This page explains how Vision Processing Unit is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Specialized hardware component that processes image data from cameras in Automated Solder Paste Inspection (SPI) systems
Technical details and manufacturing context for Vision Processing Unit
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Processing Resolution | 5–25 μm/pixel | Determines minimum detectable solder paste defect size |
| Frame Rate | 30–120 fps | Higher rates for faster production lines |
| Processing Latency | 10–50 ms | Critical for real-time inspection |
| Input Interface | GigE, USB3.0, Camera Link | Compatibility with camera types |
| Output Interface | GigE, USB3.0, HDMI | For display and data transfer |
| Power Consumption | 15–45 W | Affects cooling and energy costs |
| Supply Voltage | 12–24 V DC | Must match system power supply |
| Operating Temperature | 0–50 °C | Outside range may cause thermal throttling |
| Storage Temperature | -20–70 °C | For non-operational periods |
| Humidity | 10–90 % RH | Non-condensing; condensation may cause short circuits |
| Ingress Protection | IP40–IP65 | Higher IP for dusty or wet environmentsIEC 60529 |
| Weight | 0.5–2.5 kg | Affects mounting and vibration |
| Dimensions (W x H x D) | 100–200 x 50–100 x 150–300 mm | Space constraints in SPI machines |
| MTBF | 50000–100000 h | Reliability for continuous operation |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | N/A (electronic component, not fluid handling) |
| other spec: | Humidity: 10% to 90% non-condensing, Power: 5-12V DC, 5W max |
| temperature: | 0°C to +50°C (operating), -20°C to +70°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Vision Processing Unit.
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The VPU processes image data from cameras to analyze solder paste deposits on PCBs, performing measurements and defect detection in real-time. It outputs inspection results to the system's control software for pass/fail decisions and reporting.
Typical input interfaces include GigE, USB3.0, and Camera Link. Output interfaces include GigE, USB3.0, and HDMI for display and data transfer. Compatibility with specific camera types must be verified with the manufacturer.
Processing resolution, ranging from 5 to 25 μm/pixel, determines the minimum detectable solder paste defect size. Higher resolution allows detection of smaller defects but may impact processing speed. The appropriate resolution depends on the application's requirements.
The VPU operates in temperatures from 0 to 50 °C and can be stored from -20 to 70 °C. Humidity should be 10–90% RH non-condensing. Ingress protection is IP40–IP65 per IEC 60529. Always verify these values for the specific model.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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