LED Array/Module

Product Specifications

Technical details and manufacturing context for LED array/module

Definition

An LED array/module is a fundamental component within LED lighting systems that integrates multiple individual LED chips onto a single substrate or circuit board. It functions as the primary light source, with the arrangement and configuration of LEDs determining the overall light output pattern, intensity, and color characteristics. These modules are designed for easy integration into larger lighting fixtures and systems, providing standardized electrical and mechanical interfaces.

Typical materials include semiconductor chips (e.g., GaN, GaAs), ceramic or metal-core PCB substrates, phosphor coatings for white LEDs, encapsulation epoxy or silicone, and copper traces. The substrate material is often aluminum for thermal performance. Modules are available in a range of rated powers (10–200 W), luminous flux (1000–20000 lm), color temperatures (2700–6500 K), and color rendering indices (80–95 Ra). Forward voltage typically ranges from 9–36 V DC, forward current from 350–1400 mA, and efficacy from 100–200 lm/W. Operating temperature is -40 to 85 °C, storage temperature -40 to 100 °C, and ingress protection ratings range from IP54 to IP65. Thermal resistance is typically 0.5–2.0 K/W, dimensions from 50×50 to 300×300 mm, and weight from 50–500 g.

These modules are used in various lighting applications, including general illumination, commercial lighting, and specialty fixtures. When selecting an LED array/module, verify model-specific parameters such as electrical ratings, optical performance, thermal characteristics, and mechanical dimensions with the manufacturer or supplier. Standards like IES LM-79, IES TM-30, and IEC 60529 serve as references for testing and classification, but do not imply certification of a specific product. Always confirm compliance and suitability for your application with the legal manufacturer.

Working Principle

LED arrays/modules operate by converting electrical energy into light through electroluminescence. When forward voltage is applied to the semiconductor material within each LED chip, electrons recombine with electron holes, releasing energy in the form of photons. The array/module configuration allows for controlled current distribution across multiple LEDs, enabling uniform illumination, color mixing, and thermal management through the substrate design. The substrate, often metal-core, aids in heat dissipation, while phosphor coatings may convert blue light to white. The arrangement of chips determines the light pattern and intensity.

Common Materials

Semiconductor chips (GaN, GaAs, etc.), Ceramic or metal-core PCB substrate, Phosphor coatings (for white LEDs), Encapsulation epoxy/silicone, Copper traces

Technical Parameters

Parameter	Typical range	Notes & selection driver
Rated Power	10–200 W	Determines light output and heat generation.
Luminous Flux	1000–20000 lm	Total visible light output.IES LM-79
Color Temperature	2700–6500 K	Warm to cool white options.
Color Rendering Index	80–95 Ra	Higher for accurate color rendering.IES TM-30
Forward Voltage	9–36 V DC	Match with driver output.
Forward Current	350–1400 mA	Affects brightness and lifespan.
Efficacy	100–200 lm/W	Higher is more energy efficient.
Operating Temperature	-40–85 °C	Exceeding range may reduce lifespan.
Storage Temperature	-40–100 °C	Safe storage conditions.
Ingress Protection	IP54–IP65	Dust and water resistance.IEC 60529
Thermal Resistance	0.5–2.0 K/W	Lower is better for heat dissipation.
Substrate Material	Al	Aluminum for thermal performance.
Dimensions	50×50–300×300 mm	Footprint for integration.
Weight	50–500 g	Affects mounting and handling.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

LED chips Part
Individual light-emitting semiconductor devices that produce photons when electrically excited

Material: Gallium nitride (GaN), Gallium arsenide (GaAs)
Substrate/PCB Part
Provides mechanical support, electrical connections, and thermal dissipation for the LED chips

Material: Aluminum, ceramic, or FR4 circuit board
Encapsulation Part
Protects LED chips from environmental factors and provides optical control of light output

Material: Epoxy resin or silicone
Phosphor layer Part
Converts blue or UV light from LED chips to white light through wavelength conversion

Material: YAG:Ce phosphor or other phosphor compounds
Electrical contacts Part
Provide connection points for power input and control signals to the module

Material: Copper with gold or tin plating

Applied To / Applications

This component is essential for the following industrial systems and equipment:

LED Lighting System

View system integration details

Manufacturers of LED array/module

Manufacturer profiles associated with LED array/module.

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Frequently Asked Questions

What is the typical power range for LED arrays/modules?

According to directory reference data, rated power typically ranges from 10 to 200 watts. However, actual values depend on the specific model and application. Always verify with the manufacturer's datasheet.

How do I choose the right color temperature?

Color temperature options typically range from 2700 K (warm white) to 6500 K (cool white). The choice depends on the lighting application and desired ambiance. Confirm the exact available options with the supplier.

What does the ingress protection (IP) rating indicate?

The IP rating indicates the level of protection against dust and water. For LED arrays/modules, typical ratings are IP54 to IP65. Higher numbers mean better protection. Verify the rating for your specific module.

Are these modules compliant with lighting standards?

Standards such as IES LM-79, IES TM-30, and IEC 60529 are referenced for testing and classification. However, compliance must be confirmed with the legal manufacturer or supplier for each specific product.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric (not pressure-rated)
other spec:	Max forward current: 350-1000mA per LED (depends on chip), junction temperature: ≤125°C, humidity: 5-95% RH non-condensing
temperature:	-40°C to +85°C (operating), -40°C to +100°C (storage)

Product Specifications

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Application Fit & Sizing Matrix

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