Editorial Technical Reference

Interface Module

This page explains how Interface Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A hardware component that provides the physical and logical connection between a line scan camera's sensor/processing unit and external systems or devices.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Interface Module

Definition
The Interface Module is a critical sub-assembly within a Line Scan Camera system. It serves as the bridge for data transmission, power delivery, and control signal exchange. Its primary role is to convert the high-speed digital image data stream from the camera's internal processing into standardized electrical or optical signals compatible with industrial communication protocols (e.g., Camera Link, CoaXPress, GigE Vision). It also manages the reception of external triggers, configuration commands, and provides regulated power to the camera's core components. The module receives parallel digital pixel data and synchronization signals from the camera's sensor and image processor. It then serializes this data, encodes it according to a specific communication protocol standard, and drives it through physical connectors (e.g., MDR, optical ports). Conversely, it receives incoming control signals, deserializes them, and passes decoded commands to the camera's control unit. It typically incorporates signal conditioning, impedance matching, and sometimes galvanic isolation to ensure data integrity and system reliability in industrial environments. The module is designed for industrial use, with a wide input voltage range of 12–24 V DC, power consumption of 3–5 W, and an operating temperature range of -40 to 85 °C. It supports GigE Vision as a data interface standard, and its connector type is M12 per IEC 61076-2-101. The module's dimensions are 50×40×20 mm, and it weighs 150–250 g. It offers signal latency of 1–5 ms, shock resistance of 50 g, and vibration resistance from 10 to 500 Hz. The ingress protection rating is IP54–IP65, and it operates in non-condensing humidity of 10–90% RH. Storage temperature range is -40 to 105 °C. These values are typical for industrial cameras and should be verified with the manufacturer for specific models. The module is constructed with FR-4 PCB, copper, integrated circuits (SerDes, PHY), and connectors (e.g., MDR, SFP). It complies with relevant IEC standards for environmental and mechanical robustness, but certification must be confirmed by the supplier.
Working Principle
The module receives parallel digital pixel data and synchronization signals from the camera's sensor and image processor. It then serializes this data, encodes it according to a specific communication protocol standard, and drives it through physical connectors (e.g., MDR, optical ports). Conversely, it receives incoming control signals, deserializes them, and passes decoded commands to the camera's control unit. It typically incorporates signal conditioning, impedance matching, and sometimes galvanic isolation to ensure data integrity and system reliability in industrial environments.
Common Materials
FR-4 PCB, Copper, Integrated Circuits (SerDes, PHY), Connectors (e.g., MDR, SFP)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Data InterfaceGigE VisionStandard for industrial camerasIEC 61158
Power Supply Voltage12–24 V DCWide input range for industrial use
Power Consumption3–5 WDepends on camera model
Operating Temperature-40–85 °CExtended temperature rangeIEC 60068-2-1
Storage Temperature-40–105 °CNon-operating conditionIEC 60068-2-2
Humidity (Non-condensing)10–90 % RHRelative humidity rangeIEC 60068-2-78
Ingress Protection RatingIP54–IP65Dust and water resistanceIEC 60529
Connector TypeM12Industrial standardIEC 61076-2-101
Weight150–250 gLightweight design
Dimensions (L×W×H)50×40×20 mmCompact footprint
Signal Latency1–5 msLow latency for real-time
Shock Resistance50 gOperational shockIEC 60068-2-27
Vibration Resistance10–500 HzSinusoidal vibrationIEC 60068-2-6

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Protocol PHY Chip
    Handles the physical layer encoding, serialization/deserialization (SerDes), and signal driving for the specific interface standard.
    Material: Silicon (Integrated Circuit)
  • Connector Assembly
    Provides the robust mechanical and electrical point of connection for cables to external frame grabbers or controllers.
    Material: Metal (e.g., brass, steel) and Plastic
  • Power Regulation Circuit
    Conditions the incoming external power to provide stable, clean voltage levels required by the camera's internal electronics.
    Material: FR-4 PCB, Copper, Passive Components (inductors, capacitors)
  • Signal Conditioning and Impedance Matching
    Shapes and terminates the high-speed lines so data survives the cable run.
  • Galvanic Isolation Optional
    Breaks the ground path between camera and host where the installation needs it.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 2 bar
other spec: Max data rate: 10 Gbps, Power supply: 12-24 VDC, Humidity: 10-90% non-condensing
temperature: -40°C to +85°C (operating), -40°C to +105°C (storage)
Media Compatibility
✓ Industrial Ethernet networks (Profinet, EtherNet/IP) ✓ PLC control systems ✓ Machine vision processing units
Unsuitable: High-vibration environments without additional mounting/securing
Sizing Data Required
  • Camera sensor resolution (pixels per line)
  • Required data transfer rate (frames per second)
  • Communication protocol compatibility (e.g., GigE Vision, Camera Link)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Corrosion and electrical contact degradation
Cause: Exposure to moisture, chemicals, or harsh environments leading to oxidation, pitting, or contamination of electrical contacts, resulting in signal loss, intermittent connections, or complete failure.
Mechanical wear and connector damage
Cause: Repeated mating/unmating cycles, improper handling, or vibration causing bent pins, worn contacts, cracked housings, or loose connections, leading to poor electrical continuity or physical failure.
Maintenance Indicators
  • Intermittent signal loss or erratic communication, often accompanied by flickering status indicators or inconsistent data transmission.
  • Visible corrosion, discoloration, or physical damage on connectors, such as bent pins, cracked housings, or loose mounting hardware.
Engineering Tips
  • Implement environmental protection measures, such as using sealed or IP-rated enclosures, applying conformal coatings to PCBs, and ensuring proper gasketing to prevent moisture and contaminant ingress.
  • Establish proper handling and installation procedures, including using torque-limiting tools for connectors, avoiding over-mating cycles, and performing regular inspections for alignment and wear.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 61000-6-2 Electromagnetic Compatibility EN 60529 Degrees of Protection (IP Code)

Quoted from the published standard.

Manufacturing Precision
  • Connector Alignment: +/-0.05mm
  • Surface Finish: Ra 1.6μm max
Quality Inspection
  • Electrical Continuity Test
  • Environmental Sealing Test (IP Rating Verification)

Manufacturers of Interface Module

2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

DEGSON
Zhejiang, CN
Listed on the company's own website · profile compiled by CNFX from public sources
HONGFA
Xiamen, Fujian, CN
Listed on the company's own website · profile compiled by CNFX from public sources

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

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Frequently Asked Questions

What is the primary function of an Interface Module in a line scan camera?

The Interface Module acts as a bridge between the camera's internal processing and external systems. It converts high-speed digital image data into standardized signals (e.g., GigE Vision) for transmission, manages control signals, and provides regulated power to the camera's core components.

Which communication protocols does the Interface Module support?

The module supports industrial protocols such as Camera Link, CoaXPress, and GigE Vision. The specific protocol depends on the camera model and configuration; verify with the manufacturer.

What are the typical electrical specifications for this module?

Typical specifications include a power supply voltage of 12–24 V DC, power consumption of 3–5 W, and signal latency of 1–5 ms. These values are for reference and must be confirmed for the specific model.

What environmental conditions can the Interface Module withstand?

The module operates in temperatures from -40 to 85 °C, storage from -40 to 105 °C, and humidity of 10–90% RH non-condensing. It has an ingress protection rating of IP54–IP65, shock resistance of 50 g, and vibration resistance of 10–500 Hz.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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