee certification of a specific product.
The directory lists a minimum bend radius of 0.5–1.0 mm for dynamic flex applications. However, a larger radius is recommended for repeated bending to ensure reliability. Verify the required radius for your application with the supplier.
Typical materials include polyimide base film, rolled annealed or electro-deposited copper foil, adhesive or adhesiveless laminate, coverlay film, and FR-4 or polyimide stiffeners. The specific material grades should be confirmed with the manufacturer.
Commonly used trade names and technical identifiers for Flexible Printed Circuit (FPC).
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Compare manufacturer profiles with relevant product and process capability.