Wave Soldering Machine
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This page explains how Preheat Zone is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
The section of a wave soldering machine that gradually heats printed circuit boards (PCBs) to a controlled temperature before they enter the solder wave.
Technical details and manufacturing context for Preheat Zone
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Preheat Zone Length | 1800–3600 mm | Determines throughput and heating capacity |
| Preheat Temperature Range | 100–200 °C | Typical range for PCB preheating |
| Temperature Control Accuracy | ±2 °C | Ensures uniform heating across PCB |
| Heating Power | 12–36 kW | Affects ramp-up speed and throughput |
| Conveyor Speed | 0.5–2.0 m/min | Adjustable to match soldering process |
| Heating Zone Count | 3–6 zones | More zones allow finer temperature profiling |
| Temperature Uniformity | ±5 °C | Across PCB width and length |
| Power Supply | 380 ±10% V AC | Three-phase, 50/60 Hz |
| Operating Temperature Range | 5–40 °C | Ambient conditions for reliable operation |
| Relative Humidity | 20–80 % RH | Non-condensing |
| Ingress Protection Rating | IP54–IP65 | Protection against dust and water jetsIEC 60529 |
| Machine Weight | 1500–3000 kg | Depends on length and configuration |
| Footprint (L×W×H) | 4000×1500×1800 mm | Typical dimensions for standard model |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Preheat Zone.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric to 0.5 bar gauge (for forced convection systems) |
| other spec: | Heating rate: 1-5°C/sec (adjustable), Uniformity: ±5°C across PCB |
| temperature: | Ambient to 250°C (typical), up to 300°C (max) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Preheat Zone.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The Preheat Zone gradually heats the PCB assembly before it enters the solder wave. This activates the flux, evaporates volatile solvents, reduces thermal shock, and minimizes the temperature difference between the board and molten solder, ensuring reliable solder joint formation.
The typical preheat temperature range is 100–200 °C, with a temperature control accuracy of ±2 °C and uniformity of ±5 °C across the board. These values are reference ranges and must be confirmed for the specific model and application.
The zone uses thermocouples and a feedback control system to monitor and regulate temperature. Multiple heating zones (3–6) allow fine profiling, and the conveyor speed and heating power are adjustable to achieve the desired thermal profile.
Signs of malfunction include uneven heating (temperature uniformity exceeding ±5 °C), failure to reach set temperatures, increased cycle time, or visible damage to heating elements. Regular calibration and inspection of thermocouples and heaters are recommended.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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