Singulated-die test handler before semiconductor packaging
Bare-die handling and test interface
A singulated-die test handler transfers separated semiconductor dies into an electrical test interface before final packaging, then unloads them according to the test disposition. Carrier format, die contact and thermal control must be selected with the tester and die technology.
Test handling equipment for singulated bare dies or partially assembled dies before final semiconductor packaging, including die-level thermal/contact interfaces and result-based unloading. Packaged-device final-test handlers are covered on 8663; intact-wafer probers and analytical probe stations on 8635; standalone test contactors on 8753. The electrical tester and die-bonding machines are separate equipment.
CNFX editorial research · Sources checked October 18, 2026 · 4 sources
Specify the incoming die carrier and the tester connection together
Advantest describes HA1200 as testing singulated or partially assembled dies in conjunction with a tester and active thermal control. Its current product page calls it a die-level prober; the launch announcement calls it a die-level handler. Both refer to testing before final assembly, rather than moving finished packages through a final-test handler. [1][2]
NEXUSTEST’s PB6600 offering is a separate example for bare SiC power dies. It lists frame-ring, tape-and-reel and tray input methods, modular loading/test/unloading stations and hard docking to the test system. Identify the incoming format, die orientation and contacting arrangement instead of transferring a packaged-IC change kit to a bare-die order. [3]
For the PB6600 configuration, NEXUSTEST also describes controlled probe marks and an airtight socket with nitrogen supply and pressure monitoring for arcing protection. Define those contact and environmental provisions with the intended electrical test. They are features of the identified offering, not evidence that every die handler includes a sealed test socket. [3]
02
Keep coverage claims and throughput attached to the actual test flow
The HA1200 launch announcement states “100% test coverage”; the current English HA1200 product page instead says “FT-like test coverage”. These are different published descriptions. Ask Advantest to define the covered tests, die state and limits for the proposed configuration; neither wording establishes guaranteed assembly yield or freedom from defects. [2][1]
NEXUSTEST lists up to 1,200 UPH for PB6600 at a 1 s test time. Preserve both the upper-limit wording and the test-time condition. A changed test sequence, thermal requirement or incoming carrier needs a separately agreed throughput basis; the quoted point is not an unconditional die-handling rate. [3]
TI distinguishes its tested-die offering from known-good-die supply, describing the latter as tested to the quality and reliability standards of its packaged equivalents. A handler model name does not assign that status to a die. Retain the approved test flow and acceptance criteria with the output disposition. [4]
PB6600 lists result-based unloading and configurable bin-sorting methods. Agree which result sends a die to an accepted, rejected or held output and how the test record accompanies that disposition. Before production release, demonstrate the selected carrier-to-contact-to-output sequence with representative dies. [3]
03
Define the die state and the complete contact-to-output flow
Paste it into your enquiry below or into an email to a maker, then replace every bracket.
Device: [singulated bare die or partial assembly; die drawing; electrode/contact orientation]
Input: [frame ring; tape/reel; tray; handling restrictions]
Tester interface: [tester; hard docking; contact arrangement; test flow]
Test environment: [thermal requirement; sealed socket/nitrogen if required]
Disposition: [accept/reject/hold criteria; output carrier; result records]
Throughput: [test duration; temperature sequence; actual input/output configuration]
Acceptance: [representative-die trial; probe marks; handling damage; bin routing]
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Compiled and source-reviewed by the CNFX editorial team.
Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review
· Page last updated 18 October 2026
Buyer questions
Does the HA1200 coverage claim have identical wording in the two sources?
The launch announcement states “100% test coverage”, while the current English product page says “FT-like test coverage”. Confirm the proposed configuration’s test items and coverage definition with Advantest. [2][1]
Is the PB6600 quoted throughput independent of test duration?
NEXUSTEST lists up to 1,200 UPH at a 1 s test time. Agree the throughput basis for the actual test sequence, carriers and thermal requirements. [3]
Sources and evidence scope
Sources checked 2026-10-18. The sources distinguish die handling before final assembly, a named SiC die-handler configuration, and the qualification meaning of known-good-die supply. Tester performance, package-test options and assembly yield are not inferred from the handler name.
