Wafer Fabrication Equipment
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This page explains how Wafer Handling Robot is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Automated robotic system for precise handling and transportation of semiconductor wafers within fabrication facilities
Technical details and manufacturing context for Wafer Handling Robot
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Payload Capacity | 2–10 kg | Includes end effector and wafer cassette weight |
| Wafer Size | 150–300 mm | Supports 6, 8, and 12 inch wafersSEMI M1 |
| Positioning Repeatability | ±0.02–±0.05 mm | Critical for wafer alignment in lithographyISO 9283 |
| Maximum Reach | 600–1200 mm | Determines equipment footprint and accessibility |
| Cycle Time | 2–5 s | Per wafer transfer, affects throughput |
| Operating Temperature | 15–35 °C | Cleanroom environment typical |
| Cleanliness Class | ISO 1–ISO 4 | Particle emission control for wafer integrityISO 14644-1 |
| Operating Humidity | 20–60 % RH | Non-condensing |
| Power Supply | 200–240 V AC | Single phase, 50/60 HzIEC 60038 |
| Power Consumption | 0.5–2.0 kW | Depends on motion frequency and payload |
| Ingress Protection | IP54–IP65 | Higher rating for harsh environmentsIEC 60529 |
| Weight | 150–500 kg | Including controller and cables |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Wafer Handling Robot.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric (cleanroom environment) |
| other spec: | Particle count: Class 1-10 ISO cleanroom, Vibration: <0.5 μm RMS, Wafer size: 150-450 mm diameter |
| temperature: | 15-30°C (cleanroom ambient) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Wafer Handling Robot.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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According to the reference data, the robot supports wafer sizes of 150–300 mm, which corresponds to 6, 8, and 12 inch wafers, as per SEMI M1. However, the actual supported sizes may vary by model, so it is essential to confirm with the manufacturer.
The positioning repeatability is listed as ±0.02–±0.05 mm, based on ISO 9283. This indicates the robot's ability to return to a programmed position, which is critical for wafer alignment in processes like lithography. Verify the exact value for the specific model.
The robot is designed for cleanroom environments and is rated for ISO Class 1 to ISO Class 4 cleanliness, per ISO 14644-1. This ensures low particle emission, but the actual class achieved depends on the model and installation conditions.
The power supply is 200–240 V AC, single phase, 50/60 Hz, per IEC 60038. Power consumption ranges from 0.5 to 2.0 kW, depending on motion frequency and payload. Always check the nameplate and confirm with the supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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