Editorial Technical Reference

Embedded Computer

This page explains how Embedded Computer is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A specialized computing system designed to perform dedicated functions within a larger mechanical or electronic system.

Product Specifications

Technical details and manufacturing context for Embedded Computer

Definition
An embedded computer is a microprocessor-based system that is integrated into a larger device or system to control specific functions. Unlike general-purpose computers, embedded systems are optimized for reliability, real-time performance, power efficiency, and compact size. They typically run firmware or specialized operating systems and are found in applications ranging from industrial automation and automotive systems to medical devices and consumer electronics. This directory entry covers a representative embedded computer with an Intel Core i5-7300U processor, clock speeds from 2.6 to 3.5 MHz, memory capacity of 8–32 GB, and storage of 128–512 GB. It operates in temperatures from -20 to 60 °C, consumes 15–25 W, and supports a supply voltage of 9–36 V DC. The unit features 2×LAN, 4×USB 3.0, 2×COM, 1×VGA, and 1×HDMI interfaces. Its ingress protection rating ranges from IP40 to IP65 per IEC 60529, and it withstands vibration per IEC 60068-2-6 (3 axes, 2 g, 5–500 Hz). The device measures 200×150×60 mm, weighs 1.5–3.0 kg, and operates in non-condensing relative humidity of 10–90%. Typical materials include a printed circuit board, semiconductor components, a metal enclosure, and thermal interface materials. This embedded computer is suitable for industrial automation, transportation, and other demanding environments. Always verify model-specific values and standards with the legal manufacturer or supplier before procurement.
Working Principle
Embedded computers operate by executing pre-programmed instructions stored in non-volatile memory. They receive input from sensors or user interfaces, process data using their microprocessor or microcontroller, and generate output signals to control actuators, displays, or other system components. Many embedded systems operate in real-time environments where deterministic response times are critical. In this unit, the Intel Core i5-7300U processor handles data processing, while the system's I/O interfaces connect to external devices. The power supply accepts 9–36 V DC, and the unit is designed to operate reliably within specified temperature and humidity ranges. The enclosure provides protection against dust and water ingress according to the IP rating. The system's firmware manages boot-up, hardware initialization, and application execution. For selection, consider the required processing power, memory, storage, I/O needs, and environmental conditions. Verify that the chosen configuration meets the application's real-time requirements and that all interfaces are compatible.
Common Materials
Printed Circuit Board (PCB), Semiconductor Components, Metal Enclosure, Thermal Interface Materials
Technical Parameters
ParameterTypical rangeNotes & selection driver
Processor TypeRequiredIntel Core i5-7300U N/AArchitecture and model of the central processing unit
Clock SpeedRequired2.6–3.5 MHzOperating frequency of the processor
Memory CapacityRequired8–32 MB/GBAmount of RAM available for program execution
Storage CapacityRequired128–512 GBNon-volatile storage for operating system and applications
Operating TemperatureRequired-20–60 °CTemperature range within which the system operates reliably
Power ConsumptionRequired15–25 WMaximum power draw during normal operation
I/O InterfacesRequired2×LAN, 4×USB 3.0, 2×COM, 1×VGA, 1×HDMI N/AAvailable communication ports and protocols
Ingress Protection RatingIP40–IP65Higher IP for harsh environmentsIEC 60529
Supply Voltage9–36 V DCWide input, supports vehicle power
Weight1.5–3.0 kgDepends on configuration
Dimensions (W×D×H)200×150×60 mmCompact, DIN rail mountable
Relative Humidity10–90 %Non-condensing
Vibration Resistance5–500 Hz3 axes, 2 gIEC 60068-2-6

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Microprocessor/Microcontroller
    Executes program instructions and processes data
    Material: Semiconductor silicon with metal interconnects
  • Memory Module
    Stores program code and data during execution
    Material: Semiconductor memory chips on PCB substrate
  • Storage Device Part
    Provides non-volatile storage for operating system and applications
    Material: Flash memory chips or solid-state storage media
  • Power Supply Unit
    Converts and regulates input power for system components
    Material: Electronic components including transformers, capacitors, and regulators
  • I/O Controller
    Manages communication with external devices and interfaces
    Material: Integrated circuit chips with supporting components
  • Cooling System
    Dissipates heat generated by electronic components
    Material: Aluminum or copper heatsinks with thermal paste
  • Enclosure
    Protects internal components from environmental factors
    Material: Metal or industrial-grade plastic housing

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Embedded Computer.

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 atm (sealed enclosure)
other spec: Vibration: 5-2000 Hz, 5g RMS; Humidity: 5-95% non-condensing
temperature: -40°C to +85°C
Media Compatibility
✓ Industrial control cabinets ✓ Automotive engine compartments ✓ Outdoor weatherproof enclosures
Unsuitable: Direct immersion in conductive fluids or high-corrosion chemical baths
Sizing Data Required
  • Required processing performance (CPU/GPU specs)
  • Available physical space (dimensions constraints)
  • Power budget and thermal dissipation capacity

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal stress failure
Cause: Inadequate heat dissipation leading to overheating of components, causing solder joint fatigue, material degradation, and eventual component failure due to repeated thermal cycling.
Electrostatic discharge (ESD) damage
Cause: Accumulation and sudden discharge of static electricity through sensitive electronic components, resulting in immediate or latent failures in integrated circuits and memory chips.
Maintenance Indicators
  • Intermittent system crashes or unexplained reboots during operation
  • Audible fan failure or unusual high-pitched coil whine from power components
Engineering Tips
  • Implement proper thermal management with regular cleaning of heat sinks and fans, and ensure adequate airflow in enclosures to maintain optimal operating temperatures.
  • Establish ESD protection protocols including grounded workstations, anti-static mats, and proper handling procedures during installation and maintenance activities.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
CE Marking (EU Directive 2014/35/EU Low Voltage Directive) IEC 60068-2 Environmental Testing

Quoted from the published standard.

Manufacturing Precision
  • PCB Dimensional Tolerance: +/-0.2mm
  • Component Placement Accuracy: +/-0.1mm
Quality Inspection
  • Thermal Cycling Test
  • In-Circuit Test (ICT)

Manufacturers of Embedded Computer

12 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Advantech Co., Ltd.
Taiwan, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Fanless Embedded Computers”
View source page ↗ advantech.com · checked 2026-09-02
Amongo Display
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Systems/Box PCs”
View source page ↗ amongo.com.cn · checked 2026-08-22
Anyhertz Drive (Shenzhen) Co., Ltd.
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded systems”
View source page ↗ anyhz.com · checked 2026-09-07
ARBOR Technology
Taiwan, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Jetson Thor AI Embedded Computer”
View source page ↗ arbor-technology.com · checked 2026-09-03
Chengdu Ebyte Electronic Technology Co., Ltd.
Chengdu, Sichuan, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Computers”
View source page ↗ cdebyte.com · checked 2026-09-06
Darveen Technology Ltd.
Taiwan, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Computer”
View source page ↗ darveen.com · checked 2026-09-05
Geniatech
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded system”
View source page ↗ geniatech.com · checked 2026-08-26
Horsent
Chengdu, Sichuan, CN
Also makes: Panel PC, Touch Screen, Touchscreen Display and 4 more
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Computer”
View source page ↗ horsent.com · checked 2026-08-30
IESP Technology Co., Ltd.
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Fanless Embedded Computer”
View source page ↗ iesptech.com · checked 2026-08-27
Logic Technologies
Hong Kong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Systems”
View source page ↗ logictechno.com · checked 2026-09-16
Shenzhen Anxinruo Technology Co., Ltd.
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Systems”
View source page ↗ icsmodules.com · checked 2026-09-13
Shenzhen STHL Technology Co., Ltd.
Shenzhen, Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Embedded Systems”
View source page ↗ sthlpcba.com · checked 2026-08-29
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Frequently Asked Questions

What are the typical applications for this embedded computer?

This embedded computer is designed for industrial automation, automotive systems, medical devices, and consumer electronics. Its wide temperature range, vibration resistance, and multiple I/O interfaces make it suitable for harsh environments such as factory floors, vehicles, and outdoor installations. However, the exact suitability depends on the specific configuration and environmental conditions, so verify with the manufacturer.

What is the operating temperature range?

The operating temperature range is -20 to 60 °C. This allows the system to function in both cold and hot environments, but the actual performance may vary depending on the enclosure and cooling. Always confirm the temperature limits for your specific model and application.

What power supply voltage does it require?

The supply voltage range is 9–36 V DC, which supports a wide input, including vehicle power systems. This flexibility is useful for mobile or automotive applications. Ensure that the power source provides a stable voltage within this range and meets the power consumption of 15–25 W.

What I/O interfaces are available?

The standard I/O interfaces include 2×LAN, 4×USB 3.0, 2×COM, 1×VGA, and 1×HDMI. These allow connection to networks, peripherals, serial devices, and displays. For specific requirements, check the exact configuration with the supplier, as options may vary.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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