Wafer Fabrication Equipment
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This page explains how Gas Delivery System is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision system that delivers process gases to semiconductor fabrication equipment with controlled flow, pressure, and purity.
Technical details and manufacturing context for Gas Delivery System
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Gas flow rate range | 0-100 sccm | 0-100 — Per MFC; multiple MFCs can be manifolded for higher total flow. Per MFC; multiple MFCs can be manifolded for higher total flow. |
| Flow control accuracy | ±1% of set point % | ±1% of set point — For MFCs; repeatability ±0.2% of full scale. For MFCs; repeatability ±0.2% of full scale.SEMI E12 |
| Pressure regulation range | 0-100 psig | 0-100 — Inlet pressure up to 150 psig; outlet set point adjustable. Inlet pressure up to 150 psig; outlet set point adjustable. |
| Pressure control accuracy | ±0.5 psig | ±0.5 — For downstream pressure regulators. For downstream pressure regulators. |
| Particle filtration rating | 0.003 µm | 0.003 — High-efficiency particulate air (HEPA) or ULPA filters; 99.9999999% removal. High-efficiency particulate air (HEPA) or ULPA filters; 99.9999999% removal.SEMI E49 |
| Leak integrity | 1×10^-9 sccm He | 1×10^-9 — Maximum helium leak rate for assembled system. Maximum helium leak rate for assembled system.SEMI E58 |
| Materials of construction | 316L stainless steel, electropolished; PTFE, PFA, Kalrez, Viton seals | 316L stainless steel, electropolished; PTFE, PFA, Kalrez, Viton seals — Wetted parts must be compatible with process gases. Wetted parts must be compatible with process gases.ASTM A270, SEMI F20 |
| Surface finish (internal) | ≤ 0.25 µm Ra | ≤ 0.25 — Electropolished tubing and components. Electropolished tubing and components.SEMI F19 |
| Operating temperature range | 10-50 °C | 10-50 — Ambient; gas heating may be required for certain processes. Ambient; gas heating may be required for certain processes. |
| Maximum operating pressure | 150 psig | 150 — Design pressure for gas panels and cabinets. Design pressure for gas panels and cabinets.ASME B31.3 |
| Connection sizes | 1/4, 3/8, 1/2 inch | 1/4, 3/8, 1/2 — VCR or face seal fittings; tube OD. VCR or face seal fittings; tube OD.SEMI E58 |
| Duty cycle | Continuous | Continuous — Designed for 24/7 operation; service life > 10 years. Designed for 24/7 operation; service life > 10 years. |
| Utilities required | 24 VDC, 0.5-1.0 MPa N2 purge, 0.5 MPa instrument air | 24 VDC, 0.5-1.0 MPa N2 purge, 0.5 MPa instrument air — Electrical and pneumatic supplies. Electrical and pneumatic supplies. |
| Ambient temperature | 10-50 °C | 10-50 °C — Outside this window: Condensation or seal degradation below 10°C; elastomer softening above 50°C. Outside this window: Condensation or seal degradation below 10°C; elastomer softening above 50°C. |
| Inlet pressure | 20-150 psig | 20-150 psig — Outside this window: Below 20 psig may cause MFC starvation; above 150 psig risks component damage. Outside this window: Below 20 psig may cause MFC starvation; above 150 psig risks component damage. |
| Gas purity | ≥ 99.999% (5.0 grade) | ≥ 99.999% (5.0 grade) — Outside this window: Lower purity can contaminate process and damage MFCs. Outside this window: Lower purity can contaminate process and damage MFCs. |
| Flow rate | 0-100 sccm per MFC | 0-100 sccm per MFC — Outside this window: Exceeding range causes inaccurate flow; below 2% of full scale may be unstable. Outside this window: Exceeding range causes inaccurate flow; below 2% of full scale may be unstable. |
| Humidity | 0-90% RH non-condensing | 0-90% RH non-condensing — Outside this window: Condensation can cause corrosion and electrical shorts. Outside this window: Condensation can cause corrosion and electrical shorts. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
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The flow rate range is typically 0-100 sccm per mass flow controller (MFC). Multiple MFCs can be manifolded to achieve higher total flow rates. The exact range depends on the specific model and configuration.
Relevant standards include SEMI E12 (flow control accuracy), SEMI E49 (particle filtration), SEMI E58 (leak integrity and connection sizes), SEMI F19 (surface finish), SEMI F20 (materials), ASTM A270 (tubing), and ASME B31.3 (pressure piping). These standards serve as procurement references; compliance must be verified with the manufacturer.
Recommended conditions include an ambient temperature of 10-50 °C, inlet pressure of 20-150 psig, gas purity of at least 99.999% (5.0 grade), and humidity of 0-90% RH non-condensing. Operating outside these ranges may cause issues such as MFC starvation, component damage, or contamination.
Leak integrity is specified as a maximum helium leak rate of 1×10^-9 sccm for the assembled system, per SEMI E58. This is achieved through the use of high-quality seals, electropolished tubing, and proper assembly techniques. Verification should be performed by the manufacturer or supplier.
This component is essential for the following industrial systems and equipment:
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